Abstract: A data transmission system has a master circuit, a slave circuit, and a transmission control circuit. The slave circuit stores a plurality of data in a first format. The master circuit processes data in a second format to perform a corresponding function. The transmission control circuit is coupled to the master circuit and the slave circuit. The transmission control circuit accesses a first datum from the slave circuit according to a first access command of the master circuit, converts the first datum in the first format into a first application datum in the second format, and transmits the first application datum to the master circuit.

Abstract: The present disclosure provides a method for providing a fatal error of a system-on-chip product and a method for identifying a fatal error of a system-on-chip product. The system-on-chip product includes a processor. The method for providing a fatal error of a system-on-chip product includes: when a fatal error occurs, setting a port value of a preset port of the processor as a preset value corresponding to the fatal error; converting the preset value into register data accessible to an external server, such that the external server can identify the fatal error that occurs in the system-on-chip product according to the preset value when acquiring the register data. Through the present disclosure, even if the system-on-chip product does not support a baseboard management controller, the user of the baseboard can still obtain the reason for the error of the product through an out-of-band method.

Abstract: A semiconductor structure includes a first substrate including a first surface and a second surface opposite to the first surface; a first conductive via extended through the first substrate; a second conductive via extended through the first substrate; and a third conductive via extended through the first substrate, wherein the second conductive via is disposed between the first conductive via and the third conductive via, the second conductive via is configured to connect to a signal source, and the first conductive via and the third conductive via are configured to connect to an electrical ground.

Abstract: A semiconductor structure includes a first device and a second device bonded on the first device. The first device has a first sidewall distal to the second device and a second sidewall proximal to the second device. A surface roughness of the second sidewall is larger than a surface roughness of the first sidewall.

Abstract: An anti-collision control method and a rail vehicle control system are provided. The rail vehicle control system includes a control apparatus configured to implement the anti-collision control method to prevent a plurality of vehicles on a plurality of rails from colliding with each other. The anti-collision control method includes receiving a transfer requirement data to decide which one of the vehicles and which one of the rails are respectively an assigned vehicle and an assigned rail; planning a movement path and a movement space according to the transfer requirement data and a vehicle dimension data; determining whether any portion of the movement space is reserved; and in response to the movement space being reserved, the assigned vehicle is controlled to not move, or the movement space is reserved and the assigned vehicle is controlled to move according to the movement path along the assigned rail.

Abstract: Generally, the present disclosure provides example embodiments relating to a package attached to a printed circuit board (PCB). In an embodiment, a structure includes a PCB. The PCB has ball pads arranged in a matrix. Outer ball pads are along one or more outer edges of the matrix, and each of the outer ball pads has a first solder-attach area. Inner ball pads are interior to the matrix, and each of the inner ball pads has a second solder-attach area. The first solder-attach area is larger than the second solder-attach area.

Abstract: A method includes providing first and second wafers; forming a first device layer in a top portion of the first wafer; forming a second device layer in a top portion of the second wafer; forming a first groove in the first device layer; forming a second groove in the second device layer; bonding the first and second wafers together after at least one of the first and second grooves is formed; and dicing the bonded first and second wafers by a cutting process, wherein the cutting process cuts through the first and second grooves.

Abstract: An underwater motive device includes a rear main housing including two side handle bars, a forward joining member having a decreased diameter, a shoulder between the forward joining member and a remaining portion of the rear main housing, a battery compartment defined in both the forward joining member and the remaining portion of the rear main housing wherein the forward joining member includes an annular front end, an annular front surface between the annular front end and the shoulder, two opposite first rails on a joining portion of the annular front end and the annular front surface, and a first space on the annular front surface and abutting each first rail; and a front cone including a rear opening, an internal, annular surface on a rear portion, and two opposite sets of a second rail and a second space.

Abstract: Generally, the present disclosure provides example embodiments relating to a package that may be attached to a printed circuit board (PCB). In an embodiment, a structure includes a package. The package includes one or more dies and metal pads on an exterior surface of the package. At least some of the metal pads are first solder ball pads. The structure further includes pins, and each of the pins is attached to a respective one of the metal pads.

Abstract: An underwater motive device includes a rear main housing including two opposite handle bar elements on two sides respectively, and longitudinal rear joining projections on an inner surface; a power mechanism in the rear main housing; a propeller driven by a driving shaft of the power mechanism; a bridging housing including a battery compartment, a forward joining member, a shoulder abutted the forward joining member, and a rear joining member; a hollow intermediate housing including two opposite handle bar members on two sides respectively, the handle bar members joined the handle bar elements, longitudinal front joining projections on an inner surface, and an internal annular limit element at a front end; and a front cone including a rear opening and a structure on an inner surface for securing to the forward joining member of the bridging housing.

Abstract: A rail vehicle system, a rail vehicle, and a visual sensing device are provided. The rail vehicle system includes a system control device, a rail, and a rail vehicle. The rail vehicle includes a processing device and the visual sensing device. In a process where the rail vehicle travels along the rail, the visual sensing device captures images in front of the rail vehicle, and the visual sensing device emits a laser beam toward a front side of the rail vehicle. The visual sensing device receives the reflected laser beam to generate a laser sensing data. The processing device determines whether or not to change at least one of a travel direction and a travel speed of the rail vehicle according to the images captured by the visual sensing device and the laser sensing data.

Abstract: A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.

Abstract: Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.

Abstract: A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.

Abstract: Generally, the present disclosure provides example embodiments relating to a package that may be attached to a printed circuit board (PCB). In an embodiment, a structure includes a package. The package includes one or more dies and metal pads on an exterior surface of the package. At least some of the metal pads are first solder ball pads. The structure further includes pins, and each of the pins is attached to a respective one of the metal pads.

Abstract: A method includes providing first and second wafers; forming a first device layer in a top portion of the first wafer; forming a second device layer in a top portion of the second wafer; forming a first groove in the first device layer; forming a second groove in the second device layer; bonding the first and second wafers together after at least one of the first and second grooves is formed; and dicing the bonded first and second wafers by a cutting process, wherein the cutting process cuts through the first and second grooves.

Abstract: A semiconductor structure includes a first substrate including a first surface and a second surface opposite to the first surface; a first conductive via extended through the first substrate; a second conductive via extended through the first substrate; and a third conductive via extended through the first substrate, wherein the second conductive via is disposed between the first conductive via and the third conductive via, the second conductive via is configured to connect to a signal source, and the first conductive via and the third conductive via are configured to connect to an electrical ground.

Abstract: A solar energy absorbing device includes a substrate and a solar selective absorber film. The solar selective absorber film has a bottom surface attached on the substrate, and a top surface opposite to the bottom surface. The solar selective absorber film is a TiNxOy based film, and x and y vary from 1 to 0.1 and 0.2 to 2, respectively, from the bottom surface to the top surface of the solar selective absorber film.

Abstract: Generally, the present disclosure provides example embodiments relating to a package that may be attached to a printed circuit board (PCB). In an embodiment, a structure includes a package. The package includes one or more dies and metal pads on an exterior surface of the package. At least some of the metal pads are first solder ball pads. The structure further includes pins, and each of the pins is attached to a respective one of the metal pads.