Patents by Inventor Hsing Liu
Hsing Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11979980Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.Type: GrantFiled: August 19, 2021Date of Patent: May 7, 2024Assignee: UNIFLEX Technology Inc.Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
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Patent number: 11973149Abstract: A semiconductor device includes: a first conductive plate and a second conductive plate disposed adjacent to the first conductive plate; a first insulating plate disposed over the first conductive plate and the second conductive plate; a third conductive plate disposed over the first insulating plate; a second insulating plate disposed over the third conductive plate; a fourth conductive plate disposed over the second insulating plate; a first conductive via penetrating the fourth conductive plate, the second insulating plate, the first insulating plate, and the first conductive plate, wherein the first conductive via is electrically coupled to the fourth conductive plate and the first conductive plate; and a second conductive via penetrating the second insulating plate, the third conductive plate, the first insulating plate, and the second conductive plate, wherein the second conductive via is electrically coupled to the third conductive plate and the second conductive plate.Type: GrantFiled: February 6, 2023Date of Patent: April 30, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Yu-Hsing Chang, Chern-Yow Hsu, Shih-Chang Liu
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Patent number: 11945156Abstract: A three-dimensional printing apparatus includes a liquid tank capable of accommodating a photosensitive liquid. The liquid tank includes a film, a plurality of side walls, a plate and a motor. The film has a workpiece curing area. The plurality of side walls surrounds the film. The plate is capable of supporting the film and having at least one fluid tunnel extending from a first surface of the plate contacting the film to a second surface of the plate. The motor is connected to the liquid tank to incline the liquid tank. A gap is formed between the plat and one of the plurality of side walls of the liquid tank, and the film is communicated with an outside space via the gap.Type: GrantFiled: November 25, 2019Date of Patent: April 2, 2024Assignee: YOUNG OPTICS INC.Inventors: Li-Han Wu, Chien-Hsing Tsai, Chao-Shun Chen, Tsung-Yu Liu
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Patent number: 11937370Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.Type: GrantFiled: September 1, 2021Date of Patent: March 19, 2024Assignee: UNIFLEX Technology Inc.Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
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Publication number: 20240064867Abstract: A temperature control assembly includes a plurality of heating units and a plurality of temperature sensors. The heating units are arranged in a ring shape, and the temperature sensors are respectively arranged on the heating units. Each of the heating units includes a bearing hole and a heating body. The heating body surrounds the bearing hole and is configured to generate heat, and each of the temperature sensors is configured to sense a temperature.Type: ApplicationFiled: November 29, 2022Publication date: February 22, 2024Inventors: Chen-An SUNG, Chiung-Wei CHEN, Cheng-Hsing LIU
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Patent number: 11890256Abstract: An active rollator includes an auxiliary frame, a driving assembly, a sensing assembly, and a controller. The sensing assembly is configured to sense an operation area and output a sensing signal. When a user holds handlebars of the auxiliary frame and stands in the operation area, the controller is configured to, according to the sensing signal and a sensing threshold, control the driving assembly to make the auxiliary frame have a motion. Therefore, the active rollator aids the travel of the user.Type: GrantFiled: November 19, 2020Date of Patent: February 6, 2024Assignee: WISTRON CORPORATIONInventors: Ming-Ru Syue, Cheng-Hsing Liu, Jia-Hung Lee
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Patent number: 11742394Abstract: Provided are a semiconductor substrate and a transistor. The semiconductor substrate includes a base, an insulating layer, a semiconductor layer, a wide bandgap diffusion buffer layer and a nucleation layer. The insulating layer is disposed on the base. The semiconductor layer is disposed on the insulating layer. The wide bandgap diffusion buffer layer is disposed on the semiconductor layer, wherein the bandgap of the wide bandgap buffer diffusion layer is higher than 2.5 eV. The nucleation layer is disposed on the wide bandgap diffusion buffer layer, wherein the nucleation layer includes an aluminum-containing layer.Type: GrantFiled: December 8, 2021Date of Patent: August 29, 2023Assignee: Industrial Technology Research InstituteInventor: Hsueh-Hsing Liu
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Publication number: 20230132155Abstract: Provided is a semiconductor substrate with a balance stress. The semiconductor substrate includes a ceramics base, a nucleation layer and a first buffer layer doped with a first dopant. The ceramics base has an off-cut angle other than 0 degree. The nucleation layer is disposed on the ceramics base. The first buffer layer is disposed on the nucleation layer. The first dopant includes C, Fe or a combination thereof. The first buffer layer provides compressive stress to the ceramic base. The concentration of the first dopant in the first buffer layer is increased away from the ceramics base. The curvature of the semiconductor substrate is between 16 km?1 and ?16 km?1.Type: ApplicationFiled: November 28, 2022Publication date: April 27, 2023Applicant: Industrial Technology Research InstituteInventors: Chia-Lung Tsai, Hsueh-Hsing Liu
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Publication number: 20230129528Abstract: Provided are a semiconductor substrate and a transistor. The semiconductor substrate includes a base, an insulating layer, a semiconductor layer, a wide bandgap diffusion buffer layer and a nucleation layer. The insulating layer is disposed on the base. The semiconductor layer is disposed on the insulating layer. The wide bandgap diffusion buffer layer is disposed on the semiconductor layer, wherein the bandgap of the wide bandgap buffer diffusion layer is higher than 2.5 eV. The nucleation layer is disposed on the wide bandgap diffusion buffer layer, wherein the nucleation layer includes an aluminum-containing layer.Type: ApplicationFiled: December 8, 2021Publication date: April 27, 2023Applicant: Industrial Technology Research InstituteInventor: Hsueh-Hsing Liu
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Patent number: 11471362Abstract: A walker is provided. The walker includes a walker body, a handle unit, a first wheel unit and a second wheel unit. The handle unit is connected to the walker body. The first wheel unit is connected to the walker body. The second wheel unit is connected to the walker body. In an auxiliary mode, a first gap is formed between the first wheel unit and the second wheel unit. In a driving mode, a second gap is formed between the first wheel unit and the second wheel unit. The first gap is smaller than the second gap.Type: GrantFiled: July 21, 2020Date of Patent: October 18, 2022Assignee: WISTRON CORP.Inventors: Chen Yi Liang, Cheng Hsing Liu, Chien-Wei Chen
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Patent number: 11382821Abstract: A movable carrier includes a main body, a first wheel, a driving module, a first support member, a second wheel, a seat, a first handle and two first switches. The first wheel is pivotally connected to the main body. The driving module is disposed in the main body. The first support member is connected to the driving module. The second wheel is pivotally connected to the first support member. The seat is disposed on the main body. The first handle is pivotally connected to the seat and has a trigger portion. The first switches are disposed on the seat. When the first handle rotates with respect to the seat and the trigger portion triggers the first switch, the driving module drives the first support member to rotate with respect to the main body, so as to increase or decrease a distance between the first wheel and the second wheel.Type: GrantFiled: January 31, 2019Date of Patent: July 12, 2022Assignee: Wistron CorporationInventors: Chen-Yi Liang, Cheng-Hsing Liu, Chien-Wei Chen
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Publication number: 20220192904Abstract: A barrier overcoming method for a mobile assistive device is disclosed. The barrier overcoming method includes sensing a surrounding environment of the mobile assistive device; determining whether a dangerous terrain exists in the surrounding environment of the mobile assistive device; determining whether the dangerous terrain belongs to a conquerable obstacle when the dangerous terrain exists in the surrounding environment around the mobile assistive device; and adjusting a status of the mobile assistive device to overcome the dangerous terrain when the dangerous terrain belongs to a conquerable obstacle.Type: ApplicationFiled: March 22, 2021Publication date: June 23, 2022Inventors: Ming-Ru Syue, Cheng-Hsing Liu
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Publication number: 20220096311Abstract: An active rollator includes an auxiliary frame, a driving assembly, a sensing assembly, and a controller. The sensing assembly is configured to sense an operation area and output a sensing signal. When a user holds handlebars of the auxiliary frame and stands in the operation area, the controller is configured to, according to the sensing signal and a sensing threshold, control the driving assembly to make the auxiliary frame have a motion. Therefore, the active rollator aids the travel of the user.Type: ApplicationFiled: November 19, 2020Publication date: March 31, 2022Inventors: Ming-Ru Syue, Cheng-Hsing Liu, Jia-Hung Lee
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Patent number: 11253418Abstract: An omnidirectional wheel is provided. The omnidirectional wheel includes a support unit, a major wheel, a first minor wheel and a second minor wheel. The major wheel is annular and is rotatably disposed on the support unit. The first minor wheel is rotatably disposed on the support unit. The first minor wheel is disposed on one side of the major wheel. The second minor wheel is rotatably disposed on the support unit. The second minor wheel is disposed on the other side of the major wheel. The omnidirectional wheel can easily roll over an obstacle when the omnidirectional wheel rolls laterally or forward.Type: GrantFiled: April 15, 2020Date of Patent: February 22, 2022Assignee: WISTRON CORP.Inventors: Chen Yi Liang, Cheng Hsing Liu, Chien-Wei Chen
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Patent number: 11233173Abstract: An ultraviolet C light-emitting diode including an n-type semiconductor layer, a p-type semiconductor layer, an active layer, a two-dimensional hole gas (2DHG) inducing layer, and an electron blocking layer is provided. The active layer is disposed between the n-type semiconductor layer and the p-type semiconductor layer, wherein a wavelength of a maximum peak of a spectrum emitted by the active layer ranges from 230 nm to 280 nm. The two-dimensional hole gas (2DHG) inducing layer is disposed between the active layer and the p-type semiconductor layer. A concentration of magnesium in the 2DHG inducing layer is less than 1017 atoms/cm3. The electron blocking layer is disposed between the p-type semiconductor layer and the 2DHG inducing layer. A concentration of magnesium in a part of the electron blocking layer adjacent to the 2DHG inducing layer is greater than 1019 atoms/cm3.Type: GrantFiled: August 31, 2020Date of Patent: January 25, 2022Assignees: Industrial Technology Research Institute, OPTO TECH CORP.Inventors: Chia-Lung Tsai, Hsueh-Hsing Liu, Chang Da Tsai
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Patent number: 11206746Abstract: A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body.Type: GrantFiled: June 9, 2020Date of Patent: December 21, 2021Inventor: Chia-Hsing Liu
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Publication number: 20210385972Abstract: A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body.Type: ApplicationFiled: June 9, 2020Publication date: December 9, 2021Inventor: CHIA-HSING LIU
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Publication number: 20210290475Abstract: A walker is provided. The walker includes a walker body, a handle unit, a first wheel unit and a second wheel unit. The handle unit is connected to the walker body. The first wheel unit is connected to the walker body. The second wheel unit is connected to the walker body. In an auxiliary mode, a first gap is formed between the first wheel unit and the second wheel unit. In a driving mode, a second gap is formed between the first wheel unit and the second wheel unit. The first gap is smaller than the second gap.Type: ApplicationFiled: July 21, 2020Publication date: September 23, 2021Inventors: Chen Yi LIANG, Cheng Hsing LIU, Chien-Wei CHEN
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Publication number: 20210154085Abstract: An omnidirectional wheel is provided. The omnidirectional wheel includes a support unit, a major wheel, a first minor wheel and a second minor wheel. The major wheel is annular and is rotatably disposed on the support unit. The first minor wheel is rotatably disposed on the support unit. The first minor wheel is disposed on one side of the major wheel. The second minor wheel is rotatably disposed on the support unit. The second minor wheel is disposed on the other side of the major wheel. The omnidirectional wheel can easily roll over an obstacle when the omnidirectional wheel rolls laterally or forward.Type: ApplicationFiled: April 15, 2020Publication date: May 27, 2021Inventors: Chen Yi LIANG, Cheng Hsing LIU, Chien-Wei CHEN
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Publication number: 20210130645Abstract: The present invention provides a compound comprising EO (ethylene oxide)/PO (propylene oxide) block copolymer which can be used as an emulsifier. The present invention also provides a water-borne epoxy resin composition comprising the compound and a coating composition comprising the water-borne epoxy resin composition. The advantages of the present invention is that the epoxy resin composition or the coating composition, which the compound of the present invention is added to, enhances the compatibility between water and epoxy resin, and enhances the anticorrosive properties of the epoxy resin composition and the coating composition.Type: ApplicationFiled: January 22, 2020Publication date: May 6, 2021Inventors: YING-JUI LIN, LIANG-HSING LIU, YUNG-SHENG LIN, KUO-PIN WU, I-CHIANG LAI, YI-SERN WONG, KUEN-YUAN HWANG