Adhesive tape adhering device for wafers and method of adhering adhesive tape on wafers

Abstract

An adhesive tape adhering device includes a table unit, a wafer bearing unit, an adhesive tape pull-tight unit, an adhesive tape clipping unit, and a rolling unit. The wafer bearing unit movably disposes on the table unit upwardly and downwardly for bearing a wafer. The adhesive tape pull-tight unit has a bundle of adhesive tape, and the adhesive tape pull-tight unit disposes on the table unit and next to one side of the wafer bearing unit. The adhesive tape clipping unit disposes on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape. The rolling unit slidably disposes on the table unit and next to the other side of the wafer bearing unit for uniformly rolling, pressing and adhering the adhesive tape on the at least one wafer

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an adhesive tape adhering device and a method of adhering adhesive tape, and particularly relates to an adhesive tape adhering device for wafers and a method of adhering adhesive tape on wafers.

2. Description of the Related Art

Referring to FIG. 1 and FIGS. 1A to 1G, a known manual method of adhering adhesive tape on wafers is disclosed. The method includes the following steps: referring to FIG. 1A, pulling out a tape 10a with a predetermined length from a bundle of adhesive tape 1a and adhering the tape 10a on a table surface 2a (S100); referring to FIG. 1B, cutting the tape 10a into two tapes 100a of small size (S102); and referring to FIG. 1C, tearing open one of the two tapes 100a of small size and putting two pieces of wafers 3a between the tape 100a of small size and table surface 2a (S104).

Moreover, the method further includes: referring to FIG. 1D, rolling and pressing the tape 100a of small size with a rolling device 4a (a first rolling step) for the tape 100a of small size adhered on the two pieces of wafers 3a (S106); referring to 1E, rolling and pressing the tape 100a of small size with the rolling device 4a again (a second rolling step) for the tape 100a of small size tightly adhered on the two pieces of wafers 3a (SI 08); referring to FIG. 1F, cutting the tape 100a of small size along two peripheries of the two wafers 3a (S110); and finally, referring to FIG. G, taking two pieces of wafers 1000a with tape out (S112) for finishing the adhesive tape adhering process.

However, the known method includes some defects as follows:

1. In the step of S100: Before adhering the tape 100a of small size on the two pieces of wafers 3a, the tape 100a of small size is adhered on the table surface 2a first. Hence, a viscoid face of the tape 10a will be contaminated easily by powder or dust in the proximity of the table surface 2a.

2. In the step of S102 and S110: The table surface 2a is slashed during the step of cutting the tape 10a into two tapes 100a of small size on the table surface 2a, so that the table surface 2a is not smooth. Hence, when using the table surface 2a again, cracks will be generated on the wafers 3a during the adhesive tape adhering process due to the uneven area of the table surface 2a.

3. In the step of S104: Because the two pieces of wafer 3a are placed on the table surface 2a, the backs of the two wafer 3a will be rubbed by the table surface 2a. Hence, the backs of the two wafer 3a will be damaged.

4. In the step of S106 (a first rolling step): when rolling and pressing the tape 100a of small size on the two pieces of wafers 3a with the rolling device 4a, a plurality of air bubbles are formed between the tape 100a of small size and the two pieces of wafers 3a due to the unbalanced tension of the tape 100a of small size (the tape 100a of small size is pulled disproportionally).

5. In the step of S108 (a second rolling step): Because the step of rolling and pressing is performed manually, the force of rolling and pressing acting on the tape 100a of small size is not uniform. Hence, the wafers 3a cracks will be generated easily.

Hence, there are many defects in the prior art due to surrounding conditions (such as the table surface and the operator's technique and force, etc.).

SUMMARY OF THE INVENTION

One particular aspect of the present invention is to provide an adhesive tape adhering device for wafers and a method of adhering adhesive tape on wafers. The present invention solves all defects of the known method in the prior art, and ensures and controls the quality of the adhesive tape adhering process.

In order to achieve the above-mentioned aspects, the present invention provides an adhesive tape adhering device for wafers, including: a table unit, a wafer bearing unit, an adhesive tape pull-tight unit, an adhesive tape clipping unit, and a rolling unit. The wafer bearing unit is upward and downward movably disposed on the table unit for bearing at least one wafer. The adhesive tape pull-tight unit has a bundle of adhesive tape, and the adhesive tape pull-tight unit is disposed on the table unit and next to one side of the wafer bearing unit. The adhesive tape clipping unit is disposed on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape. The rolling unit is slidably disposed on the table unit and next to the other side of the wafer bearing unit for uniformly rolling, pressing and adhering the tape of the bundle of adhesive tape on the at least one wafer.

In order to achieve the above-mentioned aspects, the present invention provides a method of adhering adhesive tape on wafers, including: setting at least one wafer on a wafer bearing unit; pulling out a tape with a predetermined length from an adhesive tape pull-tight unit, wherein the tape traverses the at least one wafer; clipping an end side of the tape with an adhesive tape clipping unit; driving the wafer bearing unit to move a predetermined distance upward so that the at least one wafer contacts a viscoid face of the tape; rolling and pressing the tape in order to uniformly adhere the tape on the at least one wafer; and cutting the tape along a periphery of the at least one wafer in order to remove the at least one wafer.

Hence, the present invention has some advantages as follows:

1. Before adhering the tape on the wafer, the tape does not need to be adhered on the table surface as in the prior art. Hence, a viscoid face of the tape will not be contaminated easily by powder or dust in the proximity of the table surface.

2. The tape does not need to be adhered on the table surface as in the prior art and a wafer bearing surface of the wafer bearing unit will not be slashed during the step of cutting the tape, so that the wafer bearing surface remains smooth. Hence, when using the wafer bearing surface again, cracks will not be generated on the wafers during the adhesive tape adhering process due to the uneven area of the wafer bearing surface.

3. Because the wafer are placed on the wafer bearing surface of the wafer bearing unit by a vacuum sucking method, the back of the wafer will not be rubbed by the wafer bearing surface. Hence, the back of the wafer will not be damaged.

4. The tape has a predetermined tension acted thereon by a matching between the adhesive tape pull-tight unit and the adhesive tape clipping unit in order to maintain the surface planarization of the tape. Hence, no air bubbles develop between the tape and the wafer.

5. The force of rolling and pressing acting on the tape is uniform due to the accurate matching of the wafer bearing unit and the rolling unit. Hence, cracks will not be generated on the wafer easily.

It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:

FIG. 1 is a flowchart of a method of adhering adhesive tape on wafers according to the prior art;

FIGS. 1A to 1G are schematic views of a method of adhering adhesive tape on wafers according to the prior art;

FIG. 2 is a schematic view of an adhesive tape adhering device for wafers according to the present invention;

FIG. 3 is a schematic view of a wafer bearing unit of an adhesive tape adhering device for wafers according to the present invention;

FIG. 4 is a flowchart of a method of adhering adhesive tape on wafers according to the present invention; and

FIGS. 4A to 4H are schematic views of a method of adhering adhesive tape on wafers according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 2 and 3, the present invention provides an adhesive tape adhering device for wafers, including: a table unit 10, a wafer bearing unit 20, an adhesive tape pull-tight unit 30, an adhesive tape clipping unit 40, and a rolling unit 50.

The wafer bearing unit 20 can be moved upward and downward and is disposed on the table unit 10 for bearing two wafers 3a. Naturally the bearing capacity of the wafer bearing unit 20 can be decided according to a user's need. In other words, the wafer bearing unit 20 can bear more than two wafers.

The wafer bearing unit 20 is composed of a wafer bearing disc 210 and a hoist mechanism 220 that is disposed under the wafer bearing disc 210 for moving the wafer bearing disc 210 upward and downward. In addition, the wafer bearing disc 210 can be a wafer bearing sucker, and the wafer bearing sucker has a vacuum hole 211 for creating a vacuum function. Hence, the two wafers 3a can be firmly positioned on the wafer bearing disc 210 by the vacuum function of vacuum hole 211.

The wafer bearing disc 210 has a plurality of concentric annular adhesive tape cutting grooves 212 formed thereon. Naturally designers can design only one annular adhesive tape cutting groove 212 to be formed on the wafer bearing disc 210 according to a user's need. In the present embodiment, a diameter D of an inside surface 2120 of the annular adhesive tape cutting groove 212 is the same as a diameter d of any one of the two wafers 3a. The annular adhesive tape cutting groove 212 should assist the user in performing a cutting process easily.

The adhesive tape pull-tight unit 30 has a bundle of adhesive tape 300, and the adhesive tape pull-tight unit 30 is disposed on the table unit 10 and next to one side of the wafer bearing unit 20. The adhesive tape clipping unit 40 is disposed on the table unit 10 and next to the other side of the wafer bearing unit 20 for tightly clipping (not shown) an end side of a tape 3000 of the bundle of adhesive tape 300.

The rolling unit 50 is front and back slidably disposed on the table unit 10 and next to the other side of the wafer bearing unit 20 for uniformly rolling, pressing and adhering the tape 3000 of the bundle of adhesive tape 300 on the two wafers 3a at the same time. Moreover, the adhesive tape adhering device further comprises a sliding mechanism 60 disposed on the table unit 10 for driving the rolling unit to move frontward and backward.

The adhesive tape adhering device further comprises a temporary adhesive area 70 disposed between the wafer bearing unit 20 and the adhesive tape clipping unit 30 for temporarily adhering the end side of the tape 3000 of the bundle of adhesive tape 300 (as shown in FIG. 1). The temporary adhesive area 70 has a transverse adhesive tape cutting groove 700 for cutting a spare part of the tape away. The spare part means sections that the user does not require.

Referring to FIG. 4 and FIGS. 4A to 4H, the present invention provides a method of adhering adhesive tape on wafers, including: referring to FIG. 4A, setting two wafers 3a on a wafer bearing unit 20 (S200); and referring to FIG. 4B, pulling out a tape 3000 with a predetermined length from an adhesive tape pull-tight unit 30 and making the tape 3000 traverse the two wafers 3a (S202).

The method further comprises: referring to FIG. 4C, clipping an end side of the tape 3000 with an adhesive tape clipping unit 40 (S204). In other words, the tape 3000 has a predetermined tension acted thereon by a matching between the adhesive tape pull-tight unit 30 and the adhesive tape clipping unit 40 in order to maintain the surface planarization of the tape 3000. Next, the method further comprises: driving the wafer bearing unit 20 to move upward (as the arrows shown in FIG. 4C demonstrate) a predetermined distance in order that the two wafers 3a contact a viscoid face of the tape 3000 (S206). In other words, a hoist mechanism 220 (as shown in FIG. 3) of the wafer bearing unit 20 is driven to move a predetermined distance upward so that the two wafers 3a contact a viscoid face of the tape 3000.

The method further comprises: referring to FIG. 4D and 4E, rolling and pressing the tape 3000 in order to uniformly adhere the tape 3000 on the two wafers 3a (S208); and referring to FIG. 4F, cutting the tape 3000 along the peripheries of the two wafers 3a (along a annular adhesive tape cutting groove (not shown) on a top side of a wafer bearing disc 210) and a transverse adhesive tape cutting groove 700 of a temporary adhesive area 70 (S210). In other words, any spare parts of the tape 3000 that the user does not require, can be cut away by the design of the transverse adhesive tape cutting groove 700.

Finally, referring to FIGS. 4G and 4H, the method further comprises: taking two wafers 3a with two tapes 3100 out (S212); and, after taking the two wafers 3a out and cleaning a spare part of the tape 3000, respectively returning the wafer bearing unit 20, the adhesive tape clipping unit 40 and the rolling unit 50 to their original places (S214) in order to perform a next adhesive tape adhering process.

In conclusion, the present invention solves all defects of the known method of the prior art, and ensures and controls the quality of the adhesive tape adhering process. Hence, the present invention has some advantages as follows:

1. Before adhering the tape 3000 on the wafer 3a, the tape 3000 does not need to be adhered on the table surface as in the prior art. Hence, a viscoid face of the tape 3000 will not be contaminated easily by powder or dust in the proximity of the table surface.

2. The tape 3000 does not need to be adhered on the table surface as in the prior art and the wafer bearing surface of the wafer bearing unit 20 will not be slashed during the step of cutting the tape 3000, so that the wafer bearing surface remains smooth. Hence, when using the wafer bearing surface again, cracks will not be generated on the wafers 3a during the adhesive tape adhering process due to the uneven area of the wafer bearing surface.

3. Because the wafer 3a is placed on the wafer bearing surface of the wafer bearing unit 20 by a vacuum sucking method, the back of the wafer 3a will not be rubbed by the wafer bearing surface. Hence, the back of the wafer 3a will not be damaged.

4. The tape 3000 has a predetermined tension acted thereon by a matching between the adhesive tape pull-tight unit 30 and the adhesive tape clipping unit 40 in order to maintain the surface planarization of the tape 3000. Hence, no air bubbles develop between the tape 3000 and the wafer 3a.

5. The force of rolling and pressing acting on the tape 3000 is uniform due to the accurate matching of the wafer bearing unit 20 and the rolling unit 50. Hence, cracks will not be generated on the wafer 3a easily.

Although the present invention has been described with reference to the preferred best molds thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims

1. An adhesive tape adhering device for wafers, comprising:

a table unit;

a wafer bearing unit upward and downward movably disposed on the table unit for bearing at least one wafer;

an adhesive tape pull-tight unit having a bundle of adhesive tape, wherein the adhesive tape pull-tight unit is disposed on the table unit and next to one side of the wafer bearing unit;

an adhesive tape clipping unit disposed on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape; and

a rolling unit slidably disposed on the table unit and next to the other side of the wafer bearing unit for uniformly rolling, pressing and adhering the tape of the bundle of adhesive tape on the at least one wafer.

2. The adhesive tape adhering device as claimed in claim 1, wherein the wafer bearing unit is composed of a wafer bearing disc and a hoist mechanism that is disposed under the wafer bearing disc for moving the wafer bearing disc upward and downward.

3. The adhesive tape adhering device as claimed in claim 2, wherein the wafer bearing disc has an annular adhesive tape cutting groove formed thereon.

4. The adhesive tape adhering device as claimed in claim 3, wherein a diameter of an inside surface of the annular adhesive tape cutting groove is same as a diameter of the at least one wafer.

5. The adhesive tape adhering device as claimed in claim 2, wherein the wafer bearing disc has a plurality of concentric annular adhesive tape cutting grooves formed thereon.

6. The adhesive tape adhering device as claimed in claim 2, wherein the wafer bearing disc is a wafer bearing sucker.

7. The adhesive tape adhering device as claimed in claim 6, wherein the wafer bearing sucker has a vacuum hole for creating a vacuum function.

8. The adhesive tape adhering device as claimed in claim 1, further comprising a temporary adhesive area disposed between the wafer bearing unit and the adhesive tape clipping unit for temporarily adhering the end side of the tape of the bundle of adhesive tape.

9. The adhesive tape adhering device as claimed in claim 8, wherein the temporary adhesive area has a transverse adhesive tape cutting groove for cutting a spare part of the tape away.

10. The adhesive tape adhering device as claimed in claim 1, further comprising a sliding mechanism disposed on the table unit for driving the rolling unit to move.

11. A method of adhering adhesive tape on wafers, comprising:

setting at least one wafer on a wafer bearing unit;

pulling out a tape with a predetermined length from an adhesive tape pull-tight unit, wherein the tape traverses the at least one wafer;

clipping an end side of the tape with an adhesive tape clipping unit;

driving the wafer bearing unit to move a predetermined distance upward so that the at least one wafer contacts a viscoid face of the tape;

rolling and pressing the tape in order to uniformly adhere the tape on the at least one wafer; and

cutting the tape along a periphery of the at least one wafer in order to remove the at least one wafer.

12. The method as claimed in claim 11, wherein the wafer bearing unit is composed of a wafer bearing disc and a hoist mechanism that is disposed under the wafer bearing disc for moving the wafer bearing disc upward and downward.

13. The method as claimed in claim 12, wherein the wafer bearing disc has an annular adhesive tape cutting groove formed thereon, and a diameter of an inside surface of the annular adhesive tape cutting groove is same as a diameter of the at least one wafer.

14. The method as claimed in claim 12, wherein the wafer bearing disc has a plurality of concentric annular adhesive tape cutting grooves formed thereon.

15. The method as claimed in claim 12, wherein the wafer bearing disc is a wafer bearing sucker.

16. The method as claimed in claim 15, wherein the wafer bearing sucker has a vacuum hole for creating a vacuum function.

17. The method as claimed in claim 11, wherein the tape has a predetermined tension acted thereon by a matching between the adhesive tape pull-tight unit and the adhesive tape clipping unit in order to maintain the surface planarization of the tape.

18. The method as claimed in claim 11, wherein before the step of pulling out the tape with the predetermined length, the end side of the tape is adhered on a temporary adhesive area.

19. The method as claimed in claim 18, wherein the temporary adhesive area has a transverse adhesive tape cutting groove for cutting a spare part of the tape.

20. The method as claimed in claim 19, wherein after taking the at least one wafer out and cleaning a spare part of the tape, the wafer bearing unit, the adhesive tape clipping unit and the rolling unit are respectively returned to original places for performing a further adhesive tape adhering process.