Abstract: A cell of a content-addressable memory (CAM) has a first switch, a second switch and a storage unit. A first end of the first switch and a first end of the second switch are coupled to a matchline. The first switch is controlled by a first search signal, and the second switch is controlled by a second search signal. The second search signal is complementary to the first search signal. The storage unit has a first inverter and a second inverter. The first inverter has a first latch node coupled to a second end of the first switch. The second inverter is cross-coupled to the first inverter and has a second latch node coupled to a second end of the second switch.

Abstract: An SRAM cell includes two inverters and three transistors. The first inverter includes a first end coupled to a first storage node and a second end coupled to a second storage node. The second inverter includes a first end coupled to the second storage node and a second end coupled to the first storage node. The first transistor includes a first end coupled to the first storage node, a second end and a control end. The second transistor includes a first end coupled to the second end of the first transistor, a second end coupled to a first bit line, and a control end. The third transistor includes a first end coupled between the second end of the first transistor and the first end of the second transistor, a second end, and a control end coupled to the first storage node.

Abstract: A cell of a content-addressable memory (CAM) has a first switch, a second switch and a storage unit. A first end of the first switch and a first end of the second switch are coupled to a matchline. The first switch is controlled by a first search signal, and the second switch is controlled by a second search signal. The second search signal is complementary to the first search signal. The storage unit has a first inverter and a second inverter. The first inverter has a first latch node coupled to a second end of the first switch. The second inverter is cross-coupled to the first inverter and has a second latch node coupled to a second end of the second switch.

Abstract: A method for controlling voltage of a doped well in a substrate is provided. The substrate and the doped well are in different conductive type. The method includes applying a substrate voltage to the substrate while a well power for applying a well voltage to the doped well is turned off. The method also includes detecting a voltage level of one of the doped well and the substrate to judge whether or not a voltage target is reached. The well power is turned on to apply the well voltage to the doped well when the voltage level as detected reaches to the voltage target.

Abstract: The present invention provides a semiconductor memory circuit, the semiconductor memory circuit includes a static random access memory (SRAM), having a first storage node and a second storage node, a dynamic oxide semiconductor random access memory (DOSRAM), electrically connected to the SRAM, wherein the DOSRAM includes a first oxide semiconductor field effect transistor (OSFET) and a capacitor, wherein a source of the first OSFET is electrically connected to the first storage node, and a drain of the first OSFET is electrically connected to the capacitor, and a second transistor and a third oxide semiconductor field effect transistor (OSFET), wherein a drain of the second transistor is electrically connected to the second storage node, a source of the third OSFET is electrically connected to the capacitor, and a drain of the third OSFET is electrically connected to a gate of the third transistor.

Abstract: The present invention provides a semiconductor memory circuit, the semiconductor memory circuit includes a static random access memory (SRAM), having a first storage node and a second storage node, a dynamic oxide semiconductor random access memory (DOSRAM), electrically connected to the SRAM, wherein the DOSRAM includes a first oxide semiconductor field effect transistor (OSFET) and a capacitor, wherein a source of the first OSFET is electrically connected to the first storage node, and a drain of the first OSFET is electrically connected to the capacitor, and a second transistor and a third oxide semiconductor field effect transistor (OSFET), wherein a drain of the second transistor is electrically connected to the second storage node, a source of the third OSFET is electrically connected to the capacitor, and a drain of the third OSFET is electrically connected to a gate of the third transistor.

Abstract: An array of dynamic random access memory cells includes a first set of memory cell pairs in a first row, a second set of memory cells in a second row, and a first set of bit line contacts in the first row. The second set of memory cell pairs are disposed adjacent to the first set of memory cell pairs, and each two of the memory cell pairs in the second row include a common S/D region. Each of the first set of bit line contacts is electrically coupled to each of the common S/D regions of the memory cell pairs in the second row respectively.

Abstract: A memory system includes a memory device, a switch device, and a built-in self-test circuit. The memory device is for storing data and toggling a notification signal whenever a read operation or a write operation is completed. The switch device has a first input terminal for receiving an external clock signal, a second input terminal coupled to the memory device for receiving the notification signal, a select terminal for receiving a selection signal, and an output terminal for outputting a memory clock signal to the memory device. The memory clock signal is one of the external clock signal and the notification signal. The built-in self-test circuit is for outputting a control signal required by the memory device to perform the read operation or the write operation and check whether the memory device functions normally.

Abstract: A method for controlling voltage of a doped well in a substrate is provided. The substrate and the doped well are in different conductive type. The method includes applying a substrate voltage to the substrate while a well power for applying a well voltage to the doped well is turned off. The method also includes detecting a voltage level of one of the doped well and the substrate to judge whether or not a voltage target is reached. The well power is turned on to apply the well voltage to the doped well when the voltage level as detected reaches to the voltage target.

Abstract: A memory system includes a memory device, a switch device, and a built-in self-test circuit. The memory device is for storing data and toggling a notification signal whenever a read operation or a write operation is completed. The switch device has a first input terminal for receiving an external clock signal, a second input terminal coupled to the memory device for receiving the notification signal, a select terminal for receiving a selection signal, and an output terminal for outputting a memory clock signal to the memory device. The memory clock signal is one of the external clock signal and the notification signal. The built-in self-test circuit is for outputting a control signal required by the memory device to perform the read operation or the write operation and check whether the memory device functions normally.

Abstract: A memory cell array includes a bit line, a complementary bit line, a first operation voltage supply circuit, a second operation voltage supply circuit, a first memory cell and a second memory cell. The first operation voltage supply circuit is electrically coupled to the bit line and the complementary bit line and used for supplying a first operation voltage. The second operation voltage supply circuit is electrically coupled to the bit line and the complementary bit line and used for supplying a second operation voltage. The first memory cell is electrically coupled to the bit line and the complementary bit line and used for receiving the first operation voltage. The second memory cell is electrically coupled to the bit line and the complementary bit line and used for receiving the second operation voltage. The first and second memory cells are located in a same column in the memory cell array.

Abstract: A memory device includes a memory array, an array gap, a voltage provider, and a voltage divider. The voltage provider is disposed in the array gap and coupled to a column of memory cells of the memory array for providing a first voltage to the column of memory cells when a memory cell of the column is selected at a write cycle. The voltage provider is coupled to the voltage provider and the column of memory cells for providing a second voltage lower than the first voltage to the column of memory cells when the memory of the column is half selected at the write cycle.

Abstract: A memory array includes a plurality of columns of memory cells and each column of memory cells of the memory array is coupled to a local voltage source, a bit line, and a bit line bar. Provide a working voltage to pre-charge the bit line and the bit line bar of the column of memory cells when a memory cell of the column of memory cells is selected to be read, and meanwhile use local voltage sources coupled to remaining columns of memory cells of the memory array to provide high voltages lower than the working voltage to pre-charge bit lines and bit line bars of the remaining columns of memory cells.

Abstract: A memory cell array includes a bit line, a complementary bit line, a first operation voltage supply circuit, a second operation voltage supply circuit, a first memory cell and a second memory cell. The first operation voltage supply circuit is electrically coupled to the bit line and the complementary bit line and used for supplying a first operation voltage. The second operation voltage supply circuit is electrically coupled to the bit line and the complementary bit line and used for supplying a second operation voltage. The first memory cell is electrically coupled to the bit line and the complementary bit line and used for receiving the first operation voltage. The second memory cell is electrically coupled to the bit line and the complementary bit line and used for receiving the second operation voltage. The first and second memory cells are located in a same column in the memory cell array.

Abstract: A memory device includes a memory array, an array gap, a voltage provider, and a voltage divider. The voltage provider is disposed in the array gap and coupled to a column of memory cells of the memory array for providing a first voltage to the column of memory cells when a memory cell of the column is selected at a write cycle. The voltage provider is coupled to the voltage provider and the column of memory cells for providing a second voltage lower than the first voltage to the column of memory cells when the memory of the column is half selected at the write cycle.

Abstract: A memory array includes a plurality of columns of memory cells and each column of memory cells of the memory array is coupled to a local voltage source, a bit line, and a bit line bar. Provide a working voltage to pre-charge the bit line and the bit line bar of the column of memory cells when a memory cell of the column of memory cells is selected to be read, and meanwhile use local voltage sources coupled to remaining columns of memory cells of the memory array to provide high voltages lower than the working voltage to pre-charge bit lines and bit line bars of the remaining columns of memory cells.

Abstract: A memory cell includes six transistors. The first and second P-type transistors have the sources coupled to a first voltage. The first and second N-type transistors have the drains coupled to drains of the first and second P-type transistors, respectively; the sources coupled to a second voltage; and the gates coupled to gates of the first and second P-type transistors, respectively. The third N-type transistor has the drain coupled to a write word line; the source coupled to drain of the first N-type transistor and gate of the second N-type transistor; and the gate coupled to a first write bit line. The fourth N-type transistor has the drain coupled to the write word line; the source coupled to drain of the second N-type transistor and gate of the first N-type transistor; and the gate coupled to a second write bit line. A memory cell array is also provided.

Abstract: A memory cell includes six transistors. The first and second P-type transistors have the sources coupled to a first voltage. The first and second N-type transistors have the drains coupled to drains of the first and second P-type transistors, respectively; the sources coupled to a second voltage; and the gates coupled to gates of the first and second P-type transistors, respectively. The third N-type transistor has the drain coupled to a write word line; the source coupled to drain of the first N-type transistor and gate of the second N-type transistor; and the gate coupled to a first write bit line. The fourth N-type transistor has the drain coupled to the write word line; the source coupled to drain of the second N-type transistor and gate of the first N-type transistor; and the gate coupled to a second write bit line. A memory cell array is also provided.