Abstract: An optical element driving mechanism is provided, including a fixed part, a movable part, and a driving assembly. The fixed part includes a base, a first wall, and a first fixed wire gripper. The first wall is extending from the base. The first fixed wire gripper is disposed on the first wall. The movable part includes a holder, and a movable wire gripper. The holder holds an optical element. The movable wire gripper is disposed on the holder. The driving assembly drives the movable part to move relative to the fixed part, including a first wire. The first wire is connected to the first fixed wire gripper and the movable wire gripper. When the first wire receives a current, the holder is driven to move relative to the fixed part along a first direction.

Abstract: An apparatus and method for providing a filtering false photon count events for each pixel in a DTOF sensor array are disclosed herein. In some embodiments, the apparatus includes: a light source configured to emit a modulated signal towards the object; a direct time of flight (DTOF) sensor array configured to receive a reflected signal from the object, wherein the DTOF sensor array comprises a plurality of single-photon avalanche diodes (SPADs); and processing circuitry configured to receive photon event detection signals from a center pixel and a plurality of pixels orthogonally and diagonally adjacent to the center pixel and output a valid photon detection signal, in response to determining whether a sum of the received photon event detection signals is greater than a predetermined threshold.

Abstract: An optical mechanism is provided. The optical mechanism includes an immovable part, a movable part, a drive assembly, and a guidance assembly. The movable part is connected to an optical element. The movable part is movable relative to the immovable part. The drive assembly drives the movable part to move relative to the immovable part. The guidance assembly guides the movable part to move along a first axis.

Abstract: A pixel circuit includes: a photodiode capable of generating electrical current according to an incoming light signal; a control circuit coupled to the photodiode for selectively coupling a cathode of the photodiode to a first reference voltage to generate the electrical current according to a first control signal; and an output circuit coupled to the control circuit for selectively coupling a second reference voltage to a connecting terminal between the control circuit and the output circuit and to generate an output signal according to a reset signal and a select signal.

Abstract: A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.

Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

Abstract: An optical system is provided, including a movable part, a fixed part, a first sensor, a second sensor, and a control unit, wherein an optical element is disposed on the movable part. The first and second sensors detect the movement of the movable part relative to the fixed part in a first dimension and a second dimension, and thus they respectively generate a first sensing value and a second sensing value. The control unit generates an error value according to the first sensing value and an error curve, and then calibrates the second sensing value according to the error value.

Abstract: A haptic feedback system is provided, including a sensing unit, a haptic feedback module, and a circuit assembly. The sensing unit is configured to detect contact with an object. The haptic feedback module is configured to transfer the contact force to the sensing unit. The circuit assembly is electrically connected to the sensing unit and the haptic feedback module.

Abstract: A motherboard includes a connector, a multiplexer and a controller. The connector is configured to selectively couple a Redundant Array of Independent Disks (RAID) card. The connector is configured to generate a switching parameter. The multiplexer is coupled to the connector. The multiplexer is configured to detect the switching parameter. The controller is coupled to the multiplexer. The multiplexer either receives a software RAID establishment signal from the controller or it receives a hardware RAID establishment signal from the RAID card, according to the switching parameter.

Abstract: A motherboard includes a connector, a multiplexer and a controller. The connector is configured to selectively couple a Redundant Array of Independent Disks (RAID) card. The connector is configured to generate a switching parameter. The multiplexer is coupled to the connector. The multiplexer is configured to detect the switching parameter. The controller is coupled to the multiplexer. The multiplexer either receives a software RAID establishment signal from the controller or it receives a hardware RAID establishment signal from the RAID card, according to the switching parameter.

Abstract: A method for testing semiconductor devices is disclosed, which includes: obtaining a result measured on a semiconductor device in one of a set of tests; comparing the result with a maximum value determined among respective results that were previously measured in one or more of the set of tests and a minimum value determined among respective results that were previously measured in one or more of the set of tests; determining, based on the comparison between the first result and the maximum and minimum values, whether to update the maximum and minimum values to calculate a delta value; comparing the delta value with a noise threshold value; determining based on the comparison between the delta value and the noise threshold value, whether to update a value of a timer; determining that the value of the timer satisfies a timer threshold; and determining that the semiconductor device incurs noise.

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.

Abstract: An optical sensor package structure and an optical module structure are provided. The optical sensor package structure includes a substrate, a sensor device and a transparent encapsulant. The sensor device is electrically connected to the substrate, and has a sensing area facing the substrate. The transparent encapsulant covers the sensing area of the sensor device.

Abstract: A pixel circuit includes: a photodiode capable of generating electrical current according to an incoming light signal; a control circuit coupled to the photodiode for selectively coupling a cathode of the photodiode to a first reference voltage to generate the electrical current according to a first control signal; and an output circuit coupled to the control circuit for selectively coupling a second reference voltage to a connecting terminal between the control circuit and the output circuit and to generate an output signal according to a reset signal and a select signal.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

Abstract: An electronic apparatus with a touch panel including a host controller, an interface unit, and a touch panel control unit is provided. The host controller is used to control an electronic apparatus implemented with the host controller. The touch panel control unit is coupled to the host controller through the interface unit. The host controller transmits an updating information to the touch panel control unit with a format of the interface unit, in which the updating data is used to update the touch panel control unit. The touch panel control unit decodes the updating data to accordingly update.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism is disposed on an electronic apparatus. The optical element driving mechanism includes a first movable portion, a fixed portion, a first driving assembly, a circuit assembly, and a first position sensing assembly. The first movable portion is used for connecting to a first optical element. The first optical element is used for corresponding to light. The first movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the first movable portion to move relative to the fixed portion. The circuit assembly is used for electrically connected to the electronic apparatus. The first position sensing assembly is used for detecting the movement of the first movable portion relative to the fixed portion.

Abstract: The following steps are executed by a self-propelled device and a calculating device: the self-propelled device moves on a path to form a moving trajectory; the calculating device obtains a sensing data file generated by a sensing module of the self-propelled device on the path; after the sensing data file is imported into a simultaneous localization and mapping algorithm, a map corresponding to the path can be constructed; if the sensing data file is imported into a loop closure algorithm, a pose at each unit time can be obtained, and an optimized trajectory can be formed; when the sensing data file is imported into a cartographer localization algorithm, a reference trajectory can be constructed, and whether the reference trajectory approaches an optimized trajectory is determined; and parameters capable of being imported into the self-propelled device are obtained according to the reference trajectory which approaches the optimized trajectory.

Abstract: An optical system is provided. The optical system includes an immovable part, a second movable part, a second drive mechanism, and a second circuit mechanism. The second movable part is used for connecting to a second optical element. The second movable part is movable relative to the immovable part. The second drive mechanism is used for driving the second movable part to move relative to the immovable part. The second circuit mechanism is electrically connected to the second drive mechanism.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.