Patents by Inventor HSING HUNG

HSING HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120919
    Abstract: A non-contact switch and a non-contact switch control system are provided. The non-contact switch control system includes multiple non-contact switches, each including an infrared light module, a brightness sensing unit, a second switch module and a processing unit. The infrared light module includes a first switch module, transmitting unit and receiving unit. The first switch module has a first switch state. The transmitting unit connected to the first switch module emits infrared light according to the first switch state. The receiving unit receives a reflected light of the infrared light. The brightness sensing unit generates brightness information according to an ambient light. The second switch module has a second switch state. The processing unit is connected with the infrared light module, the brightness sensing unit and the second switch module, and controls the second switch state according to the reflected light and the brightness information.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Inventors: chih-hung Liu, YA-HAN KO, RAN-SHIOU YOU, HSING-YU CHEN
  • Patent number: 11952665
    Abstract: A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: April 9, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Hsing-Hung Hsieh, Super Liao
  • Patent number: 11955428
    Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.
    Type: Grant
    Filed: February 6, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 11955379
    Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai
  • Patent number: 11939677
    Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: March 26, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hsing-Hung Hsieh
  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20240076422
    Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
  • Publication number: 20240071285
    Abstract: In examples, an electronic device comprises an expandable display having a primary portion and first and second auxiliary portions. The expandable display has a default mode in which the first and second auxiliary portions are hidden and an expanded mode in which the first and second auxiliary portions are visible on opposing horizontal ends of the primary portion. The electronic device includes first and second timing controllers (TCONs) to control pixels in the expandable display.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Hsing-Hung HSIEH, Super LIAO, Kuan-Ting WU
  • Patent number: 11916110
    Abstract: Embodiments of the present disclosure provide a method for forming semiconductor device structures. The method includes forming a fin structure having a stack of semiconductor layers comprising first semiconductor layers and second semiconductor layers alternatingly arranged, forming a sacrificial gate structure over a portion of the fin structure, removing the first and second semiconductor layers in a source/drain region of the fin structure that is not covered by the sacrificial gate structure, forming an epitaxial source/drain feature in the source/drain region, removing portions of the sacrificial gate structure to expose the first and second semiconductor layers, removing portions of the second semiconductor layers so that at least one second semiconductor layer has a width less than a width of each of the first semiconductor layers, forming a conformal gate dielectric layer on exposed first and second semiconductor layers, and forming a gate electrode layer on the conformal gate dielectric layer.
    Type: Grant
    Filed: July 4, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Ching Wang, Wei-Yang Lee, Ming-Chang Wen, Jo-Tzu Hung, Wen-Hsing Hsieh, Kuan-Lun Cheng
  • Patent number: 11892728
    Abstract: A device comprises a display that includes an aperture layer, a plurality of light sources, and a piezo material. The aperture layer includes a plurality of apertures. The plurality of light sources is arranged to correspond to the plurality of the aperture. The piezo material is coupled to the light sources and is configured to alter a distance between the light sources and the corresponding apertures.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: February 6, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi-Hao Chang
  • Patent number: 11887993
    Abstract: The present disclosure is drawn to thin-film transistors, electronic displays that include thin-film transistors, and methods of making thin-film transistors. In one example, a thin-film transistor can include a nonconductive substrate, a semiconductor layer on the nonconductive substrate, a source electrode adjacent a first side of the semiconductor layer and partially overlapping a first peripheral portion of the semiconductor layer, a drain electrode adjacent a second side of the semiconductor layer and partially overlapping a second peripheral portion of the semiconductor layer, an etch stop layer on the semiconductor layer, a gat insulator layer on the etch stop layer, and a gate electrode on the gate insulator layer. The source electrode and the drain electrode do not overlap the etch stop layer.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: January 30, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Super Liao
  • Patent number: 11869270
    Abstract: A sensing device includes a first substrate, a first sensing element, a first light-shielding layer, a second light-shielding layer and an insulating layer. The first sensing element is disposed on the first substrate. The first light-shielding layer is disposed on the first sensing element and has a first opening, wherein the first opening is completely overlapped with the first sensing element. The second light-shielding layer is disposed on the first light-shielding layer and includes an upper light-shielding part and a lateral light-shielding part, wherein the upper light-shielding part is overlapped with the first light-shielding layer and has a second opening, and the lateral light-shielding part is separated from the upper light-shielding part. The insulating layer is disposed between the first light-shielding layer and the second light-shielding layer, and the lateral light-shielding part covers a sidewall of the insulating layer.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: January 9, 2024
    Assignee: AUO Corporation
    Inventors: Shuo-Hong Wang, Yang-En Wu, Shih-Hsing Hung, Chao-Chien Chiu
  • Patent number: 11846845
    Abstract: An example of an apparatus is provided. The apparatus includes a display portion and a camera. In addition, the apparatus includes a thin film transistor substrate extending over the display portion and the camera. Furthermore, the apparatus includes an image generation layer disposed under the thin film transistor substrate within the display portion. Also, the apparatus includes a polymer dispersed liquid crystal disposed between the thin film transistor substrate and the camera. The polymer dispersed liquid crystal is to be switched between an opaque state and a clear state. The opaque state is to block the camera from receiving imaging light. The clear state allows light to pass through the polymer dispersed liquid crystal.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: December 19, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Alexander Wayne Clark, Ann Alejandro Villegas
  • Publication number: 20230401296
    Abstract: In an example in accordance with the present disclosure, a wearable extended reality (XR) system is described. The wearable XR system includes a transceiver to receive, from a host computing device, a hologram pattern of original content to be displayed. The wearable XR system also includes a display unit. The display unit includes 1) a pattern lens to display the hologram pattern in front of a red, green, blue (RGB) light source and 2) the RGB light source to emit red, green, and blue light towards the hologram pattern to deconstruct the hologram pattern to present the original content. The wearable XR system also includes an image director to reflect the decoded original content towards a user of the wearable XR system.
    Type: Application
    Filed: June 8, 2022
    Publication date: December 14, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Super Liao, Chia-Cheng Lin, Hsing-Hung Hsieh
  • Publication number: 20230351799
    Abstract: A sensing device includes a first substrate, a first sensing element, a first light-shielding layer, a second light-shielding layer and an insulating layer. The first sensing element is disposed on the first substrate. The first light-shielding layer is disposed on the first sensing element and has a first opening, wherein the first opening is completely overlapped with the first sensing element. The second light-shielding layer is disposed on the first light-shielding layer and includes an upper light-shielding part and a lateral light-shielding part, wherein the upper light-shielding part is overlapped with the first light-shielding layer and has a second opening, and the lateral light-shielding part is separated from the upper light-shielding part. The insulating layer is disposed between the first light-shielding layer and the second light-shielding layer, and the lateral light-shielding part covers a sidewall of the insulating layer.
    Type: Application
    Filed: April 7, 2023
    Publication date: November 2, 2023
    Applicant: AUO Corporation
    Inventors: Shuo-Hong Wang, Yang-En Wu, Shih-Hsing Hung, Chao-Chien Chiu
  • Patent number: 11775017
    Abstract: The present disclosure is drawn to bendable displays for electronic devices. In one example, a first display region including a glass panel that is rigid, the glass panel including a first interlocking edge. A second display region can include a plastic panel that is bendable, the plastic panel including a second interlocking edge that is shaped to inversely correspond with the first interlocking edge. An interlock zone where the first interlocking edge can be joined with the second interlocking edge such that the first display region and the second display region form a continuous display panel that is bendable at a location along the second display region.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: October 3, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Super Liao, Kuan-Ting Wu, Hsing-Hung Hsieh
  • Patent number: 11768652
    Abstract: A portable computing device may comprise an internal central processing unit (CPU), an internal graphics processing unit (GPU), a communications port to communicate with an external computing device, a first electronic display connected to the internal GPU, a second electronic display connected to the internal GPU, a touch input device to receive touch inputs from a user, and a display mode control unit. The control unit may cause the portable computing device to selectively operate in a dual display operational mode, a direct input operational mode, and an indirect input operational mode.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: September 26, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mario E. Campos, Hsing-Hung Hsieh, Cheng-Hua Yu
  • Publication number: 20230298516
    Abstract: A display having an area of non-transparent pixels, an area of transparent pixels, a camera positioned behind the transparent pixels to capture an image when light passes through the transparent pixels, and a display controller for driving the non-transparent pixels at a first brightness and driving the transparent pixels at a second brightness greater than the first brightness during image capture by the camera.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 21, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Dehuei Chen
  • Patent number: 11763748
    Abstract: A control circuit of a pixel-addressable display corrects a brightness of a pixel element of a pixel circuit of the display based on a curvature of a curvable area of the display. The control circuit selectively applies data line voltages to the pixel circuit. The pixel circuit applies a driving voltage to the pixel element based on the data line voltages.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: September 19, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Dehuei Chen, Ann Alejandro Villegas
  • Patent number: 11763759
    Abstract: In an example implementation according to aspects of the present disclosure, a display panel is described including a set of high color gamut light emitting diodes (LEDs), a set of narrow color gamut LEDs, a light guide plate wherein the set of high color gamut LEDs alternate positions with the set of narrow color gamut LEDs, and a switch to toggle between the sets of LEDs.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: September 19, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Hsing-Hung Hsieh, Thong Thai, Mario Campos, Gregory Staten