Patents by Inventor Hsun-Wei Chan
Hsun-Wei Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240102799Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.Type: ApplicationFiled: December 5, 2023Publication date: March 28, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ying-Chung CHEN, Hsun-Wei CHAN, Lu-Ming LAI, Kuang-Hsiung CHEN
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Patent number: 11835363Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.Type: GrantFiled: March 1, 2022Date of Patent: December 5, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai, Kuang-Hsiung Chen
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Patent number: 11776862Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.Type: GrantFiled: September 21, 2020Date of Patent: October 3, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
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Patent number: 11588081Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.Type: GrantFiled: March 4, 2020Date of Patent: February 21, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Shih-Chieh Tang, Lu-Ming Lai
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Publication number: 20220416111Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.Type: ApplicationFiled: August 30, 2022Publication date: December 29, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang Chin TSAI, Yu-Che HUANG, Hsun-Wei CHAN
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Patent number: 11430906Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.Type: GrantFiled: July 22, 2019Date of Patent: August 30, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chang Chin Tsai, Yu-Che Huang, Hsun-Wei Chan
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Publication number: 20220187068Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.Type: ApplicationFiled: March 1, 2022Publication date: June 16, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ying-Chung CHEN, Hsun-Wei CHAN, Lu-Ming LAI, Kuang-Hsiung CHEN
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Patent number: 11296025Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.Type: GrantFiled: July 17, 2019Date of Patent: April 5, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsun-Wei Chan, Shih-Chieh Tang
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Patent number: 11276797Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.Type: GrantFiled: April 15, 2019Date of Patent: March 15, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsiang-Cheng Tsai, Lu-Ming Lai, Hsun-Wei Chan, Ying-Chung Chen
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Patent number: 11276806Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.Type: GrantFiled: January 3, 2020Date of Patent: March 15, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi Wen Chiang, Kuang-Hsiung Chen, Lu-Ming Lai, Hsun-Wei Chan, Hsin-Ying Ho, Shih-Chieh Tang
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Patent number: 11262197Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.Type: GrantFiled: November 13, 2019Date of Patent: March 1, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai, Kuang-Hsiung Chen
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Publication number: 20210280755Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.Type: ApplicationFiled: March 4, 2020Publication date: September 9, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-Ying HO, Hsun-Wei CHAN, Shih-Chieh TANG, Lu-Ming LAI
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Publication number: 20210210662Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.Type: ApplicationFiled: January 3, 2020Publication date: July 8, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi Wen CHIANG, Kuang-Hsiung CHEN, Lu-Ming LAI, Hsun-Wei CHAN, Hsin-Ying HO, Shih-Chieh TANG
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Patent number: 10910532Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.Type: GrantFiled: November 21, 2018Date of Patent: February 2, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Hsun-Wei Chan
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Publication number: 20210005522Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Han CHEN, Hsun-Wei CHAN, Mei-Yi WU
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Patent number: 10862014Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.Type: GrantFiled: November 12, 2015Date of Patent: December 8, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai, Shih-Chieh Tang
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Publication number: 20200328322Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.Type: ApplicationFiled: April 15, 2019Publication date: October 15, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsiang-Chen TSAI, Lu-Ming LAI, Hsun-Wei CHAN, Ying-Chung CHEN
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Patent number: 10804173Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.Type: GrantFiled: October 14, 2016Date of Patent: October 13, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun-Han Chen, Hsun-Wei Chan, Mei-Yi Wu
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Patent number: 10752494Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.Type: GrantFiled: December 6, 2018Date of Patent: August 25, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chi Sheng Tseng, Lu-Ming Lai, Shih-Chieh Tang, Hsin-Ying Ho, Hsun-Wei Chan
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Patent number: 10689249Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.Type: GrantFiled: September 16, 2015Date of Patent: June 23, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ching-Han Huang, Hsun-Wei Chan, Lu-Ming Lai