Abstract: A semiconductor structure includes a first device and a second device bonded on the first device. The first device has a first sidewall distal to the second device and a second sidewall proximal to the second device. A surface roughness of the second sidewall is larger than a surface roughness of the first sidewall. The second device has a third sidewall proximal to the first device and a fourth sidewall distal to the first device. A surface roughness of the fourth sidewall is larger than a surface roughness of the third sidewall.

Abstract: A tin (Sn) auto-filling device and system provided to provide new liquid Sn to an inner sidewall surface of a rotation crucible. A laser is exposed to the liquid Sn at the inner sidewall surface of the rotation crucible to generate extreme-ultraviolet-light (EUV) that is utilized to process workpieces within a semiconductor manufacturing plant (FAB). The auto-filling device automatically refills as the liquid Sn at the inner sidewall surface of the rotation crucible is consumed due to the liquid Sn at the inner sidewall surface of the rotation crucible being exposed to the laser.

Abstract: Generally, the present disclosure provides example embodiments relating to a package that may be attached to a printed circuit board (PCB). In an embodiment, a structure includes a package. The package includes one or more dies and metal pads on an exterior surface of the package. At least some of the metal pads are first solder ball pads. The structure further includes pins, and each of the pins is attached to a respective one of the metal pads.

Abstract: A laser produced plasma (LPP)-extreme ultraviolet (EUV) light source includes a vacuum chamber, a rotatable crucible disposed in the vacuum chamber with an annular inner surface for carrying a liquid metal, and a laser arranged to apply laser light to the liquid metal carried on the annular inner surface of the rotatable crucible to cause the liquid metal to emit EUV light. The LPP-EUV light source further includes a stationary component disposed in the vacuum chamber and positioned proximate to the annular inner surface of the rotatable crucible or surrounding the rotatable crucible, a coolant fluid delivery inlet or nozzle, and a cooling element secured with the stationary component and including a feature configured to operatively couple with coolant fluid delivered by the coolant fluid delivery inlet or nozzle.

Abstract: A method includes receiving a first wafer having a first device layer on a first semiconductor substrate, receiving a second wafer having a second device layer on a second semiconductor substrate, forming a first groove along a first scribing channel of the first wafer with a non-mechanical cutting process, and forming a second groove along a second scribing channel of the second wafer with the non-mechanical cutting process. The method further includes after the forming of the first and second grooves, bonding the first and second wafers together, and dicing the bonded first and second wafers through the first and second grooves with a mechanical cutting process.

Abstract: An EUV radiation source apparatus includes an EUV source vessel including a chamber; a crucible disposed in the chamber; a tin layer disposed on the crucible; a catcher disposed in the chamber and configured to collect fuel debris generated from a collision of the tin layer and a laser beam; a heat dissipation structure disposed over the catcher; and a venting system coupled to the EUV source vessel and communicable with the chamber. A method for generating EUV radiation includes: collecting fuel debris on a catcher disposed in a chamber of an EUV source vessel; dissipating heat from the catcher to the chamber; and venting a gas out of the EUV source vessel to cool the chamber to a decreased temperature through an opening disposed on the EUV source vessel.

Abstract: An EUV radiation source apparatus includes an EUV source vessel; a tin layer disposed in the EUV source vessel; a chamber disposed adjacent to the EUV source vessel; and a first filter disposed in the chamber, wherein the first filter includes a membrane and a mesh disposed on the membrane, and the membrane and the mesh are integrally formed. A method for generating EUV radiation includes: forming a first filter including a membrane and a mesh integrally formed with the membrane; disposing the first filter in a chamber adjacent to an EUV source vessel; and collecting fuel debris on the first filter in the chamber.

Abstract: A semiconductor structure includes a first device and a second device bonded on the first device. The first device has a first sidewall distal to the second device and a second sidewall proximal to the second device. A surface roughness of the second sidewall is larger than a surface roughness of the first sidewall.

Abstract: A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.

Abstract: An anti-collision control method and a rail vehicle control system are provided. The rail vehicle control system includes a control apparatus configured to implement the anti-collision control method to prevent a plurality of vehicles on a plurality of rails from colliding with each other. The anti-collision control method includes receiving a transfer requirement data to decide which one of the vehicles and which one of the rails are respectively an assigned vehicle and an assigned rail; planning a movement path and a movement space according to the transfer requirement data and a vehicle dimension data; determining whether any portion of the movement space is reserved; and in response to the movement space being reserved, the assigned vehicle is controlled to not move, or the movement space is reserved and the assigned vehicle is controlled to move according to the movement path along the assigned rail.

Abstract: A photoelectrochemical device includes a substrate, a first titanium nitride (TiN) layer coated on the substrate, and a first nitrogen-doped titanium dioxide (N—TiO2) layer coated on the first TiN layer. The photoelectrochemical device has enhanced photoelectric conversion efficiency and can be made by a simple, effective method, thereby shortening the manufacturing time and lowering the manufacturing cost thereof.

Abstract: To improve EUV emission stability, bumps and eaves are added to the interior wall of a rotating crucible that produces EUV light by vaporizing a pre-heated metal, such as tin, using a laser. The bumps and eaves prevent migration of debris and control liquid metal flow, which is otherwise distributed over time by the centrifugal forces generated as the crucible rotates. The bumps and eaves stabilize EUV emissions by changing turbulent liquid metal flow to a predominately laminar flow. Tin catchers of various designs are available to collect and recycle a significant portion of the debris and unused liquid metal. A closed crucible chamber design alleviates non-uniform heating issues.

Abstract: A semiconductor structure includes a first device and a second device bonded on the first device. The first device has a first sidewall distal to the second device and a second sidewall proximal to the second device. A surface roughness of the second sidewall is larger than a surface roughness of the first sidewall. The second device has a third sidewall proximal to the first device and a fourth sidewall distal to the first device. A surface roughness of the fourth sidewall is larger than a surface roughness of the third sidewall.

Abstract: Generally, the present disclosure provides example embodiments relating to a package that may be attached to a printed circuit board (PCB). In an embodiment, a structure includes a package. The package includes one or more dies and metal pads on an exterior surface of the package. At least some of the metal pads are first solder ball pads. The structure further includes pins, and each of the pins is attached to a respective one of the metal pads.

Abstract: A data transmission system has a master circuit, a slave circuit, and a transmission control circuit. The slave circuit stores a plurality of data in a first format. The master circuit processes data in a second format to perform a corresponding function. The transmission control circuit is coupled to the master circuit and the slave circuit. The transmission control circuit accesses a first datum from the slave circuit according to a first access command of the master circuit, converts the first datum in the first format into a first application datum in the second format, and transmits the first application datum to the master circuit.

Abstract: A rail vehicle system, a rail vehicle, and a visual sensing device are provided. The rail vehicle system includes a system control device, a rail, and a rail vehicle. The rail vehicle includes a processing device and the visual sensing device. In a process where the rail vehicle travels along the rail, the visual sensing device captures images in front of the rail vehicle, and the visual sensing device emits a laser beam toward a front side of the rail vehicle. The visual sensing device receives the reflected laser beam to generate a laser sensing data. The processing device determines whether or not to change at least one of a travel direction and a travel speed of the rail vehicle according to the images captured by the visual sensing device and the laser sensing data.

Abstract: Generally, the present disclosure provides example embodiments relating to a package that may be attached to a printed circuit board (PCB). In an embodiment, a structure includes a package. The package includes one or more dies and metal pads on an exterior surface of the package. At least some of the metal pads are first solder ball pads. The structure further includes pins, and each of the pins is attached to a respective one of the metal pads.

Abstract: A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.

Abstract: The present disclosure provides a method for providing a fatal error of a system-on-chip product and a method for identifying a fatal error of a system-on-chip product. The system-on-chip product includes a processor. The method for providing a fatal error of a system-on-chip product includes: when a fatal error occurs, setting a port value of a preset port of the processor as a preset value corresponding to the fatal error; converting the preset value into register data accessible to an external server, such that the external server can identify the fatal error that occurs in the system-on-chip product according to the preset value when acquiring the register data. Through the present disclosure, even if the system-on-chip product does not support a baseboard management controller, the user of the baseboard can still obtain the reason for the error of the product through an out-of-band method.

Abstract: A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.