Patents by Inventor Hsin Yeh

Hsin Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240047369
    Abstract: A chip package structure and a package module thereof are provided. The package module includes an encapsulant and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof and that corresponds in shape to a predetermined two-dimensional (2D) code pattern. The recognition contrast layer is filled in the patterned trench. The recognition contrast layer and the top surface of the encapsulant respectively have different colors that conform to grade A or grade B in the ISO/IEC 15415 standard. The recognition contrast layer is coplanar with the top surface of the encapsulant so as to jointly form the predetermined 2D code pattern having a planar shape.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 8, 2024
    Inventors: CHIH-HAO LIAO, HSIN-YEH HUANG, SHU-HAN WU
  • Publication number: 20240047373
    Abstract: A chip package structure and an electromagnetic interference (EMI) shielding package module thereof are provided. The EMI shielding package module includes an encapsulant, an EMI shielding layer, and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof. The EMI shielding layer includes a recognition region formed on the top surface and an embedded region that is filled in the patterned trench. The recognition contrast layer is filled in the patterned trench and is connected to the embedded region. The recognition contrast layer and the recognition region respectively have different colors that conform to grade A or grade B in ISO/IEC 15415 standard. An end portion of the recognition contrast layer protruding from the top surface is coplanar with the recognition region so as to jointly form a predetermined two-dimensional (2D) code pattern having a planar shape.
    Type: Application
    Filed: October 12, 2022
    Publication date: February 8, 2024
    Inventors: CHIH-HAO LIAO, HSIN-YEH HUANG, SHU-HAN WU
  • Patent number: 11870010
    Abstract: A light-emitting diode includes an N-type cladding layer, and a superlattice structure, an active layer, a P-type electron-blocking layer, and a P-type cladding layer disposed on the N-type cladding layer in such order. The superlattice structure includes at least one first layered element which has a sub-layer made of a nitride-based semiconductor material including Al, and having an energy band gap greater than that of said electron-blocking layer. The P-type electron-blocking layer is made of a nitride-based semiconductor material including Al, and has an energy band gap greater than that of the P-type cladding layer.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: January 9, 2024
    Assignee: Xiamen San'An Optoelectronics Co., Ltd.
    Inventors: Wen-Yu Lin, Meng-Hsin Yeh, Yun-Ming Lo, Chien-Yao Tseng, Chung-Ying Chang
  • Patent number: 11729301
    Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: August 15, 2023
    Assignee: HTC CORPORATION
    Inventors: Chih-Kuang Wang, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Publication number: 20230220017
    Abstract: The present disclosure relates to a method for alleviating and/or treating a coronavirus disease in a subject in need thereof, including administering an effective amount of Ganoderma immunomodulatory protein, a recombinant thereof or a fragment thereof to the subject.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 13, 2023
    Inventors: Tung-Yi LIN, Hsin YEH, Zhi-Hu LIN
  • Patent number: 11695410
    Abstract: Herein disclosed is a voltage isolation circuit coupled to power supplies. The voltage isolation circuit comprises a series switch group controlled by a first control signal, a parallel switch group controlled by a second control signal, and a first high impedance element. The series switch group comprises a transistor arranged in a first current loop and having two channels connected to one of the power supplies respectively. The first high impedance element, coupled to the transistor in parallel, has a measurement terminal and two ends, connected to one of the power supplies respectively. When the series switch group is conducted, the power supplies are coupled in series in the first current loop. When the parallel switch group is conducted, the power supplies are coupled in parallel in a second current loop. Impedance values measured from the measurement terminal to each end of the first high impedance element are identical.
    Type: Grant
    Filed: September 19, 2021
    Date of Patent: July 4, 2023
    Assignee: Chroma ATE Inc.
    Inventors: Yung-Lin Chen, Szu-Chieh Su, Lien-Sheng Hung, Chun-Tai Cheng, Hsi-Ping Tsai, Szu-Hsin Yeh
  • Patent number: 11690193
    Abstract: A support assembly includes a first slide rail assembly, a second slide rail assembly, a carried object, a first cable management device and a second cable management device. The first cable management device is mounted to the first slide rail assembly and the second slide rail assembly. The first cable management device includes a first cross bar and a second cross bar movably connected to the first cross bar. The first cross bar is further connected to the first slide rail assembly and the second cross bar is further connected to the first slide rail assembly. The present invention further discloses a cable management kit which includes the first cable management device and the second cable management device.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: June 27, 2023
    Assignees: KING SLIDE WORKS CO., LTD., KING SLIDE TECHNOLOGY CO., LTD.
    Inventors: Ken-Ching Chen, Shun-Ho Yang, Chih-Hsin Yeh, Chun-Chiang Wang
  • Publication number: 20230144389
    Abstract: An artificial intelligence (AI)-based constrained random verification (CRV) method for a design under test (DUT) includes: receiving a series of constraints; obtaining a limited constraint range according to the series of constraints; generating a series of stimuli according to the limited constraint range; and verifying the DUT by the series of stimuli; wherein at least one of the step of obtaining the limited constraint range according to the series of constraints and the step of generating the series of stimuli according to the limited constraint range employs an AI algorithm.
    Type: Application
    Filed: October 19, 2022
    Publication date: May 11, 2023
    Applicant: MEDIATEK INC.
    Inventors: Chung-An Wang, Chiao-Hua Tseng, Chia-Cheng Tsai, Tung-Yu Lee, Yen-Her Chen, Chien-Hsin Yeh, Chia-Shun Yeh, Chin-Tang Lai
  • Publication number: 20230134865
    Abstract: An intradialytic analysis method and an analysis apparatus for dialysis are provided. One or more input features are obtained. The input features include variance relation between current data and previous data of an operating parameter related to a dialysis machine and data related to a tester. Future data is predicted according to the input features through one or more prediction models. The future data includes blood pressure information and a predicted result of intradialytic hypotension at a future time point. Therefore, intradialytic hypotension can be predicted with high accuracy.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 4, 2023
    Applicant: Wistron Corporation
    Inventors: Chih-Hsin Yeh, Chih-Yi Chien, Chih-Feng Kuo, Ting-Hui Lee
  • Publication number: 20230122025
    Abstract: A semiconductor light emitting device includes an epitaxial light emitting structure that includes a light emitting component. The light emitting component includes a multiple quantum well structure which contains a plurality of first periodic layered elements, each of which includes first, second and third layers alternately stacked on one another. For each of the first periodic layered elements, the first, second and third layers respectively have first, second and third energy bandgaps (Eg1, Eg2, Eg3) that satisfy a relationship of Eg1<Eg2<Eg3. The third layer has a thickness smaller than that of the first layer. Also disclosed herein is another embodiment of the aforementioned semiconductor light emitting device.
    Type: Application
    Filed: December 16, 2022
    Publication date: April 20, 2023
    Inventors: Wen-Yu LIN, Meng-Hsin YEH, Yun-Ming LO, Chien-Yao TSENG, Chung-Ying CHANG
  • Publication number: 20230100165
    Abstract: An electronic device includes a first body, a second body and a third body. The first body includes a processing unit. The second body includes an input unit and is pivoted to an end of the first body. The third body includes a display unit and is pivoted to another end of the first body. When the third body is closed to the first body and the first body is closed to the second body, the electronic device is in a folded state. When the first body is expanded from the second body with a first predetermined angle, the third body is expanded from the first body with a second predetermined angle, such that the electronic device is in an operation state. When the electronic device is in the operation state, the third body is supported away from the second body by the first body.
    Type: Application
    Filed: June 15, 2022
    Publication date: March 30, 2023
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: I-Ta Tsai, Jyh-Chyang Tzou, Hsin Yeh, I-Hao Chen
  • Patent number: 11573486
    Abstract: A notebook computer including a screen, a body, and a camera module is provided. The body is pivotally connected to the screen so that the screen is opened and closed relative to the body. The camera module is stored in one of the screen and the body and includes a photosensitive element and a first polarizer. The first polarizer is disposed between the screen and the photosensitive element. The screen includes a display panel and a second polarizer. The second polarizer is disposed between the display panel and the first polarizer. The first polarizer and the second polarizer have different polarization directions.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: February 7, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsin Yeh, Cheng-Hao Hsu, Ting-Hsuan Yu, Han-Tsai Liu, Jyh-Chyang Tzou, Chih-Wen Chiang
  • Patent number: 11551955
    Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: January 10, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ming-Che Lai, Hua-Wei Peng, Chia-He Cheng, Ming-Tso Chen, Chao-Chi Lu, Hsin-Hsu Lin, Kuo-Tsai Lo, Kao-Hua Wu, Huan-Hsin Yeh
  • Patent number: 11538960
    Abstract: An epitaxial light emitting structure includes n-type and p-type semiconductor layers, and a light emitting component disposed therebetween. The light emitting component includes a multiple quantum well structure which contains a plurality of first periodic layered elements, each of which includes first, second and third layers alternately stacked on one another. For each of the first periodic layered elements, the first, second and third layers respectively have a first energy bandgap (Eg1), a second energy bandgap (Eg2), and a third energy bandgap (Eg3) that satisfy a relationship of Eg1<Eg2<Eg3. Also disclosed herein is a light emitting diode which includes the aforementioned epitaxial light emitting structure.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: December 27, 2022
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD
    Inventors: Wen-Yu Lin, Meng-Hsin Yeh, Yun-Ming Lo, Chien-Yao Tseng, Chung-Ying Chang
  • Patent number: 11539235
    Abstract: A power conversion circuit for an uninterruptible power system, including an inductor, a first capacitor, a second capacitor, a first switch, a second switch, a third switch, a first diode, a second diode, and a third diode body, is provided. A terminal of the second switch is electrically coupled to the inductor through the first switch, and another terminal of the second switch is electrically coupled to a neutral wire and the third switch. An anode and a cathode of the first diode are electrically coupled to the first switch and a positive DC bus, respectively. A cathode and an anode of the second diode are electrically coupled to the first switch and the third switch, respectively. A cathode and an anode of the third diode are electrically coupled to the third switch and a negative DC bus, respectively. In addition, an uninterruptible power system using the same is provided.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: December 27, 2022
    Assignee: CYBER POWER SYSTEMS, INC.
    Inventors: Yu-Cheng Yang, Kuang-Yu Yang, Cheng-Hsin Yeh
  • Patent number: 11538730
    Abstract: A chip scale package structure of heat-dissipating type is provided and includes a board, a die fixed on and electrically coupled to the board, a thermally conductive adhesive sheet adhered to the die, and a package body formed on the board. The die has a heat-output surface arranged away from the board. The thermally conductive adhesive sheet is connected to at least 50% of an area of the heat-output surface. The package body covers and is connected to the die and entire of the surrounding lateral surface of the thermally conductive adhesive sheet. The die is embedded in the board, the thermally conductive adhesive sheet, and the package body. The heat-dissipating surface of the thermally conductive adhesive sheet is exposed from the package body, and a thermal conductivity of the thermally conductive adhesive sheet is at least 150% of a thermal conductivity of the package body.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: December 27, 2022
    Assignee: AZUREWAVE TECHNOLOGIES, INC.
    Inventors: Hsin-Yeh Huang, Chih-Hao Liao, Shu-Han Wu
  • Patent number: 11527184
    Abstract: The invention relates to an image playing system and an image playing method. The image playing system includes a projection device. The projection device includes a storage circuit, a processor, and a projection module. The storage circuit stores a playing content including at least one multimedia content, a play time length and a play order corresponding to each multimedia content. The processor obtains the playing content from the storage circuit in response to receiving the power signal. The projection module is controlled by the processor and sequentially projects the multimedia content according to the play time length and play order corresponding to each multimedia content.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: December 13, 2022
    Assignee: Coretronic Corporation
    Inventors: Hao-Chang Tsao, Tsung-Hsin Yeh
  • Patent number: 11467050
    Abstract: An orientation device, an orientation system and an orientation method are provided. The orientation device includes a seat body, a pressure sensor, and a computing unit. The seat body includes a bearing surface, and the seat body is non-directional. The pressure sensor is disposed below the bearing surface. The pressure sensor is configured to obtain a plurality of pressure data of the bearing surface when an object is disposed on the bearing surface. The computing unit is coupled to the pressure sensor. The computing unit is configured to analyze the pressure data to obtain a direction data. The direction data is configured to determine a first direction of the seat body.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: October 11, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yao-Hsien Yang, Jyh-Chyang Tzou, Hsin Yeh
  • Patent number: D965586
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: October 4, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Tsai Liu, Jyh-Chyang Tzou, Hsin Yeh, Yao-Hsien Yang, Cheng-Ya Chi
  • Patent number: D968390
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 1, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Ya Chi, Hsin Yeh, Pai-Feng Chen, Chien-Chu Chen