Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

Abstract: The present disclosure discloses a light emitting touch pad device including a circuit board, a plurality of sensing elements, a light guiding plate, a light emitting component, and a plurality of first spacing blocks. The sensing elements are disposed on the circuit board, and a distance between geometric centers of two adjacent sensing elements is a first length. The light guiding plate is disposed above the circuit board, and includes at least one light spot area and at least one nil-light spot area. The light emitting component emits light toward the light guiding plate. The first spacing blocks are disposed on the light guiding plate, and are located in the nil-light spot area. A distance between geometric centers of two adjacent first spacing blocks is a second length, and a spacing distance between two adjacent first spacing blocks is a third length.

Abstract: The present disclosure discloses a light emitting touchpad device including a circuit board, a plurality of sensing elements, a light guiding plate, a plurality of first spacing blocks, and a plurality of second spacing blocks. The sensing elements are disposed on the circuit board. Each of the first spacing blocks and each of the second spacing blocks are respectively disposed on a bottom surface and a top surface of the light guiding plate, and are all located in a nil-light spot area of the light guiding plate. A spacing distance between two adjacent first spacing blocks is a third length. A spacing distance between two adjacent second spacing blocks is a fifth length. A position of any one of the second spacing blocks corresponds to a position between two of the first spacing blocks.

Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.

Abstract: A method for manufacturing a wavelength converting film is provided. A release film is provided. At a least one coating process is performed to form at least one wavelength converting layer on the release film, wherein a first contact surface of the at least one wavelength converting layer and the release film has a first roughness. An adhesive layer is formed on a surface of the wavelength converting layer farthest from the release film, wherein a second contact surface of the adhesive layer and the wavelength converting layer has a second roughness. The second roughness is greater than the first roughness.

Abstract: A backlight module includes a light blocking plate, a light guiding plate, a reflector, a circuit board, a flexible circuit board and a conductive connection element. The light blocking plate is disposed below a keyboard component and includes an emission zone. The light guiding plate is disposed below the light blocking plate and includes a hollowed-out portion. The reflector is disposed below the light guiding plate and includes a through hole. The through hole corresponds in position to the hollowed-out portion. The circuit board is disposed below the reflector. A light-emitting component is disposed on the circuit board. The flexible circuit board is disposed below the reflector which separates the flexible circuit board and the light guiding plate. The conductive connection element is disposed on the circuit board, penetratingly disposed at the hollowed-out portion and the through hole, and connected to the circuit board and the flexible circuit board.

Abstract: A lighting bulb according to embodiments of the disclosure comprises a light source assembly, a base and a transparent top cap. The light source assembly has a carrier plate, a first plurality of light-emitting units and a second plurality of light-emitting units. The carrier plate has first and second surfaces. The base is for fixing the carrier plate to have the first surface facing to a first direction and the second surface facing to a second direction opposite to the first direction. The transparent top cap has an inner surface facing to a third direction perpendicular to the first and second directions. The first and second plurality of light-emitting units are located between the transparent top cap and the base.

Abstract: An anti-glare display system is provided, including: at least one camera unit disposed on a moving device, at least disposed on a rear side of the moving device, and photographing a major image in a direction opposite to a moving direction; a processing unit electrically connected to the at least one camera unit to receive the major image and dividing the major image to obtain at least one sub-image; at least one display unit comprising an electrochromic element and electrically connected to the processing unit to receive and display the sub-image from the processing unit; and a microcontroller electrically connected to the processing unit and the at least one display unit.

Abstract: A panoramic image system includes at least two camera modules, at least two display elements, and an image processor. Each of the camera modules takes a rear field of view or side field of view to obtain a view image. Each of the display elements displays each of the view images, and each of the view images is configured to have an overlapping region. The image processor receives each of the view images and pieces each of the view images into a panoramic image according to each of the overlapping regions. Each of the display elements selectively displays the panoramic image partially or displays the panoramic image entirely according to a region of interest by a user's observation. The panoramic image system may be applied to a vehicle-monitoring system to assist the driver in viewing the traffic conditions behind the vehicle.

Abstract: The present disclosure discloses an illuminating keyboard including a keyboard module and a light emitting module. The keyboard module has an opaque region. The light emitting module includes a light guiding plate, a first light emitting component and a second light emitting component. The light guiding plate includes an accommodating groove corresponding to the opaque region. The accommodating groove has a first sidewall, a second sidewall, a first light divergence segment and a second light divergence segment. The first light divergence segment and the second light divergence segment are disposed on the first sidewall and the second sidewall, respectively. The first light emitting component and the second light emitting component are located in the accommodating groove and are disposed toward the first sidewall and the second sidewall, respectively. The light beams are injected into the light guiding plate via the first and the second light divergence segment.

Abstract: A semiconductor device includes a first interlayer dielectric layer disposed over a substrate, metal wirings, a second interlayer dielectric layer disposed over the first interlayer dielectric layer and the metal wirings, a first air gap and a second air gap. The metal wirings are embedded in the first interlayer dielectric layer, and arranged with a first space or a second space between the metal wirings. The second space has a greater length than the first space. The first air gap is formed by the second interlayer dielectric layer and formed in a first area sandwiched by adjacent two metal wirings arranged with the first space. The second air gap is formed by the second interlayer dielectric layer and formed in a second area sandwiched by adjacent two metal wirings arranged with the second space therebetween. No adjacent two metal wirings are arranged with a space smaller than the first space.

Abstract: A semiconductor device includes a first interlayer dielectric layer disposed over a substrate, metal wirings, a second interlayer dielectric layer disposed over the first interlayer dielectric layer and the metal wirings, a first air gap and a second air gap. The metal wirings are embedded in the first interlayer dielectric layer, and arranged with a first space or a second space between the metal wirings. The second space has a greater length than the first space. The first air gap is formed by the second interlayer dielectric layer and formed in a first area sandwiched by adjacent two metal wirings arranged with the first space. The second air gap is formed by the second interlayer dielectric layer and formed in a second area sandwiched by adjacent two metal wirings arranged with the second space therebetween. No adjacent two metal wirings are arranged with a space smaller than the first space.

Abstract: In a method for manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, first recesses are formed in the first dielectric layer. Metal wirings extending is a first direction are formed in the first recesses. A mask layer is formed over the metal wirings and the first dielectric layer, which includes a first opening extending in the first direction and is located above a space between adjacent two metal wirings. A first groove corresponding to the first opening is formed between the adjacent two metal wirings by etching the first dielectric layer using the mask layer as an etching mask. A second dielectric layer is formed so that a first air gap is formed in the first groove. A width of the first opening in a perpendicular direction to the first direction is smaller than a space between the adjacent two metal wirings.

Abstract: A method for creating partial screenshot includes displaying a screen frame on touch surface of a display unit, sensing a multi-touch gesture on the touch surface, acquiring a plurality of pixels on the screen frame according to a plurality of coordinate positions of the multi-touch gesture, defining a captured region according to the pixels, and creating a partial screenshot according to the screen frame and the captured region.

Abstract: A compound, a composition employing the same and a polymer prepared therefrom are provided. The compound has a structure represented by Formula (I): wherein A is B is R1 is C1-10 alkyl, C5-12 cycloalkyl, C6-14 aryl, C3-12 heteroaryl, alkoxy, C6-12 aryloxy, silyl, amino, thiol, or phosphonate group; R2 is H, or C1-10 alkyl; and, R3 is C1-10 alkoxy, C1-10 alkanol, amine, or hydroxy.

Abstract: A light emitting module including a circuit carrier and a plurality of light emitting devices is provided. The circuit carrier includes a first circuit layer, a second circuit layer, a dielectric layer and a plurality of conductive vias. The first circuit layer and the second circuit layer are located at two opposite sides of the dielectric layer. The conductive vias pass through the dielectric layer and two opposite end portions of each of the conductive vias are respectively connected to the first circuit layer and the second circuit layer. The light emitting devices are electrically bonded to the first circuit layer. Moreover, the light emitting devices are disposed in a device disposing area of the circuit carrier and the conductive vias are arranged outside the device disposing area. A display device is also provided.

Abstract: In a method for manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, first recesses are formed in the first dielectric layer. Metal wirings extending is a first direction are formed in the first recesses. A mask layer is formed over the metal wirings and the first dielectric layer, which includes a first opening extending in the first direction and is located above a space between adjacent two metal wirings. A first groove corresponding to the first opening is formed between the adjacent two metal wirings by etching the first dielectric layer using the mask layer as an etching mask. A second dielectric layer is formed so that a first air gap is formed in the first groove. A width of the first opening in a perpendicular direction to the first direction is smaller than a space between the adjacent two metal wirings.

Abstract: A lighting bulb according to embodiments of the disclosure comprises a light source assembly, a base and a transparent top cap. The light source assembly has a carrier plate, a first plurality of light-emitting units and a second plurality of light-emitting units. The carrier plate has first and second surfaces. The base is for fixing the carrier plate to have the first surface facing to a first direction and the second surface facing to a second direction opposite to the first direction. The transparent top cap has an inner surface facing to a third direction perpendicular to the first and second directions. The first and second plurality of light-emitting units are located between the transparent top cap and the base.

Abstract: An encrypting method of a security short message includes performing a first encryption computation according to a short message content and a deadline code to generate a verification code, performing a second encryption computation according to the short message content, deadline code and verification code to generate an encrypting field, and combining a non-encrypting field and the encrypting field to create the security short message.

Abstract: A semiconductor device includes a first interlayer dielectric layer disposed over a substrate, metal wirings, a second interlayer dielectric layer disposed over the first interlayer dielectric layer and the metal wirings, a first air gap and a second air gap. The metal wirings are embedded in the first interlayer dielectric layer, and arranged with a first space or a second space between the metal wirings. The second space has a greater length than the first space. The first air gap is formed by the second interlayer dielectric layer and formed in a first area sandwiched by adjacent two metal wirings arranged with the first space. The second air gap is formed by the second interlayer dielectric layer and formed in a second area sandwiched by adjacent two metal wirings arranged with the second space therebetween. No adjacent two metal wirings are arranged with a space smaller than the first space.