Abstract: The present invention provides a fabric having soil resistance and no oil stains after wiping and a manufacturing method thereof. The fabric of the present invention comprises an underlayer and a soil-resistant protection film, which can effectively prevent oil corrosion, penetration, and permeation of the surface of the fabric, thus resulting in no oil stains after wiping. The manufacturing method of the present invention comprises the steps of dyeing, setting, performing an underlayer surface treatment to form an underlayer on a surface of the fabric, and performing a soil resistance processing treatment to form a soil-resistant protection film on the surface of the underlayer.

Abstract: A power management device cooperated with a plurality of computing units and a plurality of power supply units is disclosed. The power supply units provide the power source to the computing units through the power management device. The power management device includes a detecting module and a control module. The detecting module is operatively connected with the computing units, and detects a total consumption power of the computing units. The control module is operatively connected with the detecting module and the power supply units, and adjusts the operation amount of the power supply units providing the power source to the computing units in accordance with the total consumption power. In addition, a high performance server and a power management method are also disclosed.

Abstract: A photomask storage apparatus including a bottom plate and top lid is provided. The photomask storage apparatus includes poly-ether ketone (PEEK). A fastening element is configured to couple the lid to the bottom plate. A retaining element is secured to the lid to prevent vibrations of a photomask. A vent structure is also provided. The vent structure is configured such that airflow through the vent is purged in approximately 360 degrees into a chamber including the photomask. The vent structure may include a particulate filter. A seal liner is disposed on the bottom component.

Abstract: A method for applying a plasticity plastic film to an in-mold decoration, including the steps of: (a) providing a substrate defining a top surface and a bottom surface, printing layer and a plastic material; wherein the plasticity plastic film comprises a photo-curing multiple functional group oligomer, a thermohardening resin and a cross-linking agent, and the photo-curing multiple functional group oligomer is cross-linked with the thermohardening resin through the cross-linking agent; (b) forming the plasticity plastic film on the top surface of the substrate; (c) hardening the plasticity plastic film; (d) solidifying the plasticity plastic film to form a plasticity resin layer; (e) covering the bottom surface of the substrate with the printing layer; (f) simultaneously pressing the plasticity resin layer and the substrate to form a predetermined shape; and then (g) forming the plastic material on a bottom surface of the printing layer.

Abstract: A manufacturing method for an article of photo-curing compose resin includes the following steps. First step is providing a plastic article with an upper surface and a bottom surface, a photo-curing compose resin, an ink layer, and a plastic material. Second, coating the photo-curing compose resin on the upper surface of the plastic article. Third, pressing and curing the photo-curing compose resin to form a plurality of patterns. Fourth step is shaping the plastic article with the patterns. Fifth step is coating the ink layer on the bottom surface of the plastic article. At the sixth step is injecting the plastic material to attach the plastic material with the ink layer.

Abstract: A film structure and a manufacturing method thereof are applied to the in-mold decoration process. First, at least two kinds of flexible resin particles are applied on the upper surface of a film. The two kinds of flexible resin particles include first resin particles for increasing the tissue-type feeling and second resin particles for enhancing the anti-wear effect. Next, an ink layer is formed on the lower surface of the film. A heating process is used for forming the film into a pre-determined shape, and an injection molding process is used for forming a plastic substrate and the plastic substrate is pasted below the ink layer. Finally, UV light is used for hardening the coating layer. Thereby, the film has the tissue-type feeling and the anti-wear effect.

Abstract: A photomask storage apparatus including a bottom plate and top lid is provided. The photomask storage apparatus includes poly-ether ketone (PEEK). A fastening element is configured to couple the lid to the bottom plate. A retaining element is secured to the lid to prevent vibrations of a photomask. A vent structure is also provided. The vent structure is configured such that airflow through the vent is purged in approximately 360 degrees into a chamber including the photomask. The vent structure may include a particulate filter. A seal liner is disposed on the bottom component.

Abstract: The present invention provides a fabric having soil resistance and no oil stains after wiping and a manufacturing method thereof. The fabric of the present invention comprises an underlayer and a soil-resistant protection film, which can effectively prevent oil corrosion, penetration, and permeation of the surface of the fabric, thus resulting in no oil stains after wiping. The manufacturing method of the present invention comprises the steps of dyeing, setting, performing an underlayer surface treatment to form an underlayer on a surface of the fabric, and performing a soil resistance processing treatment to form a soil-resistant protection film on the surface of the underlayer.

Abstract: A reticle carrier including a base portion and a cover portion at least partially detachable from the base portion. The base portion and the cover portion are configured to collectively house a reticle in a region collectively defined by the base portion and the cover portion when the base portion and the cover portion are fully attached. At least a portion of an interior surface of at least one of the base portion and the cover portion is treated with a sulfide-absorbing composition, such as silver or a silver-containing alloy.

Abstract: An automatic method to maintain and correct overlay in the fabrication of integrated circuits is described. An overlay control table is automatically generated for lots run through a process tool. An overlay correction is calculated from the overlay control table and sent to the process tool for real-time or manual overlay correction.

Abstract: A method for fabricating a microelectronic product and a system for fabricating the microelectronic product each employ an in-line automatic photolithographic processing and overlay registration measurement for a pair of pilot lots of a new product order, prior to in-line automatic processing of an additional new product order lot within a photolithographic process tool. The method and the system provide for efficient production of new product order lots, absent need for an independent pilot lot qualification method or system.

Abstract: An automatic method to maintain and correct overlay in the fabrication of integrated circuits is described. An overlay control table is automatically generated for lots run through a process tool. An overlay correction is calculated from the overlay control table and sent to the process tool for real-time or manual overlay correction.

Abstract: A method for fabricating a microelectronic product and a system for fabricating the microelectronic product each employ an in-line automatic photolithographic processing and overlay registration measurement for a pair of pilot lots of a new product order, prior to in-line automatic processing of an additional new product order lot within a photolithographic process tool. The method and the system provide for efficient production of new product order lots, absent need for an independent pilot lot qualification method or system.

Abstract: Removing photoresist from alignment marks on a semiconductor wafer using a wafer edge exposure process is disclosed. The alignment marks on the wafer are covered by photoresist used in conjunction with semiconductor processing of one or more layers deposited on the semiconductor wafer. One or more parts of the edge of the wafer are exposed to remove the photoresist from these parts and thus reveal alignment marks on the wafer. The exposure of the one or more parts of the wafer is accomplished without performing a photolithographic clear out process. Rather, a wafer edge exposure (WEE) process is inventively utilized. Once the WEE process is performed, subsequent layers may be deposited by aligning them using the revealed alignment marks.

Abstract: Removing photoresist from alignment marks on a semiconductor wafer using a wafer edge exposure process is disclosed. The alignment marks on the wafer are covered by photoresist used in conjunction with semiconductor processing of one or more layers deposited on the semiconductor wafer. One or more parts of the edge of the wafer are exposed to remove the photoresist from these parts and thus reveal alignment marks on the wafer. The exposure of the one or more parts of the wafer is accomplished without performing a photolithographic clear out process. Rather, a wafer edge exposure (WEE) process is inventively utilized. Once the WEE process is performed, subsequent layers may be deposited by aligning them using the revealed alignment marks.