Patents by Inventor Hsun-Tien Li

Hsun-Tien Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fine conductive particles for making anisotropic conductive adhesive composition
    Publication number: 20040056236
    Abstract: Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.
    Type: Application
    Filed: September 19, 2002
    Publication date: March 25, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Hsun-Tien Li, Shu-Chen Huang, Kai-Chi Chen
  • Dielectric compositions having two steps of laminating temperatures
    Patent number: 6627684
    Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: September 30, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Tzong-Ming Lee, Hsun-Tien Li, Kai-Chi Chen, Mei-Ling Chen
  • Dielectric compositions having two steps of laminating temperatures
    Publication number: 20020123540
    Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.
    Type: Application
    Filed: December 18, 2001
    Publication date: September 5, 2002
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tzong-Ming Lee, Hsun-Tien Li, Kai-Chi Chen, Mei-Ling Chen