Patents by Inventor Hu Peng
Hu Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180206328Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.Type: ApplicationFiled: June 27, 2017Publication date: July 19, 2018Inventors: John A. Starkovich, Jesse B. Tice, Xianglin Zeng, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman
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Publication number: 20180098406Abstract: A power drawing device using a single live wire includes a first and second mechanical switches, and a power drawing circuit, wherein the first mechanical switch includes a first contact connected to a live wire, a third contact connected to a first light adjusting circuit, and a fifth contact connected to the first light adjusting circuit; the second mechanical switch includes a first contact connected to the live wire, a third contact connected to a second light adjusting circuit, a fifth contact connected to the second light adjusting circuit, and a sixth contact connected to the first mechanical switch; and the power drawing circuit includes a first terminal connected to the live wire, a second terminal connected to the second mechanical switch, a third terminal connected to the first light adjusting circuit, and a fourth terminal connected to the second light adjusting circuit.Type: ApplicationFiled: July 20, 2017Publication date: April 5, 2018Applicant: Delta Electronics (Shanghai) CO., LTDInventors: Hu PENG, Bo YANG, Tsu-Hua AI
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Patent number: 9920178Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.Type: GrantFiled: December 11, 2015Date of Patent: March 20, 2018Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Patent number: 9810820Abstract: A method for manufacturing optical and microwave reflectors includes: placing an assembly comprising a resin-infiltrated tendrillar mat structure on a mandrel; placing a pre-impregnated carbon fiber (CF) lamina on top of the tendrillar mat structure; placing the assembly in a vacuum device so as to squeeze out excess resin; and placing the assembly in a heating device so as to cure the tendrillar mat structure together with the CF lamina, forming the CF laminae into a laminate that combines with the tendrillar mat structure to create a cured assembly. A reflector suitable for one or more of optical and microwave applications includes: a mandrel; a resin-infiltrated tendrillar mat structure placed on the mandrel; and a pre-impregnated carbon fiber (CF) lamina placed on top of the tendrillar mat structure.Type: GrantFiled: September 8, 2016Date of Patent: November 7, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 9741636Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.Type: GrantFiled: September 20, 2016Date of Patent: August 22, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Patent number: 9736923Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.Type: GrantFiled: January 17, 2017Date of Patent: August 15, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Xianglin Zeng, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman
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Patent number: 9693429Abstract: A system for controlling power supply according to the present disclosure includes a controlled device, a waveform control circuitry and a power detection and control circuitry. A supply voltage is provided to the controlled device for supplying power and, at the same time is applied to the waveform control circuitry for changing its waveform so as to generate a control signal. The control signal is then received and analyzed by the power detection and control circuitry to output a control command, which is used to control the controlled device. Based on the system for controlling power supply, there is also provided a method for controlling power supply, which may be implemented by a smart dimming system to realize remote control of lighting-on, lighting-off, dimming and color temperature regulation.Type: GrantFiled: June 6, 2016Date of Patent: June 27, 2017Assignee: Delta Greentech (China) Co., Ltd.Inventors: Bo Yang, Hu Peng, Xu Wang
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Patent number: 9688827Abstract: A method for infusing a nanoporous tendrillar mat with resin includes: performing a short duration, elevated temperature, pre-cure contacting treatment of the tendrillar mat using resin, thereby substantially uniformly infusing the tendrillar mat with resin; and curing the resin-infused tendrillar mat.Type: GrantFiled: August 29, 2016Date of Patent: June 27, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
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Publication number: 20170166721Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.Type: ApplicationFiled: December 11, 2015Publication date: June 15, 2017Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Publication number: 20170146302Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material: placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: ApplicationFiled: February 2, 2017Publication date: May 25, 2017Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Patent number: 9613882Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.Type: GrantFiled: September 19, 2016Date of Patent: April 4, 2017Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Patent number: 9601452Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: GrantFiled: August 29, 2016Date of Patent: March 21, 2017Assignees: Northrup Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior UniversityInventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Publication number: 20170005026Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.Type: ApplicationFiled: September 19, 2016Publication date: January 5, 2017Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
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Publication number: 20160372438Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: ApplicationFiled: August 29, 2016Publication date: December 22, 2016Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Publication number: 20160360592Abstract: A system for controlling power supply according to the present disclosure includes a controlled device, a waveform control circuitry and a power detection and control circuitry. A supply voltage is provided to the controlled device for supplying power and, at the same time is applied to the waveform control circuitry for changing its waveform so as to generate a control signal. The control signal is then received and analyzed by the power detection and control circuitry to output a control command, which is used to control the controlled device. Based on the system for controlling power supply, there is also provided a method for controlling power supply, which may be implemented by a smart dimming system to realize remote control of lighting-on, lighting-off, dimming and color temperature regulation.Type: ApplicationFiled: June 6, 2016Publication date: December 8, 2016Applicant: DELTA GREENTECH (CHINA) CO., LTD.Inventors: Bo YANG, Hu PENG, Xu WANG
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Patent number: 9468989Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: GrantFiled: January 26, 2016Date of Patent: October 18, 2016Assignees: Northrop Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior UniversityInventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Publication number: 20160250710Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: ApplicationFiled: January 26, 2016Publication date: September 1, 2016Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
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Publication number: 20160251769Abstract: A method for making a thermal interface material (TIM) comprises the steps of: depositing a seed layer onto a substrate; attaching a template membrane to the substrate; depositing metal into one or more of the pores of the template membrane, substantially filling the template membrane to create a vertically-aligned metal nanowire (MNW) array comprising a plurality of nanowires that grow upward from the seed layer; and after the template membrane is substantially filled with the deposited metal, removing the template membrane, leaving the plurality of nanowires attached to the seed layer. A TIM comprises: a vertically-aligned MNW array comprising a plurality of nanowires that grow upward from a seed layer deposited on the surface of a template membrane, and the template membrane being removed after MNW growth.Type: ApplicationFiled: January 26, 2016Publication date: September 1, 2016Inventors: Edward M. Silverman, John A. Starkovich, Hsiao-Hu Peng, Jesse B. Tice, Michael T. Barako, Conor E. Coyan, Kenneth E. Goodson
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Publication number: 20160160001Abstract: A polymer composite material that achieves an improved damage resistant performance reinforced composite by adding carbon nanotubes (CNTs) is disclosed. The CNTs serve as the mechanical strengthening component. Higher filler loadings and filler surface area proved by CNTs result in volume maximization which provides a more homogeneous distribution of fillers. This allows the formation of a network of nanofibers which reduces the filler-free volume of the matrix, effectively filling nano-sized voids.Type: ApplicationFiled: November 6, 2014Publication date: June 9, 2016Inventors: Edward M. Silverman, Hsiao-Hu Peng
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Patent number: 8808792Abstract: A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant so as to increase the conductance of the conductor element to a desired value, wherein the dopant is one of bromine, iodine, chloroauric acid, hydrochloric acid, hydroiodic acid, nitric acid, and potassium tetrabromoaurate. A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant solution comprising one of chloroauric acid, hydrochloric acid, nitric acid, and potassium tetrabromoaurate, so as to increase the conductance of the conductor element to a desired value.Type: GrantFiled: January 17, 2012Date of Patent: August 19, 2014Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Edward M. Silverman, Hsiao-Hu Peng