Abstract: A planarization method and a CMP method are provided. The planarization method includes providing a substrate with a first region and a second region having different degrees of hydrophobicity or hydrophilicity and performing a surface treatment to the first region to render the degrees of hydrophobicity or hydrophilicity in proximity to that of the second region. The CMP method includes providing a substrate with a first region and a second region; providing a polishing slurry on the substrate, wherein the polishing slurry and the surface of the first region have a first contact angle, and the polishing slurry and the surface of the first region have a second contact angle; modifying the surface of the first region to make a contact angle difference between the first contact angle and the second contact angle equal to or less than 30 degrees.

Abstract: A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.

Abstract: A semiconductor device package includes a carrier, a semiconductor device disposed on the carrier, and a lid disposed on the semiconductor device. The lid is spaced from the carrier by a first distance. The lid includes a base portion, a first pin extending from the base portion toward the semiconductor device, and a transparent portion. The first pin is spaced from the carrier by a second distance.

Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.

Abstract: An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.

Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.

Abstract: Provided is a poly-p-xylyene having at least one chemically active functional group present in a form of particles. In an embodiment, the functionalized poly-p-xylylene is synthesized via CVD, and electrospinning is then performed at a relatively low polymer concentration, so as to produce functionalized poly-p-xylylene particles. The functionalized poly-p-xylyene particles have a particle size at nano-scale or micro-scale. Such functionalized poly-p-xylyene particles can be applied to biological fields extensively.

Abstract: Provided is an press needles with an alignment structure having a conductor and multiple needles. The conductor having two opposite ends has an acupuncture area and a holding area. The acupuncture area is located at one end of the conductor, and the holding area is located at the other end of the conductor. The needles are sequentially aligned at a side of the conductor. Therefore, the alignment structure offers the patient better treatments and decreasing the period of treatment.

Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.

Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.

Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.

Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.

Abstract: An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component, a light sensing component, and a lid. The light emitting component is disposed within the first chamber and the light sensing component is disposed within the second chamber. The lid includes a first lens with a non-convex upper surface and a convex lower surface facing the light emitting component. The upper surface of the first lens may be substantially planar. The lid may further include a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed.

Abstract: Provided is a poly-p-xylyene having at least one chemically active functional group present in a form of particles. In an embodiment, the functionalized poly-p-xylylene is synthesized via CVD, and electrospinning is then performed at a relatively low polymer concentration, so as to produce functionalized poly-p-xylylene particles. The functionalized poly-p-xylyene particles have a particle size at nano-scale or micro-scale. Such functionalized poly-p-xylyene particles can be applied to biological fields extensively.

Abstract: In a light emitting diode (LED) chess set, when a chess piece of the chess set is placed on a chessboard, a power supply element in the chessboard will supply power to an LED in the chess piece to emit light, so that the chess piece gives a light emitting effect. When a player removes a chess piece from a square of the chessboard for a next movement of the chess piece, a control element in the chessboard will identify an identification element of the chess piece through a sensing element on the square to determine the possible next movements of the chess piece on the chessboard and drive the LEDs in the corresponding squares of all suggested movements to emit light. The light-emitting square guides and suggests players to make the next movement of a chess piece and improve a beginner's memory on the rules of chess.

Abstract: A method for continuously projecting images by enabling an apparatus including a light source, an image creation unit, and a projection unit includes receiving video signals from a predetermined source; creating a plurality of images from the video signals while being impinged by light emitted by the light source; receiving the images from the image creation unit; and activating the projection unit to project the images on a projection screen in a predetermined rapid succession so as to create a motion picture effect. As such, lighting adjustment and natural beauty simulations in a vivid way can be achieved.

Abstract: A light mixing apparatus of a light emitting diode (LED) is installed on a light emitting surface of the LED. The light emitted from the LED is mixed by a light mixing module of the light mixing apparatus uniformly for adjusting the light output angle. After the angle increases, the light is scattered into a fixed base of the light mixing apparatus, reflected to a containing groove of the light mixing apparatus by a reflecting layer of the fixed base, and guided into the total internal reflection lens of the containing groove. After the total internal reflection lens gathers the light, the light is projected onto a projected surface. If the LED is made of a multi-chip package, the light mixing apparatus can be used for improving the luminance of a light emitted by the LED onto the projected surface and the uniform distribution of the luminance.