Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A device includes a substrate and a plurality of photosensitive regions in the substrate. The substrate has a first side and a second side opposite to the first side. The device further includes an interconnect structure on the first side of the substrate, and a plurality of recesses on the second side of the substrate. The plurality of recesses extend into a semiconductor material of the substrate.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A device includes a substrate and a plurality of photosensitive regions in the substrate. The substrate has a first side and a second side opposite to the first side. The device further includes an interconnect structure on the first side of the substrate, and a plurality of recesses on the second side of the substrate. The plurality of recesses extend into a semiconductor material of the substrate.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: The present embodiment relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: The present embodiment relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: A method for transferring inorganic oxide nanoparticles from aqueous phase to organic phase. A modifier is used to change the surface polarity of inorganic oxide nanoparticles, followed by using proper solvents to transfer the modified inorganic oxide nanoparticles form aqueous phase to organic phase. The organic dispersion of modified inorganic oxide nanoparticles can be combined with a polymer to provide a polymer composite with the nanoparticles uniformly dispersed therein.

Abstract: The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: The invention provides a bio-based material composition and an optical device employing the same. The composition can be a petroleum resin-free composition, including a polylactic acid resin, a filler, and a light diffusion agent. Further, the composition can be a composition with petroleum resin, including a polylactic acid resin, a petroleum resin, a light diffusion agent, and an antioxidant.

Abstract: A reactive organo-modified inorganic particle. Inorganic particles are modified with functional groups through chemical bonding, ionic bonding, hydrogen bond or complex formation. The functional groups of organo-modified inorganic particle can react with monomer or oligomer of biodegradable materials to facilitate crosslinking and functionalization, thus improving physical properties of the inorganic particle-biodegradable hybrid materials.

Abstract: A method for transferring inorganic oxide nanoparticles from aqueous phase to organic phase. A modifier is used to change the surface polarity of inorganic oxide nanoparticles, followed by using proper solvents to transfer the modified inorganic oxide nanoparticles form aqueous phase to organic phase. The organic dispersion of modified inorganic oxide nanoparticles can be combined with a polymer to provide a polymer composite with the nanoparticles uniformly dispersed therein.

Abstract: The present invention relates to a Plasticizer, which is fabricated by mixing monomers of biodegradable polymer with bio-molecules subsequently to deal the mixture with thermal treatment. The Biodegradable material comprising the Plasticizer has high melt index which is contributive for the processing of thermal processing, and the microwave-tolerance and water-resistance of the material makes the material suitable for food packaging.

Abstract: A reactive organo-modified inorganic particle. Inorganic particles are modified with functional groups through chemical bonding, ionic bonding, hydrogen bond or complex formation. The functional groups of organo-modified inorganic particle can react with monomer or oligomer of biodegradable materials to facilitate crosslinking and functionalization, thus improving physical properties of the inorganic particle-biodegradable hybrid materials.