Abstract: A backlight module includes a circuit board, a light-emitting unit, a light-reflecting plate, a light guide plate, and a light-shielding sheet. The light-emitting unit is disposed on the circuit board. The light-reflecting plate is disposed above the circuit board. The light guide plate is disposed above the light-reflecting plate and includes a single-key light guide area. The single-key light guide area includes an accommodating hole and a light-blocking structure. The accommodating hole runs through the single-key light guide area and accommodates the light-emitting unit. The light-blocking structure and the light-emitting unit are arranged in a direction. The light-shielding sheet is disposed above the light guide plate.

Abstract: In a method for manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, first recesses are formed in the first dielectric layer. Metal wirings extending is a first direction are formed in the first recesses. A mask layer is formed over the metal wirings and the first dielectric layer, which includes a first opening extending in the first direction and is located above a space between adjacent two metal wirings. A first groove corresponding to the first opening is formed between the adjacent two metal wirings by etching the first dielectric layer using the mask layer as an etching mask. A second dielectric layer is formed so that a first air gap is formed in the first groove. A width of the first opening in a perpendicular direction to the first direction is smaller than a space between the adjacent two metal wirings.

Abstract: Described herein is a non-aqueous composition including (a) an organic protic solvent, (b) ammonia, and (c) at least one additive of formulae I or II where R1 is H R2 is selected from H, C1 to C10 alkyl, C1 to C10 alkoxy, C6 to C10 aryl, and C6 to C10 aroxy, R3 is selected from R2, R4 is selected from C1 to C10 alkyl, C1 to C10 alkoxy, C6 to C10 aryl, and C6 to C10 aroxy, R10, R12 are independently selected from C1 to C10 alkyl and C1 to C10 alkoxy, m is 1, 2 or 3, and n is 0 or an integer from 1 to 100.

Abstract: A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

Abstract: A backlight module includes a light-shielding sheet, a light guide plate under the light-shielding sheet, a reflective sheet under the light guide plate, a main circuit board under the reflective sheet, a light-emitting unit on the main circuit board, a flexible circuit board under the reflective sheet, and an electrical connector electrically connected to the flexible circuit board and the main circuit board. A protrusion of the reflective sheet protrudes into a through hole of the light guide plate. The light-emitting unit passes through an opening of the reflective sheet to be accommodated in a slot hole of the light guide plate. The light-emitting unit is configured to emit light to reach a light exit area of the light-shielding sheet through the light guide plate. The electrical connector is aligned with the through hole or further protrudes into the through hole.

Abstract: A backlight module adapted to an illuminated keyboard is provided. The backlight module includes a light source assembly, a light guide film, and a reflective sheet. The light guide film has a top surface, a bottom surface, a through hole and a light-exit pattern. The light source assembly includes a light-emitting component configured to emit light toward the through hole. A size of the through hole is smaller than a size of the light-emitting component. The light-exit pattern is on the bottom surface and encloses the through hole. The reflective sheet is located above the through hole. A size of the reflective sheet is larger than or equal to the size of the through hole. A distance from the through hole to an outer edge of the light-exit pattern is greater than a distance from to the through hole to an outer edge of the reflective sheet.

Abstract: A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.

Abstract: An illuminated keyboard comprises a first keycap group, a second keycap group, and a backlight module. Each keycap group includes plural keycaps. The backlight module comprises a first light-emitting unit, a second light-emitting unit, a first resistor, a second resistor, a light guide plate, and a circuit board. The light-emitting elements in the first and second light-emitting units are electrically connected to each other in parallel. The first resistor is electrically connected to the first light-emitting unit in series, and the second resistor is electrically connected to the second light-emitting unit in series. The light guide plate is configured with plural through holes, and the circuit board is disposed under the light guide plate. A first total light-emitting area of the first keycap group is not equal to a second total light-emitting area of the second keycap group.

Abstract: A backlight module includes a light-shielding sheet, a light guide plate under the light-shielding sheet, a reflective sheet under the light guide plate, a main circuit board under the reflective sheet, a light-emitting unit on the main circuit board, a flexible circuit board under the reflective sheet, and an electrical connector electrically connected to the flexible circuit board and the main circuit board. A protrusion of the reflective sheet protrudes into a through hole of the light guide plate. The light-emitting unit passes through an opening of the reflective sheet to be accommodated in a slot hole of the light guide plate. The light-emitting unit is configured to emit light to reach a light exit area of the light-shielding sheet through the light guide plate. The electrical connector is aligned with the through hole or further protrudes into the through hole.

Abstract: A surface monitoring device is for monitoring a contact surface of a detected object. The surface monitoring device and the detected object are disposed on a substrate. The surface monitoring device includes a resonant mechanical part, having a contact tip adjacent to the contact surface by a preset gap in a static state. A driving circuit, applying an AC input signal to drive the resonant mechanical part to cause the contact tip to vibrate with respect to the contact surface at a plurality of sampling frequencies. The contact tip substantially hits the contact surface in a tapping bandwidth within the sampling frequencies. An analysis circuit to analyze a ratio of an output voltage to an input voltage of the input signal and determine the tapping bandwidth, wherein the ratio in the tapping bandwidth is jumping to a flatten phase.

Abstract: The present disclosure discloses a light emitting touchpad device including a circuit board, a plurality of sensing elements, a light guiding plate, a plurality of first spacing blocks, and a plurality of second spacing blocks. The sensing elements are disposed on the circuit board. Each of the first spacing blocks and each of the second spacing blocks are respectively disposed on a bottom surface and a top surface of the light guiding plate, and are all located in a nil-light spot area of the light guiding plate. A spacing distance between two adjacent first spacing blocks is a third length. A spacing distance between two adjacent second spacing blocks is a fifth length. A position of any one of the second spacing blocks corresponds to a position between two of the first spacing blocks.

Abstract: A backlight module is adapted to an illuminated keyboard. The backlight module includes a light source assembly and a light guide film. The light guide film has a top surface, a bottom surface, a through hole, a light-incident pattern and a light-exit pattern. The light source assembly includes a light-emitting component configured to emit light toward the through hole. A size of the through hole is smaller than a size of the light-emitting component. The light-incident pattern is located on at least one of the top surface and the bottom surface. The light-exit pattern is located on the bottom surface. A distance from the through hole to the light-exit pattern is greater than a distance from the through hole to the light-incident pattern.

Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.

Abstract: An illuminated touch panel includes a backlight assembly and a cover plate. The backlight assembly includes a light guide plate, and an outer stop. The light guide plate includes a plurality of bar portions and a connecting portion. The plurality of bar portions are separated from each other and arranged side by side. Each of the bar portions includes a pattern dot region, a connecting end and a light entrance end. There is a narrow slot between any two adjacent bar portions. The long axis direction of each of the extending dot regions of the connecting portion is substantially parallel to the length direction of each of the narrow slots. The plurality of light blocking bars of the outer stop are arranged side by side and fitted with the plurality of narrow slots. The cover plate includes a plurality of window regions corresponding to the plurality of pattern dot regions.

Abstract: A semiconductor device includes a first interlayer dielectric layer disposed over a substrate, metal wirings, a second interlayer dielectric layer disposed over the first interlayer dielectric layer and the metal wirings, a first air gap and a second air gap. The metal wirings are embedded in the first interlayer dielectric layer, and arranged with a first space or a second space between the metal wirings. The second space has a greater length than the first space. The first air gap is formed by the second interlayer dielectric layer and formed in a first area sandwiched by adjacent two metal wirings arranged with the first space. The second air gap is formed by the second interlayer dielectric layer and formed in a second area sandwiched by adjacent two metal wirings arranged with the second space therebetween. No adjacent two metal wirings are arranged with a space smaller than the first space.

Abstract: The present disclosure discloses a light emitting touch pad device including a circuit board, a plurality of sensing elements, a light guiding plate, a light emitting component, and a plurality of first spacing blocks. The sensing elements are disposed on the circuit board, and a distance between geometric centers of two adjacent sensing elements is a first length. The light guiding plate is disposed above the circuit board, and includes at least one light spot area and at least one nil-light spot area. The light emitting component emits light toward the light guiding plate. The first spacing blocks are disposed on the light guiding plate, and are located in the nil-light spot area. A distance between geometric centers of two adjacent first spacing blocks is a second length, and a spacing distance between two adjacent first spacing blocks is a third length.

Abstract: A multilayer opto-electronic module includes a circuit board, a first light-emitting assembly, a second light-emitting assembly and a contact sheet. The first light-emitting assembly includes a first light guide sheet, a first light-shielding structure, and a first light-emitting element assembly. The second light-emitting assembly includes a second light guide sheet, a second light-shielding structure, and a second light-emitting element assembly. The second light-shielding structure has a second opening. The second opening corresponds to a first micro structure and a second micro structure. The contact sheet is above the second light-shielding structure. The contact sheet has a top transparent area. The top transparent area corresponds to the second opening.

Abstract: An illuminated module includes a light source assembly, a light guide plate, a filter, and a light-shielding sheet. The light source assembly includes a light-emitting component, the light-emitting component being configured to emit light. The light guide plate is on a traveling route of the light, and has a surface and a microstructure. The filter is located on the surface, and has a first area and a second area, the first area and the second area corresponding to the microstructure, where the first area has a first filter characteristic, the second area has a second filter characteristic, and the first filter characteristic is different from the second filter characteristic. The light-shielding sheet is located on the other side of the light guide plate opposite to the filter, and has a transparent opening corresponding to the microstructure. In addition, an illuminated keyboard is provided.

Abstract: A light emitting module including a circuit carrier and a plurality of light emitting devices is provided. The circuit carrier includes a first circuit layer, a second circuit layer, a dielectric layer and a plurality of conductive vias. The first circuit layer and the second circuit layer are located at two opposite sides of the dielectric layer. The conductive vias pass through the dielectric layer and two opposite end portions of each of the conductive vias are respectively connected to the first circuit layer and the second circuit layer. The light emitting devices are electrically bonded to the first circuit layer. Moreover, the light emitting devices are disposed in a device disposing area of the circuit carrier and the conductive vias are arranged outside the device disposing area. A display device is also provided.

Abstract: An opto-electronic module includes a circuit board, a light-emitting assembly, a contact sheet, a light shielding structure, and an outer block. The circuit board has a surface and a groove on the surface. The light-emitting assembly includes a light guide plate and a light-emitting element set. The contact sheet is above the light guide plate. The light shielding structure is above the light guide plate or below the contact sheet. The light shielding structure has an opening. The opening corresponds to a microstructure. The outer block is at an outer periphery of the light guide plate, there is a gap between the outer block and the light guide plate, and the outer block is between the contact sheet and the circuit board. One end of the groove is in communication with the gap, and the other end of the groove is in communication with the environment outside the opto-electronic module.