Patents by Inventor Hsiu-Wu (Jason) Guo

Hsiu-Wu (Jason) Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230127889
    Abstract: An optical system is provided, including an optical module, a fixed part, a movable part for holding an optical module, and a flexible member. The flexible member movably connects the movable part to the fixed part to suppress the vibration of the optical system at a first frequency.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 27, 2023
    Inventors: Ying-Jen WANG, Yi-Ho CHEN, Ya-Hsiu WU
  • Publication number: 20230132120
    Abstract: An optical element driving mechanism includes a fixed portion, a movable portion, a driving assembly, and a limiting assembly. The movable portion is connected to an optical element with an optical axis, and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The limiting assembly is disposed on the movable portion and is connected with the driving assembly. The driving assembly is limited to move within a movable range relative to the fixed portion by the limiting assembly.
    Type: Application
    Filed: October 21, 2022
    Publication date: April 27, 2023
    Inventors: Yi-Ho CHEN, Ya-Hsiu WU
  • Patent number: 11633820
    Abstract: A fixing jig includes a support plate for supporting a workpiece. A fixing member is arranged on the support plate and defines a receiving groove penetrating a bottom surface of the fixing member. A stopper is slidably received in the receiving groove. A bottom surface of the stopper is flush with the bottom surface of the fixing member and contacts the support plate. An end of the stopper extends out of the receiving groove and abuts against the workpiece. The adjusting member is coupled to the fixing member. One end of the adjusting member extends into the receiving groove and is coupled to the stopper. The adjusting member is used to adjust a position of the stopper. The locking member is arranged on the adjusting member and used to lock a position of the adjusting member, thereby locking the position of the stopper.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 25, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventor: Chia-Hsiu Wu
  • Patent number: 11630282
    Abstract: An optical element driving mechanism includes a fixed portion, a movable portion, a driving assembly, and a circuit assembly. The movable portion is connected to the optical element and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit assembly is connected to the driving assembly. The driving assembly is electrically connected to an external circuit via the circuit assembly.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: April 18, 2023
    Assignee: TDK TAIWAN CORP.
    Inventors: Yi-Ho Chen, Chen-Hsin Huang, Chao-Chang Hu, Chen-Chi Kuo, Ying-Jen Wang, Ya-Hsiu Wu, Sin-Jhong Song, Che-Hsiang Chiu, Kuen-Wang Tsai, Mao-Kuo Hsu, Tun-Ping Hsueh, I-Hung Chen, Chun-Chia Liao, Wei-Zhong Luo, Wen-Chang Lin
  • Patent number: 11626525
    Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: April 11, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chun Yu Ko, Tsu-Hsiu Wu, Meng-Jen Wang
  • Patent number: 11600717
    Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: March 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Shih-Yao Lin, Pei-Hsiu Wu, Chih Ping Wang, Chih-Han Lin, Jr-Jung Lin, Yun Ting Chou, Chen-Yu Wu
  • Patent number: 11579263
    Abstract: Disclosed is a time-of-flight sensing apparatus and method.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: February 14, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin Yin, Meng-Hsiu Wu, Chih-Lin Lee, Calvin Yi-Ping Chao, Shang-Fu Yeh
  • Publication number: 20230037713
    Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Tang CHU, Tsu-Hsiu WU, Chun Yu KO
  • Patent number: 11569422
    Abstract: A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: January 31, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei-Tang Chu, Tsu-Hsiu Wu, Chun Yu Ko
  • Publication number: 20230012620
    Abstract: Disclosed is a tape packing apparatus and method. The tape packing apparatus including: a supporting frame; a drive unit configured to install on the supporting frame; a tape head pressing arm configured to install on the supporting frame and connected to the drive unit, and the drive unit configured to drive the tape head pressing arm to move to a packing position such that the tap head is pressed onto an object to be packed; a cutting module configured to install on the supporting frame and connected with the driving unit, and the driving unit is constructed to drive the cutting module to the packing position to cut the tape. The tape packing apparatus provided by the embodiment of the present invention has good packing effect, can effectively shortens the packing time, has high packing efficiency, and saves manpower and costs.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 19, 2023
    Inventor: MENG HSIU WU
  • Publication number: 20230010081
    Abstract: A semiconductor device includes a semiconductor stack, a third semiconductor structure, a dielectric layer, and a reflective layer under the third semiconductor structure. The semiconductor stack includes a first semiconductor structure, an active structure, a second semiconductor structure. The first semiconductor structure has a first surface which includes a first portion and a second portion, and the first surface has a first area. The third semiconductor structure connects to the first portion, and has a second surface with a second area. The dielectric layer connects to the second portion and includes a plurality of openings, and the plurality of openings have a third area. A ratio of the second area to the first area is between 0.1˜0.7, and a ratio of the third area to the first area is less than 0.2.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 12, 2023
    Inventors: Chun-Yu Lin, Jun-Yi Li, Yi-Yang Chiu, Chun-Wei Chang, Yi-Ming Chen, Chang-Hsiu Wu, Wen-Luh Liao, Chen Ou, Wei-Wun Jheng
  • Publication number: 20220397755
    Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, a driving assembly, and a first supporting assembly. The movable part is used for connecting an optical element. The movable part is movable relative to the fixed part. The driving assembly is used for driving the movable part to move relative to the fixed part. The movable part is movable relative to the fixed part through the support of the first supporting assembly. There is a gap between the movable part and the fixed part.
    Type: Application
    Filed: February 18, 2022
    Publication date: December 15, 2022
    Inventors: Ya-Hsiu WU, Ying-Jen WANG, Yi-Ho CHEN
  • Publication number: 20220397804
    Abstract: A driving mechanism is provided, including a fixed part, a movable part connected to the fixed part, a first connecting member, and a first wire. The first connecting member is hinged to the fixed part and connected to the movable part. The first wire has SMA material and is connected between the fixed part and the first connecting member. When the first wire contracts in length, the first connecting member rotates relative to the fixed part, and the movable part is driven to move relative to the fixed part.
    Type: Application
    Filed: June 9, 2022
    Publication date: December 15, 2022
    Inventors: Ying-Jen WANG, Ya-Hsiu WU, Yi-Ho CHEN, Chao-Chang HU
  • Publication number: 20220308306
    Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, and a driving assembly. The movable part is for connecting an optical element. The movable part is movable relative to the fixed part. The driving assembly is for driving the movable part to move relative to the fixed part. The optical element is used to correspond to an electromagnetic wave.
    Type: Application
    Filed: February 18, 2022
    Publication date: September 29, 2022
    Inventors: Ya-Hsiu WU, Ying-Jen WANG, Yi-Ho CHEN
  • Publication number: 20220283407
    Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, and a driving assembly. The movable part is used for connecting an optical element. The movable part is movable relative to the fixed part. The driving assembly is used for driving the movable part to move relative to the fixed part. The driving assembly is used for driving the movable part to move in a first dimension.
    Type: Application
    Filed: February 18, 2022
    Publication date: September 8, 2022
    Inventors: Ya-Hsiu WU, Yi-Ho CHEN, Ying-Jen WANG
  • Publication number: 20220269030
    Abstract: An optical element driving mechanism, including a movable part, a fixed part, a driving assembly, and a first supporting assembly. The movable part is for connecting an optical element. The movable part is movable relative to the fixed part. The driving assembly is for driving the movable part to move relative to the fixed part. The movable part is movable relative to the fixed part through the support of the first supporting element. The first supporting assembly is at least partially located between the movable part and the fixed part.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 25, 2022
    Inventors: Ya-Hsiu WU, Yi-Ho CHEN, Ying-Jen WANG, Chao-Chang HU
  • Publication number: 20220269034
    Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, a driving assembly, and a first supporting assembly. The movable part is used for connecting an optical element. The movable part is movable relative to the fixed part. The driving assembly is used for driving the movable part to move relative to the fixed part. The movable part is movable relative to the fixed part through the support of the first supporting assembly. The movable part includes a movable part setting surface, and the movable part setting surface corresponds to the optical element.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 25, 2022
    Inventors: Ya-Hsiu WU, Yi-Ho CHEN, Ying-Jen WANG
  • Publication number: 20220248122
    Abstract: A task assigning method of adaptively assigning at least one operation task is applied for a task assigning device including a first electronic device and a second electronic device communicated with each other in a wireless manner. The task assigning method includes acquiring a first detection parameter of the first electronic device, and adjusting a task transmission rate from the first electronic device to the second electronic device in accordance with the first detection parameter.
    Type: Application
    Filed: December 8, 2021
    Publication date: August 4, 2022
    Applicant: MEDIATEK INC.
    Inventors: Liang-Che Sun, Yiou-Wen Cheng, Shang-Hsiu Wu
  • Publication number: 20220241914
    Abstract: A fixing jig includes a support plate for supporting a workpiece. A fixing member is arranged on the support plate and defines a receiving groove penetrating a bottom surface of the fixing member. A stopper is slidably received in the receiving groove. A bottom surface of the stopper is flush with the bottom surface of the fixing member and contacts the support plate. An end of the stopper extends out of the receiving groove and abuts against the workpiece. The adjusting member is coupled to the fixing member. One end of the adjusting member extends into the receiving groove and is coupled to the stopper. The adjusting member is used to adjust a position of the stopper. The locking member is arranged on the adjusting member and used to lock a position of the adjusting member, thereby locking the position of the stopper.
    Type: Application
    Filed: April 26, 2021
    Publication date: August 4, 2022
    Inventor: CHIA-HSIU WU
  • Publication number: 20220197050
    Abstract: A driving mechanism is provided. The driving mechanism includes a fixed portion, a movable portion, a driving assembly, a circuit assembly, and a signal adjusting assembly. The movable portion is movable relative to the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion. The driving assembly is used for receiving a first signal provided by a control assembly. The driving assembly is electrically connected to the control assembly by the circuit assembly. The signal adjusting assembly is electrically connected to the driving assembly. The signal adjusting assembly is used for adjusting the first signal.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 23, 2022
    Inventors: Ya-Hsiu WU, Yi-Ho CHEN, Ying-Jen WANG