Stamp mount cover

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top perspective view of the stamp mount cover in accordance with my design.

FIG. 2 is a bottom perspective view thereof.

FIG. 3 is a top elevation view thereof.

FIG. 4 is a right side elevation view thereof.

FIG. 5 is a left side elevation view thereof.

FIG. 6 is a front elevation view thereof.

FIG. 7 is a rear elevation view thereof; and,

FIG. 8 is a bottom elevation view thereof.

The broken lines showing environment structure are for illustrative purposes and form no part of the claimed design.

Claims

The ornamental design for a stamp mount cover, as shown and described.

Referenced Cited
U.S. Patent Documents
3158096 November 1964 Arnold
4996921 March 5, 1991 Hong
D346396 April 26, 1994 Sculler
5647278 July 15, 1997 Wu
5870953 February 16, 1999 Winston
5992319 November 30, 1999 Hsu
D446542 August 14, 2001 Suto
D459386 June 25, 2002 Pichler
D497629 October 26, 2004 Kuhr
7635180 December 22, 2009 Hattori et al.
Patent History
Patent number: D630677
Type: Grant
Filed: Sep 18, 2010
Date of Patent: Jan 11, 2011
Assignee: Sun Same Enterprises Co., Ltd. (Yongkang, Tainan Hsien)
Inventor: Hsu-Shen Shih (Tainan)
Primary Examiner: Charles A Rademaker
Attorney: Su IP Consulting
Application Number: 29/375,204
Classifications
Current U.S. Class: Element Or Attachment (D18/18)