Abstract: An LDMOS transistor with a dummy gate comprises an extended drift region over a substrate, a drain region in the extended drift region, a channel region in the extended drift region, a source region in the channel region, a first dielectric layer with a first thickness formed over the extended drift region, a second dielectric layer with a second thickness formed over the extended drift region and the channel region, wherein the first thickness is greater than the second thickness, and wherein the first dielectric layer and the second dielectric layer form two steps, a first gate formed over the first dielectric layer and a second gate formed above the second dielectric layer.

Abstract: A device includes a vertical transistor comprising a first gate in a first trench, wherein the first gate comprises a dielectric layer and a gate region over the dielectric layer, and a second gate in a second trench, a high voltage lateral transistor immediately adjacent to the vertical transistor and a low voltage lateral transistor, wherein the high voltage lateral transistor is between the vertical transistor and the low voltage lateral transistor.

Abstract: A device includes a vertical transistor and a lateral transistor on a substrate, wherein the vertical transistor comprises a first gate in a first trench, a second gate in a second trench, a source and a drain, wherein the source and the drain are on opposite sides of the first trench and the lateral transistor and the drain are on opposite sides of the second trench.

Abstract: A method includes forming a first semiconductor layer over a substrate, forming a second semiconductor layer over the first semiconductor layer, forming a first trench and a second trench through in the first semiconductor layer and the second semiconductor layer, wherein a width of the second trench is different from a width of the first trench, forming a dielectric region in the first trench and forming a first gate region in the first trench and over the dielectric region, and a second gate region in the second trench.

Abstract: A device includes a semiconductor region of a first conductivity type, a trench extending into the semiconductor region, and a conductive field plate in the trench. A first dielectric layer separates a bottom and sidewalls of the field plate from the semiconductor region. A main gate is disposed in the trench and overlapping the field plate. A second dielectric layer is disposed between and separating the main gate and the field plate from each other. A Doped Drain (DD) region of the first conductivity type is under the second dielectric layer, wherein an edge portion of the main gate overlaps the DD region. A body region includes a first portion at a same level as a portion of the main gate, and a second portion at a same level as, and contacting, the DD region, wherein the body region is of a second conductivity type opposite the first conductivity type.

Abstract: The present disclosure provides a photodiode device, which includes a semiconductor substrate, a well region in the semiconductor substrate of a first dopant type, a first doped region of the first dopant type in the well region, and a second doped region of a second dopant type disposed in the well region and over the first doped region. The second doped region comprises first recesses exposed through a surface of the second doped region, and a first portion of the second doped region on the surface comprises a first doping concentration of the second dopant type greater than a second doping concentration of a second portion of the second doped region away from the first recesses.

Abstract: A device includes a semiconductor region in a semiconductor chip, a gate dielectric layer over the semiconductor region, and a gate electrode over the gate dielectric. A drain region is disposed at a top surface of the semiconductor region and adjacent to the gate electrode. A gate spacer is on a sidewall of the gate electrode. A dielectric layer is disposed over the gate electrode and the gate spacer. A conductive field plate is over the dielectric layer, wherein the conductive field plate has a portion on a drain side of the gate electrode. A conductive via is disposed in the semiconductor region. A source electrode is underlying the semiconductor region, wherein the source electrode is electrically shorted to the conductive field plate through the conductive via.

Abstract: A method comprises forming a buried layer over a substrate, forming an epitaxial layer over the buried layer, forming a first trench and a second trench in the buried layer and the epitaxial layer, wherein a width of the second trench is greater than a width of the first trench, depositing a dielectric layer in the first trench and the second trench, wherein the dielectric layer partially fills the second trench, removing the dielectric layer in the second trench and forming a first gate region in the first trench and a second gate region in the second trench.

Abstract: The present disclosure provides a photodiode device, which includes a semiconductor substrate, a well region in the semiconductor substrate of a first dopant type, a first doped region of the first dopant type in the well region, and a second doped region of a second dopant type disposed in the well region and over the first doped region. The second doped region comprises first recesses exposed through a surface of the second doped region, and a first portion of the second doped region on the surface comprises a first doping concentration of the second dopant type greater than a second doping concentration of a second portion of the second doped region away from the first recesses.

Abstract: A device includes a semiconductor layer of a first conductivity type, and a first and a second body region over the semiconductor layer, wherein the first and the second body regions are of a second conductivity type opposite the first conductivity type. A doped semiconductor region of the first conductivity type is disposed between and contacting the first and the second body regions. A gate dielectric layer is disposed over the first and the second body regions and the doped semiconductor region. A first and a second gate electrode are disposed over the gate dielectric layer, and overlapping the first and the second body regions, respectively. The first and the second gate electrodes are physically separated from each other by a region, and are electrically interconnected. The region between the first and the second gate electrodes overlaps the doped semiconductor region.

Abstract: A device includes a semiconductor region of a first conductivity type, a trench extending into the semiconductor region, and a conductive field plate in the trench. A first dielectric layer separates a bottom and sidewalls of the field plate from the semiconductor region. A main gate is disposed in the trench and overlapping the field plate. A second dielectric layer is disposed between and separating the main gate and the field plate from each other. A Doped Drain (DD) region of the first conductivity type is under the second dielectric layer, wherein an edge portion of the main gate overlaps the DD region. A body region includes a first portion at a same level as a portion of the main gate, and a second portion at a same level as, and contacting, the DD region, wherein the body region is of a second conductivity type opposite the first conductivity type.

Abstract: A semiconductor device includes a substrate, a buried doped layer, a first doped well, a multiplication region and a first contact doped region. The substrate has a first doping type, wherein the substrate includes a surface. The buried doped layer is in the substrate and exposed from the surface of the substrate, wherein the buried doped layer has a second doping type opposite to the first doping type. The first doped well is over the buried doped layer, wherein the first doped well has the first doping type. The multiplication region is proximal to an interface between the buried doped layer and the first doped well. The first contact doped region is over the first doped well, wherein the first contact doped region has the first doping type and a doped concentration higher than a doped concentration of the first doped well.

Abstract: A semiconductor device includes a substrate, a buried doped layer, a first doped well, a multiplication region and a first contact doped region. The substrate has a first doping type, wherein the substrate includes a surface. The buried doped layer is in the substrate and exposed from the surface of the substrate, wherein the buried doped layer has a second doping type opposite to the first doping type. The first doped well is over the buried doped layer, wherein the first doped well has the first doping type. The multiplication region is proximal to an interface between the buried doped layer and the first doped well. The first contact doped region is over the first doped well, wherein the first contact doped region has the first doping type and a doped concentration higher than a doped concentration of the first doped well.

Abstract: An integrated circuit device includes a pad layer having a body portion with a first doping type laterally adjacent to a drift region portion with a second doping type, a trench formed in the pad layer, the trench extending through an interface of the body portion and the drift region portion, a gate formed in the trench and over a top surface of the pad layer along the interface of the body portion and the drift region portion, an oxide formed in the trench on opposing sides of the gate, and a field plate embedded in the oxide on each of the opposing sides of the gate.

Abstract: Present disclosure provides a transistor structure, including a substrate, a first gate over the substrate, a second gate over the substrate and laterally in contact with the first gate, a first conductive region of a first conductivity type in the substrate, self-aligning to a side of the first gate, and a second conductive region of the first conductivity type in the substrate, self-aligning to a side of the second gate. A method for manufacturing the transistor structure is also disclosed.

Abstract: A method comprises providing a substrate with a second conductivity type, growing a first epitaxial layer having the second conductivity type, growing a second epitaxial layer having a first conductivity type, forming a trench in the first epitaxial layer and the second epitaxial layer, forming a gate electrode in the trench, applying an ion implantation process using first gate electrode as an ion implantation mask to form a drain-drift region, forming a field plate in the trench, forming a drain region in the second epitaxial layer, wherein the drain region has the first conductivity type and forming a source region in the first epitaxial layer, wherein the source region has the first conductivity type, and wherein the source region is electrically coupled to the field plate.

Abstract: The present disclosure, in some embodiments, relates to a transistor device having a field plate. The transistor device has a gate electrode disposed over a substrate between a source region and a drain region. One or more dielectric layers are arranged over the gate electrode, and a field plate is arranged over the one or more dielectric layers. The field plate extends from a first outermost sidewall that is directly over an upper surface of the gate electrode to a second outermost sidewall that is between the gate electrode and the drain region and that extends to below the upper surface of the gate electrode.

Abstract: A device includes a semiconductor region in a semiconductor chip, a gate dielectric layer over the semiconductor region, and a gate electrode over the gate dielectric. A drain region is disposed at a top surface of the semiconductor region and adjacent to the gate electrode. A gate spacer is on a sidewall of the gate electrode. A dielectric layer is disposed over the gate electrode and the gate spacer. A conductive field plate is over the dielectric layer, wherein the conductive field plate has a portion on a drain side of the gate electrode. A conductive via is disposed in the semiconductor region. A source electrode is underlying the semiconductor region, wherein the source electrode is electrically shorted to the conductive field plate through the conductive via.

Abstract: A device includes a vertical transistor and a lateral transistor on a substrate, wherein the vertical transistor comprises a first gate in a first trench, a second gate in a second trench, a source and a drain, wherein the source and the drain are on opposite sides of the first trench and the lateral transistor and the drain are on opposite sides of the second trench.

Abstract: An LDMOS transistor with a dummy gate comprises an extended drift region over a substrate, a drain region in the extended drift region, a channel region in the extended drift region, a source region in the channel region, a first dielectric layer with a first thickness formed over the extended drift region, a second dielectric layer with a second thickness formed over the extended drift region and the channel region, wherein the first thickness is greater than the second thickness, and wherein the first dielectric layer and the second dielectric layer form two steps, a first gate formed over the first dielectric layer and a second gate formed above the second dielectric layer.