Abstract: A chip scale package structure of heat-dissipating type is provided and includes a board, a die fixed on and electrically coupled to the board, a thermally conductive adhesive sheet gaplessly adhered to the die, and a package body formed on the board. The die has a heat-output surface arranged away from the board. The thermally conductive adhesive sheet is connected to at least 50% of an area of the heat-output surface. The package body covers and is connected to the die and the entirety of the surrounding lateral surface of the thermally conductive adhesive sheet. The die is embedded in the board, the thermally conductive adhesive sheet, and the package body. The heat-dissipating surface of the thermally conductive adhesive sheet is exposed from the package body, and a thermal conductivity of the thermally conductive adhesive sheet is at least 150% of a thermal conductivity of the package body.

Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.

Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.

Abstract: The invention relates to an image playing system and an image playing method. The image playing system includes a projection device. The projection device includes a storage circuit, a processor, and a projection module. The storage circuit stores a playing content including at least one multimedia content, a play time length and a play order corresponding to each multimedia content. The processor obtains the playing content from the storage circuit in response to receiving the power signal. The projection module is controlled by the processor and sequentially projects the multimedia content according to the play time length and play order corresponding to each multimedia content.

Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.

Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.

Abstract: An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.

Abstract: A support assembly includes a first slide rail assembly, a second slide rail assembly, a carried object, a first cable management device and a second cable management device. The first cable management device is mounted to the first slide rail assembly and the second slide rail assembly. The first cable management device includes a first cross bar and a second cross bar movably connected to the first cross bar. The first cross bar is further connected to the first slide rail assembly and the second cross bar is further connected to the first slide rail assembly. The present invention further discloses a cable management kit which includes the first cable management device and the second cable management device.

Abstract: Immobilized enzyme complexes (IEC) with enzymes that are non-covalently linked to matrices are provided along with methods for making the same. Methods of using the IEC for a wide variety of industrial enzymatic processes are also provided. Methods of converting cellulosic biomass and methods of effecting blood type conversions with the IEC are amongst the methods disclosed.

Abstract: A support assembly includes a first slide rail assembly, a second slide rail assembly, a first cable management device and a second cable management device. The first slide rail assembly includes a first rail and a second rail movable relative to the first rail. The second slide rail assembly includes a third rail and a fourth rail movable relative to the third rail. The first cable management device is mounted to the second rail of the first slide rail assembly and the fourth rail of the second slide rail assembly. The second cable management device includes a first cable management arm and a second cable management arm. The first cable management arm is mounted to the first rail of the first slide rail assembly and the second cable management arm is mounted to the second rail of the first slide rail assembly.

Abstract: An integrated antenna package structure including a circuit board, a chip, an encapsulant and an antenna is provided. The chip is disposed on and electrically connected to the circuit board. The encapsulant encapsulates the chip. The encapsulant has a first surface and a second surface, wherein the normal vector of the first surface is different from the normal vector of the second surface. The antenna is disposed on the first surface and the second surface of the encapsulant. A manufacturing method of an integrated antenna package structure is also provided.

Abstract: An epitaxial light emitting structure includes n-type and p-type semiconductor layers, and a light emitting component disposed therebetween. The light emitting component includes a multiple quantum well structure which contains a plurality of first periodic layered elements, each of which includes first, second and third layers alternately stacked on one another. For each of the first periodic layered elements, the first, second and third layers respectively have a first energy bandgap (Eg1), a second energy bandgap (Eg2), and a third energy bandgap (Eg3) that satisfy a relationship of Eg1<Eg2<Eg3. Also disclosed herein is a light emitting diode which includes the aforementioned epitaxial light emitting structure.

Abstract: An integrated antenna package structure including a circuit board, a chip, an encapsulant and an antenna is provided. The chip is disposed on the circuit board and electrically connected to the circuit board. The encapsulant encapsulates the chip. The antenna is embedded in the encapsulant. The antenna has a first outer surface, the encapsulant has a second outer surface, and the first outer surface is substantially coplanar with the second outer surface. A manufacturing method of an integrated antenna package structure is also provided.

Abstract: An integrated antenna package structure including a circuit board, a chip, an encapsulant and an antenna is provided. The chip is disposed on the circuit board and electrically connected to the circuit board. The encapsulant encapsulates the chip. The antenna is embedded in the encapsulant. The antenna has a first outer surface, the encapsulant has a second outer surface, and the first outer surface is substantially coplanar with the second outer surface. A manufacturing method of an integrated antenna package structure is also provided.

Abstract: An integrated antenna package structure including a circuit board, a chip, an encapsulant and an antenna is provided. The chip is disposed on and electrically connected to the circuit board. The encapsulant encapsulates the chip. The encapsulant has a first surface and a second surface, wherein the normal vector of the first surface is different from the normal vector of the second surface. The antenna is disposed on the first surface and the second surface of the encapsulant. A manufacturing method of an integrated antenna package structure is also provided.

Abstract: An electronic device includes a first body, a second body, and a speaker module. The first body includes a first housing and a second housing disposed on the first housing. The second body is pivotally connected to the first body. The speaker module is movably disposed in the first body. The first body has a first surface and a second surface, and the first surface and the second surface are respectively located at two opposite sides of the speaker module. When the speaker module is abutted against the first surface, the speaker module resonates with the first housing to emit a first sound. When the speaker module is abutted against the second surface, the speaker module resonates with the second housing to emit a second sound.

Abstract: A flexible display includes a bottom plate, a support plate, two hinge modules, a frame body, a bending module and a flexible panel. The support plate is provided with a first end and a second end. The first end is rotatably connected to the bottom plate. The hinge modules are disposed at the second end of the support plate. The frame body is provided with a fixed frame and a plurality of turning frames. The fixed frame is connected to the hinge modules. The plurality of turning frames are pivoted to two opposite sides of the fixed frame respectively. The bending module is connected with the fixed frame and the plurality of turning frames. The flexible panel is disposed on the frame body and covers the bending module. When the flexible display is switched to a touch mode, the bending module drives the plurality of turning frames to be flush with the fixed frame so that the flexible panel is in a flat plate shape.