Patents by Inventor Hu Peng

Hu Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180206328
    Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.
    Type: Application
    Filed: June 27, 2017
    Publication date: July 19, 2018
    Inventors: John A. Starkovich, Jesse B. Tice, Xianglin Zeng, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman
  • Publication number: 20180098406
    Abstract: A power drawing device using a single live wire includes a first and second mechanical switches, and a power drawing circuit, wherein the first mechanical switch includes a first contact connected to a live wire, a third contact connected to a first light adjusting circuit, and a fifth contact connected to the first light adjusting circuit; the second mechanical switch includes a first contact connected to the live wire, a third contact connected to a second light adjusting circuit, a fifth contact connected to the second light adjusting circuit, and a sixth contact connected to the first mechanical switch; and the power drawing circuit includes a first terminal connected to the live wire, a second terminal connected to the second mechanical switch, a third terminal connected to the first light adjusting circuit, and a fourth terminal connected to the second light adjusting circuit.
    Type: Application
    Filed: July 20, 2017
    Publication date: April 5, 2018
    Applicant: Delta Electronics (Shanghai) CO., LTD
    Inventors: Hu PENG, Bo YANG, Tsu-Hua AI
  • Patent number: 9920178
    Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: March 20, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
  • Patent number: 9810820
    Abstract: A method for manufacturing optical and microwave reflectors includes: placing an assembly comprising a resin-infiltrated tendrillar mat structure on a mandrel; placing a pre-impregnated carbon fiber (CF) lamina on top of the tendrillar mat structure; placing the assembly in a vacuum device so as to squeeze out excess resin; and placing the assembly in a heating device so as to cure the tendrillar mat structure together with the CF lamina, forming the CF laminae into a laminate that combines with the tendrillar mat structure to create a cured assembly. A reflector suitable for one or more of optical and microwave applications includes: a mandrel; a resin-infiltrated tendrillar mat structure placed on the mandrel; and a pre-impregnated carbon fiber (CF) lamina placed on top of the tendrillar mat structure.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: November 7, 2017
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
  • Patent number: 9741636
    Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: August 22, 2017
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
  • Patent number: 9736923
    Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: August 15, 2017
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Jesse B. Tice, Xianglin Zeng, Andrew D. Kostelec, Hsiao-Hu Peng, Edward M. Silverman
  • Patent number: 9693429
    Abstract: A system for controlling power supply according to the present disclosure includes a controlled device, a waveform control circuitry and a power detection and control circuitry. A supply voltage is provided to the controlled device for supplying power and, at the same time is applied to the waveform control circuitry for changing its waveform so as to generate a control signal. The control signal is then received and analyzed by the power detection and control circuitry to output a control command, which is used to control the controlled device. Based on the system for controlling power supply, there is also provided a method for controlling power supply, which may be implemented by a smart dimming system to realize remote control of lighting-on, lighting-off, dimming and color temperature regulation.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: June 27, 2017
    Assignee: Delta Greentech (China) Co., Ltd.
    Inventors: Bo Yang, Hu Peng, Xu Wang
  • Patent number: 9688827
    Abstract: A method for infusing a nanoporous tendrillar mat with resin includes: performing a short duration, elevated temperature, pre-cure contacting treatment of the tendrillar mat using resin, thereby substantially uniformly infusing the tendrillar mat with resin; and curing the resin-infused tendrillar mat.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: June 27, 2017
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Hsiao-Hu Peng, Edward M. Silverman
  • Publication number: 20170166721
    Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 15, 2017
    Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
  • Publication number: 20170146302
    Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material: placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
    Type: Application
    Filed: February 2, 2017
    Publication date: May 25, 2017
    Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
  • Patent number: 9613882
    Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: April 4, 2017
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
  • Patent number: 9601452
    Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: March 21, 2017
    Assignees: Northrup Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior University
    Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
  • Publication number: 20170005026
    Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. At least one of the interfacial layers is a vertically aligned metal nanowire array. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.
    Type: Application
    Filed: September 19, 2016
    Publication date: January 5, 2017
    Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao-Hu Peng
  • Publication number: 20160372438
    Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
    Type: Application
    Filed: August 29, 2016
    Publication date: December 22, 2016
    Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
  • Publication number: 20160360592
    Abstract: A system for controlling power supply according to the present disclosure includes a controlled device, a waveform control circuitry and a power detection and control circuitry. A supply voltage is provided to the controlled device for supplying power and, at the same time is applied to the waveform control circuitry for changing its waveform so as to generate a control signal. The control signal is then received and analyzed by the power detection and control circuitry to output a control command, which is used to control the controlled device. Based on the system for controlling power supply, there is also provided a method for controlling power supply, which may be implemented by a smart dimming system to realize remote control of lighting-on, lighting-off, dimming and color temperature regulation.
    Type: Application
    Filed: June 6, 2016
    Publication date: December 8, 2016
    Applicant: DELTA GREENTECH (CHINA) CO., LTD.
    Inventors: Bo YANG, Hu PENG, Xu WANG
  • Patent number: 9468989
    Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: October 18, 2016
    Assignees: Northrop Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior University
    Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
  • Publication number: 20160250710
    Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
    Type: Application
    Filed: January 26, 2016
    Publication date: September 1, 2016
    Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
  • Publication number: 20160251769
    Abstract: A method for making a thermal interface material (TIM) comprises the steps of: depositing a seed layer onto a substrate; attaching a template membrane to the substrate; depositing metal into one or more of the pores of the template membrane, substantially filling the template membrane to create a vertically-aligned metal nanowire (MNW) array comprising a plurality of nanowires that grow upward from the seed layer; and after the template membrane is substantially filled with the deposited metal, removing the template membrane, leaving the plurality of nanowires attached to the seed layer. A TIM comprises: a vertically-aligned MNW array comprising a plurality of nanowires that grow upward from a seed layer deposited on the surface of a template membrane, and the template membrane being removed after MNW growth.
    Type: Application
    Filed: January 26, 2016
    Publication date: September 1, 2016
    Inventors: Edward M. Silverman, John A. Starkovich, Hsiao-Hu Peng, Jesse B. Tice, Michael T. Barako, Conor E. Coyan, Kenneth E. Goodson
  • Publication number: 20160160001
    Abstract: A polymer composite material that achieves an improved damage resistant performance reinforced composite by adding carbon nanotubes (CNTs) is disclosed. The CNTs serve as the mechanical strengthening component. Higher filler loadings and filler surface area proved by CNTs result in volume maximization which provides a more homogeneous distribution of fillers. This allows the formation of a network of nanofibers which reduces the filler-free volume of the matrix, effectively filling nano-sized voids.
    Type: Application
    Filed: November 6, 2014
    Publication date: June 9, 2016
    Inventors: Edward M. Silverman, Hsiao-Hu Peng
  • Patent number: 8808792
    Abstract: A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant so as to increase the conductance of the conductor element to a desired value, wherein the dopant is one of bromine, iodine, chloroauric acid, hydrochloric acid, hydroiodic acid, nitric acid, and potassium tetrabromoaurate. A method includes the steps of receiving a conductor element formed from a plurality of carbon nanotubes; and exposing the conductor element to a controlled amount of a dopant solution comprising one of chloroauric acid, hydrochloric acid, nitric acid, and potassium tetrabromoaurate, so as to increase the conductance of the conductor element to a desired value.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: August 19, 2014
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Edward M. Silverman, Hsiao-Hu Peng