Abstract: A material supply device for diffusion furnaces includes a main body, a fixing pedestal mechanism, a transmission mechanism and a cover mechanism for a furnace door. The main body includes a base portion and a main rod. The base portion is mounted on the main rod and the main rod extends through the base portion. The fixing pedestal mechanism is mounted on the main rod and is pivotedly mounted on a fixing pedestal. The transmission mechanism is mounted on the base portion and has a transmission rod slidably mounted on the base portion. The cover mechanism for a furnace door is fixed on an end of the transmission rod which is far away from the main body and is turnablely mounted on a cover of the furnace door. Based on the above assemblies, the present invention runs smoothly and improves production quality.

Abstract: An adhesive tape adhering device includes a table unit, a wafer bearing unit, an adhesive tape pull-tight unit, an adhesive tape clipping unit, and a rolling unit. The wafer bearing unit movably disposes on the table unit upwardly and downwardly for bearing a wafer. The adhesive tape pull-tight unit has a bundle of adhesive tape, and the adhesive tape pull-tight unit disposes on the table unit and next to one side of the wafer bearing unit. The adhesive tape clipping unit disposes on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape.

Abstract: A non-contact laser carving process and the equipment. By the orientation of an orienting module, the center of a wafer can be amended and oriented to the orienting module precisely. By the rotation of the orienting module and an optical sensor of a transmission mechanical module, the center of the wafer can be obtained precisely. By the compensation of the optical sensor, a specific boundary position is oriented. No matter what the external diameter of the wafer is, the specific boundary position in the wafer can be carved by laser precisely through the transmission mechanical module cooperated with a laser-carving unit, and a specific number can be carved at the specific boundary position of each wafer. Therefore, the wafer can be efficiently traced and controlled, and the amount of the wafer can be figured out easily to raise the quality of the wafer.

Abstract: A material supply device for diffusion furnaces includes a main body, a fixing pedestal mechanism, a transmission mechanism and a cover mechanism for a furnace door. The main body includes a base portion and a main rod. The base portion is mounted on the main rod and the main rod extends through the base portion. The fixing pedestal mechanism is mounted on the main rod and is pivotedly mounted on a fixing pedestal. The transmission mechanism is mounted on the base portion and has a transmission rod slidably mounted on the base portion. The cover mechanism for a furnace door is fixed on an end of the transmission rod which is far away from the main body and is turnablely mounted on a cover of the furnace door. Based on the above assemblies, the present invention runs smoothly and improves production quality.

Abstract: An inner lining structure for a photoresistant collecting device includes a body, a receiving groove and a through-hole. A periphery of the body is a circular arced surface. A receiving groove is formed by concaving a top of the body downwards and the upper end is shaped like an opening. A through-hole is arranged in a center of the body and penetrates a bottom surface of the receiving groove and a bottom of the body. Based on the above assembly, the present invention engages with a sucking plate of a photoresistant coater and ensures that photoresistant filaments cannot adhere to the bottom of a wafer when the wafer is operated at a high speed.