Abstract: The present disclosure provides a battery cabinet of a battery box and an energy storage container including the battery cabinet.

Abstract: A battery box, battery pack and energy storage container are provided. The battery box comprises: a bottom plate and a frame, the bottom plate and the frame together form an installation cavity, the bottom plate is provided with a number of cooling flow channels, and the cooling flow channels are used for circulating cooling medium; a coolant-converging-channel, at least one end of the bottom plate is provided with the coolant-converging-channel, the coolant-converging-channel is located inside or outside the installation cavity, and the coolant-converging-channel connects to the bottom plate and is interconnected to the cooling flow channels. The battery box, battery pack and energy storage container can achieve uniform heat dissipation of the battery module, convenient for thermal management inside the battery pack and improving battery safety.

Abstract: Automatically upgrading a computing environment system may include automatically identifying a set of timeframes and nodes running user applications on physical machines, containers, or virtual machines (VMs) whose disruption during the identified timeframes minimally impact the user applications. The timeframes may be intelligently determined by leveraging the monitoring data obtained automatically and/or the hints supplied by the user.

Abstract: Automatically upgrading a computing environment system may include automatically identifying a set of timeframes and nodes running user applications on physical machines, containers, or virtual machines (VMs) whose disruption during the identified timeframes minimally impact the user applications. The timeframes may be intelligently determined by leveraging the monitoring data obtained automatically and/or the hints supplied by the user.

Abstract: A display device includes a monitor, a stand, and a speaker module. The monitor includes a first side and a second side. An accommodating groove is formed on the first side, and a slot is formed on the second side. The stand is selectively installed inside the accommodating groove for being stored in the first side of the monitor or inserted into the slot for supporting the monitor on a supporting surface. The speaker module is installed inside the stand for outputting an audio signal transmitted from the monitor.

Abstract: An electronic device is provided. The electronic device includes a liquid-crystal display module, a diffuser, a prism sheet, a light guide, a back panel and an outer frame. The diffuser, the prism sheet and the light guide are sandwiched between the liquid-crystal display module and the back panel. The outer frame covers the liquid-crystal display module, wherein the outer frame includes a first frame member and a second frame member, a welded portion is formed between the first frame member and the second frame member, the outer frame includes an outer surface, and the outer surface includes a planar area at the welded portion.

Abstract: A display device includes a monitor, a stand, and a speaker module. The monitor includes a first side and a second side. An accommodating groove is formed on the first side, and a slot is formed on the second side. The stand is selectively installed inside the accommodating groove for being stored in the first side of the monitor or inserted into the slot for supporting the monitor on a supporting surface. The speaker module is installed inside the stand for outputting an audio signal transmitted from the monitor.

Abstract: A method for manufacturing an electronic device is provided, including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.

Abstract: A polymer ion exchange membrane for acidic electrolyte flow battery. The membrane is nitrogen heterocycles aromatic polymer, especially polybenzimidazole type polymer. A nitrogen heterocycles in the membrane interact with acid in the electrolyte to form donor-receptor proton transport network, so as to keep the proton transport performance of the membrane. The preparation condition for the membrane is mild, and the process is simplicity. The preparation method is suitable for mass production. The membrane is used in acidic electrolyte flow battery, especially in vanadium flow energy storage battery. The membrane has excellent mechanical stability and thermostability. In vanadium redox flow battery, the membrane has excellent proton conduct performance and excellent resistance to the permeation of vanadium ions.

Abstract: A method for manufacturing an electronic device is provided, including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.

Abstract: A method and an apparatus of image depth estimation are provided. The method includes the following steps. First, a hue value of each pixel in an image is calculated by comparing all color components of each pixel in the image. The hue value of each pixel in the image is associated with a corresponding value, wherein the corresponding value is a first numerical value or a second numerical value. Then, according to the corresponding value of each pixel in the image, a depth value of each pixel in the image is calculated, in which the depth value is used to convert the image into a three-dimensional (3D) image to be displayed on a 3D display apparatus.

Abstract: A liquid crystal display device is disclosed. The liquid crystal display device includes a panel, a first frame, and a second frame. The panel has a side face. At least one first locking hole is disposed on the side face. The first frame includes a first side edge and a second side edge. The first side edge has at least one second locking hole and at least one slot. The at least one first locking hole and the at least one second locking hole are locked with each other via at least one locking element, so as to fix the panel and the first frame. The second frame has at least one hook part used for matching the at least one slot of the first side edge such that the second frame and the first frame can be fixed to each other.

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.

Abstract: A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.

Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.

Abstract: A bumping process includes providing a silicon substrate, forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first areas and a plurality of second areas, forming a photoresist layer on the titanium-containing metal layer, patterning the photoresist layer to form a plurality of opening slots corresponded to the first areas of the titanium-containing metal layer, forming a plurality of copper bumps at the opening slots, proceeding a heat procedure, forming a plurality of bump isolation layers on the copper bumps, forming a plurality of connective layers on the bump isolation layers, removing the photoresist layer, removing the second areas and enabling each the first areas to form an under bump metallurgy layer.

Abstract: A method and an apparatus of image depth estimation are provided. The method includes the following steps. First, a hue value of each pixel in an image is calculated by comparing all color components of each pixel in the image. The hue value of each pixel in the image is associated with a corresponding value, wherein the corresponding value is a first numerical value or a second numerical value. Then, according to the corresponding value of each pixel in the image, a depth value of each pixel in the image is calculated, in which the depth value is used to convert the image into a three-dimensional (3D) image to be displayed on a 3D display apparatus.