Patents by Inventor Hsing Chen

Hsing Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240234635
    Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.
    Type: Application
    Filed: December 29, 2023
    Publication date: July 11, 2024
    Inventors: Chao-Hsing CHEN, Jia-Kuen WANG, Tzu-Yao TSENG, Tsung-Hsun CHIANG, Bo-Jiun HU, Wen-Hung CHUANG, Yu-Ling LIN
  • Publication number: 20240216496
    Abstract: A recombinant lactic acid bacterium and a method thereof for simultaneous treatment and/or prevention of dust mite and cockroach allergies. The recombinant lactic acid bacterium has a gene fragment with nucleotide coded as SEQ ID No: 1 to be capable of expressing the D2P2 protein with amino acid sequence of SEQ ID No: 2. Therefore, by administering an effective amount of the recombinant lactic acid bacterium to an individual is capable of effectively causing the individual's body to produce antibodies against dust mite and/or cockroach allergens, thereby achieving an efficacy of preventing and/or treating an allergic disease caused by dust mite and/or cockroach allergens.
    Type: Application
    Filed: June 7, 2023
    Publication date: July 4, 2024
    Inventors: Mey Fann LEE, Yi-Hsing CHEN
  • Patent number: 12023150
    Abstract: An implantable micro-biosensor includes at least one counter electrode, a first working electrode, a chemical reagent layer, and at least one second working electrode. The chemical reagent layer reacts with an analyte to product a product, such that a first sensing section of the first working electrode is driven to perform a measurement action. A second sensing section of the second working electrode is driven to perform an interference-eliminating action to consume interference. The second working electrode cooperates with the counter electrode to permit the counter electrode to be driven to perform a regeneration action to regenerate silver halide.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: July 2, 2024
    Assignee: BIONIME CORPORATION
    Inventors: Chun-Mu Huang, Chieh-Hsing Chen
  • Publication number: 20240206771
    Abstract: The present invention provides a micro biosensor for reducing a measurement interference when measuring a target analyte in the biofluid, including: a substrate; a first working electrode configured on the surface, and including a first sensing section; a second working electrode configured on the surface, and including a second sensing section which is configured adjacent to at least one side of the first sensing section; and a chemical reagent covered on at least a portion of the first sensing section for reacting with the target analyte to produce a resultant. When the first working electrode is driven by a first working voltage, the first sensing section measures a physiological signal with respect to the target analyte. When the second working electrode is driven by a second working voltage, the second conductive material can directly consume the interferant so as to continuously reduce the measurement inference of the physiological signal.
    Type: Application
    Filed: March 7, 2024
    Publication date: June 27, 2024
    Inventors: Chun-Mu Huang, Chieh-Hsing Chen, Heng-Chia Chang, Chi-Hao Chen, Pi-Hsuan Chen
  • Patent number: 12016681
    Abstract: A physiological signal monitoring device includes a biosensor, and a transmitter including a bottom casing, a processing unit and a battery. The bottom casing has a first stepped section, a second stepped section, and a riser section interconnecting the first stepped section and the second stepped section. The processing unit corresponds in position to the first stepped section. The battery corresponds in position to the first stepped section, and is configured not to overlap the processing unit in a direction of a first axis so as to reduce a thickness of the transmitter.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: June 25, 2024
    Assignee: BIONIME CORPORATION
    Inventors: Chun-Mu Huang, Chieh-Hsing Chen
  • Patent number: 12010996
    Abstract: Novel tris-substituted biguanide compounds are made by reaction of sodium dicyanamide with a trifunctional primary amine followed by reaction with anilines. The tris-substituted biguanide compounds are potent biocide and useful as a disinfectant. The novel compounds have biocidal activity comparable to those of widely used chlorhexidine with respect to width of antibacterial spectrum and in immediate effectiveness. The novel tris-substituted biguanide compounds can also be used for cleaning wounds, preventing dental plaque, treating yeast infections of the mouth, and to keep urinary catheters from blocking, These novel compounds have superior aqueous solubility and bioavailability and have potent antibacterial activity especially against A. baumanni and K. pneumonia.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: June 18, 2024
    Inventor: Hwang Hsing Chen
  • Patent number: 12014987
    Abstract: The present disclosure provides a structure and a method to reduce electro-migration. An interconnect structure according to the present disclosure includes a conductive feature embedded in a dielectric layer, a capping barrier layer disposed over the conductive feature and the dielectric layer, and an adhesion layer sandwiched between the capping barrier layer and the dielectric layer. The adhesion layer includes a degree of crystallinity between about 40% and about 70%.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: June 18, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Chen Ho, Chien Lin, Cheng-Yeh Yu, Hsin-Hsing Chen, Ju Ru Hsieh
  • Patent number: 12015350
    Abstract: A novel power supply apparatus (10) includes a microcontroller (102) and a plurality of voltage converters (104). If the voltage converters (104) are in a boost mode and a plurality of duty cycles of the voltage converters (104) calculated by the microcontroller (102) are less than 0.5, the microcontroller (102) is configured to limit at least one of the duty cycles of the voltage converters (104) to 0.5. If the voltage converters (104) are in a buck mode and the duty cycles of the voltage converters (104) calculated by the microcontroller (102) are greater than 0.5, the microcontroller (102) is configured to limit at least one of the duty cycles of the voltage converters (104) to 0.5.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: June 18, 2024
    Assignee: P-DUKE TECHNOLOGY CO., LTD.
    Inventors: Lien-Hsing Chen, Ta-Wen Chang, Hsiao-Hua Chi, Ching-Ming Lai, Wei-Hsuan Lin
  • Publication number: 20240194724
    Abstract: A light-emitting device comprises a substrate; a first light-emitting unit and a second light-emitting unit formed on the substrate, each of the first light-emitting unit and the second light-emitting unit comprises a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first light-emitting unit comprises a first semiconductor mesa and a first surrounding part surrounding the first semiconductor mesa, and the second light-emitting unit comprises a second semiconductor mesa and a second surrounding part surrounding the second semiconductor mesa; a trench formed between the first light-emitting unit and the second light-emitting unit and exposing the substrate; a first insulating layer comprising a first opening on the first surrounding part and a second opening on the second semiconductor layer of the second light-emitting unit; and a connecting electrode comprising a first connecting part on the first
    Type: Application
    Filed: February 15, 2024
    Publication date: June 13, 2024
    Inventors: Chao-Hsing CHEN, I-Lun MA, Bo-Jiun HU, Yu-Ling LIN, Chien-Chih LIAO
  • Publication number: 20240186459
    Abstract: A light emitting structure includes a carrying unit, a light emitting unit and a light transmitting unit. The light emitting unit is arranged on the carrying unit, and includes a light emitting surface. The light transmitting unit directly contacts the light emitting unit, and includes a first surface and a second surface opposite to each other. The first surface covers at least part of the light emitting surface, and the second surface directly contacts a gas.
    Type: Application
    Filed: December 4, 2023
    Publication date: June 6, 2024
    Inventors: Chen-Lun HSING CHEN, Jung-Hao HUNG, Yung-Chun YANG
  • Patent number: 12002904
    Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: June 4, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Hsing Chen, Tsung-Hsun Chiang, Chien-Chih Liao, Wen-Hung Chuang, Min-Yen Tsai, Bo-Jiun Hu
  • Patent number: 11994534
    Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board, a testing socket, a conductive fastener, a cover, and a conductive element assembly. The printed circuit board includes a first metal layer formed on the bottom surface thereof. The testing socket is disposed above the printed circuit board. The conductive fastener is configured to secure the testing socket to the printed circuit board, wherein the conductive fastener is electrically connected to the first metal layer and the testing socket. The cover is disposed above the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket, wherein the cover makes electrical contact with the integrated circuit package. The conductive element assembly is disposed between and electrically connected to the cover and the testing socket.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shao-Chun Chiu, Wen-Feng Liao, Hao Chen, Chun-Hsing Chen
  • Patent number: 11990575
    Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.
    Type: Grant
    Filed: June 5, 2023
    Date of Patent: May 21, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Hsin-Ying Wang, Chih-Hao Chen, Chien-Chih Liao, Chao-Hsing Chen, Wu-Tsung Lo, Tsun-Kai Ko, Chen Ou
  • Publication number: 20240163417
    Abstract: The present invention saves space by having an image sensor testing system that includes an image capturing module, an image storage module, and a signal processing module that are integrated on a mainboard. The mainboard uses multiple wires to respectively electrically connect to the image capturing module, the image storage module, and the signal processing module, and the image storage module is electrically connected to the image capturing module and the signal processing module. The image capturing module captures an image signal generated by an image sensor, the image storage module stores the image signal, and the signal processing module processes the image signal into a processed image signal and analyzes the processed image signal to obtain an image test value. The image capturing module and the signal processing module both directly access the image storage module, allowing the image test value to be calculated with less processing time.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 16, 2024
    Inventors: Yu-Hsing CHEN, Chen-An FANG, Syue-Ling YAN
  • Patent number: 11983882
    Abstract: The invention provides an E13B image interpretation method mainly aiming at interpreting numbers and symbols in a check reading code printed with magnetic ink on a check, and defining a plurality of feature areas for each of the numbers and dividing each of the numbers into a plurality of blocks, and then interpreting according to whether an amount of magnetic ink being in the feature areas and a magnetic ink density between the blocks, and also generating a plurality of target pixels for each of the symbols, and then interpreting according to a relative position and a size of the target pixels.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: May 14, 2024
    Assignee: ADVANCED VIEW INC.
    Inventor: Chung-Hsing Chen
  • Publication number: 20240148280
    Abstract: An implantable micro-biosensor a substrate, a first electrode, a second electrode, a third electrode, and a chemical reagent layer. The first electrode is disposed on the substrate and used as a counter electrode. The second electrode is disposed on the substrate and spaced apart from the first electrode. The third electrode is disposed on the substrate and used as a working electrode. The chemical reagent layer at least covers a sensing section of the third electrode so as to permit the third electrode to selectively cooperate with the first electrode or the first and second electrodes to measure a physiological signal in response to the physiological parameter of the analyte.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Inventors: Chun-Mu Huang, Chieh-Hsing Chen, Heng-Chia Chang, Chi-Hao Chen, Chien-Chung Chen
  • Publication number: 20240154065
    Abstract: An optoelectronic device includes a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second semiconductor layer; a first insulating layer on the second semiconductor layer and including a plurality of first openings exposing the first semiconductor layer, wherein the first openings include a first group and a second group; a third electrode on the first insulating layer and including a first extended portion and a second extended portion, wherein the first extended portion and the second extended portion are respectively electrically connected to the first semiconductor layer through the first group of the first openings and the second group of the first openings, and wherein the number of the first group of the first openings is different from the number of the second group of the first openings; and a plurality of fourth electrodes on the second insulating layer and electrically connected to the second semiconductor layer, wherein in a
    Type: Application
    Filed: January 11, 2024
    Publication date: May 9, 2024
    Inventors: Chao-Hsing CHEN, Jia-Kuen WANG, Chien-Chih LIAO, Tzu-Yao TSENG, Tsun-Kai KO, Chien-Fu SHEN
  • Patent number: 11974842
    Abstract: An implantable micro-biosensor a substrate, a first electrode, a second electrode, a third electrode, and a chemical reagent layer. The first electrode is disposed on the substrate and used as a counter electrode. The second electrode is disposed on the substrate and spaced apart from the first electrode. The third electrode is disposed on the substrate and used as a working electrode. The chemical reagent layer at least covers a sensing section of the third electrode so as to permit the third electrode to selectively cooperate with the first electrode or the first and second electrodes to measure a physiological signal in response to the physiological parameter of the analyte.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: May 7, 2024
    Assignee: Bionime Corporation
    Inventors: Chun-Mu Huang, Chieh-Hsing Chen, Heng-Chia Chang, Chi-Hao Chen, Chien-Chung Chen
  • Patent number: 11979980
    Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: May 7, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11973164
    Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: April 30, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Che-Hung Lin, Chien-Chih Liao, Chi-Shiang Hsu, De-Shan Kuo, Chao-Hsing Chen