Patents by Inventor Hsu-Shen Shih
Hsu-Shen Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8931407Abstract: A stamp assembly has a bracket, a stamping member, an ink cartridge, a spring, a housing and a pushing device. The stamping member is mounted in the bracket and is capable of being moved in a longitudinal direction relative to the bracket and being rotated. The ink cartridge and the spring are mounted in the bracket. The housing is mounted around the bracket and has a through hole formed through a front side of the housing. The pushing device is mounted on the front side of the housing and has a pushed member. The pushed member is slidably mounted in the through hole and is capable of pushing the ink cartridge out of the bracket. With the pushing device, the stamp assembly is convenient for a user to push and remove the ink cartridge.Type: GrantFiled: June 18, 2013Date of Patent: January 13, 2015Assignee: Sun Same Enterprises Co.,.Ltd.Inventor: Hsu-Shen Shih
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Publication number: 20140196622Abstract: A stamp assembly has a bracket, a stamping member, an ink cartridge, a spring, a housing and a pushing device. The stamping member is mounted in the bracket and is capable of being moved in a longitudinal direction relative to the bracket and being rotated. The ink cartridge and the spring are mounted in the bracket. The housing is mounted around the bracket and has a through hole formed through a front side of the housing. The pushing device is mounted on the front side of the housing and has a pushed member. The pushed member is slidably mounted in the through hole and is capable of pushing the ink cartridge out of the bracket. With the pushing device, the stamp assembly is convenient for a user to push and remove the ink cartridge.Type: ApplicationFiled: June 18, 2013Publication date: July 17, 2014Inventor: HSU-SHEN SHIH
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Patent number: 8701556Abstract: One embodiment of the present invention sets forth a handheld stamp assembly. The handheld stamp assembly includes a stamp mount having a top member with an opening and a bottom member capable of being slid into the top member along a first direction through the opening, wherein the top member and the bottom member form an enclosure when the top member slides into and is secured with the bottom member; and a handle coupled to the stamp mount in a detachable manner along a second direction.Type: GrantFiled: August 28, 2009Date of Patent: April 22, 2014Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Patent number: 8621994Abstract: Embodiments of the disclosure set forth an embosser for a die. The embosser includes a frame, a roller body, and a handle. The frame includes two substantially parallel sides. The roller body includes a roller to be in contact with the die. The embosser further includes a first pin pivotally coupling an end of the handle to the sides of the frame, and a second pin pivotally coupled the handle to a first end of the roller body. The second pin further couples the first end of the roller body to the sides of the frame along a first path. The embosser further includes a third pin coupling a second end of the roller body to the sides of the frame along a second path.Type: GrantFiled: November 24, 2010Date of Patent: January 7, 2014Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Patent number: 8596196Abstract: An adjustment wheel assembly of an adjustable stamp, mounted on an adjustment wheel unit of the adjustable stamp, has a printing type cover combined with a torsion spring and pivotally mounted on the adjustable wheel unit, and a fastener mounted on the adjustment wheel unit. The printing type cover has a tab and a snap part formed on another side of the printing type cover to engage the fastener and disengage the fastener when a pressing part of the fastener is pressed. The torsion spring enables the printing type cover to flip up. The printing type cover is closed and fixed by pressing down the tab formed on an edge portion of the printing type cover. Accordingly, users' fingers can be prevented from being stained upon flipping up and closing the printing type cover.Type: GrantFiled: July 29, 2011Date of Patent: December 3, 2013Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Publication number: 20130025480Abstract: An adjustment wheel assembly of an adjustable stamp, mounted on an adjustment wheel unit of the adjustable stamp, has a printing type cover combined with a torsion spring and pivotally mounted on the adjustable wheel unit, and a fastener mounted on the adjustment wheel unit. The printing type cover has a tab and a snap part formed on another side of the printing type cover to engage the fastener and disengage the fastener when a pressing part of the fastener is pressed. The torsion spring enables the printing type cover to flip up. The printing type cover is closed and fixed by pressing down the tab formed on an edge portion of the printing type cover. Accordingly, users' fingers can be prevented from being stained upon flipping up and closing the printing type cover.Type: ApplicationFiled: July 29, 2011Publication date: January 31, 2013Inventor: Hsu-Shen SHIH
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Patent number: 8230782Abstract: A stamp die assembly for a self-inking stamping device has a die bracket and a replaceable stamp die. The replaceable stamp die is mounted detachably on the die bracket via the engagement between the median tab of the replaceable stamp die and the transverse recess of the die bracket, and via the engagement between the side strips of the replaceable stamp die and the keyed recesses of the die bracket. The die bracket has two elongated keyed protrusions parallel with each other and near two side edges. The replaceable stamp die has two guiding channels engaging with the keyed protrusions. Therefore, the related position of the die bracket and the replaceable stamp die is fixed.Type: GrantFiled: July 22, 2010Date of Patent: July 31, 2012Assignee: Warm Sun Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Publication number: 20120037015Abstract: Embodiments of the disclosure set forth an embosser for a die. The embosser includes a frame, a roller body, and a handle. The frame includes two substantially parallel sides. The roller body includes a roller to be in contact with the die. The embosser further includes a first pin pivotally coupling an end of the handle to the sides of the frame, and a second pin pivotally coupled the handle to a first end of the roller body. The second pin further couples the first end of the roller body to the sides of the frame along a first path. The embosser further includes a third pin coupling a second end of the roller body to the sides of the frame along a second path.Type: ApplicationFiled: November 24, 2010Publication date: February 16, 2012Applicant: SUN SAME ENTERPRISES CO., LTD.Inventor: Hsu-Shen SHIH
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Publication number: 20120017786Abstract: A stamp die assembly for a self-inking stamping device has a die bracket and a replaceable stamp die. The replaceable stamp die is mounted detachably on the die bracket via the engagement between the median tab of the replaceable stamp die and the transverse recess of the die bracket, and via the engagement between the side strips of the replaceable stamp die and the keyed recesses of the die bracket. The die bracket has two elongated keyed protrusions parallel with each other and near two side edges. The replaceable stamp die has two guiding channels engaging with the keyed protrusions. Therefore, the related position of the die bracket and the replaceable stamp die is fixed.Type: ApplicationFiled: July 22, 2010Publication date: January 26, 2012Applicant: SUN SAME ENTERPRISES CO., LTD.Inventor: Hsu-Shen Shih
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Publication number: 20110290131Abstract: A stamp has a frame, a stamp assembly and a skidproof assembly. The stamp assembly is mounted slidably on the frame. The skidproof assembly has four non-slip elements made of rubber and mounted respectively on the corners of the stamp assembly. Therefore, the skidproof assembly of the stamp prevents the stamp from slipping and increases steadiness of the stamp.Type: ApplicationFiled: May 28, 2010Publication date: December 1, 2011Applicant: SUN SAME ENTERPRISES CO., LTD.Inventor: Hsu-Shen SHIH
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Publication number: 20110048258Abstract: One embodiment of the present invention sets forth a handheld stamp assembly. The handheld stamp assembly includes a stamp mount having a top member with an opening and a bottom member capable of being slid into the top member along a first direction through the opening, wherein the top member and the bottom member form an enclosure when the top member slides into and is secured with the bottom member; and a handle coupled to the stamp mount in a detachable manner along a second direction.Type: ApplicationFiled: August 28, 2009Publication date: March 3, 2011Applicant: SUN SAME ENTERPRISES CO., LTD.Inventor: Hsu-Shen SHIH
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Patent number: D607490Type: GrantFiled: August 3, 2009Date of Patent: January 5, 2010Inventor: Hsu-Shen Shih
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Patent number: D610192Type: GrantFiled: April 14, 2009Date of Patent: February 16, 2010Inventor: Hsu-Shen Shih
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Patent number: D621440Type: GrantFiled: July 31, 2009Date of Patent: August 10, 2010Inventor: Hsu-Shen Shih
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Patent number: D626585Type: GrantFiled: August 28, 2009Date of Patent: November 2, 2010Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Patent number: D626586Type: GrantFiled: August 28, 2009Date of Patent: November 2, 2010Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Patent number: D628234Type: GrantFiled: August 28, 2009Date of Patent: November 30, 2010Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Patent number: D630677Type: GrantFiled: September 18, 2010Date of Patent: January 11, 2011Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Patent number: D650412Type: GrantFiled: August 12, 2010Date of Patent: December 13, 2011Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih
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Patent number: D653281Type: GrantFiled: September 16, 2010Date of Patent: January 31, 2012Assignee: Sun Same Enterprises Co., Ltd.Inventor: Hsu-Shen Shih