Patents by Inventor Hua Dai

Hua Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8501614
    Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: August 6, 2013
    Assignee: Chipbond Technology Corporation
    Inventors: Cheng-Hung Shih, Yung-Wei Hsieh, Shu-Chen Lin, Cheng-Fan Lin, Hua-An Dai
  • Publication number: 20130183823
    Abstract: A bumping process includes providing a silicon substrate, forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first areas and a plurality of second areas, forming a photoresist layer on the titanium-containing metal layer, patterning the photoresist layer to form a plurality of opening slots corresponded to the first areas of the titanium-containing metal layer, forming a plurality of copper bumps at the opening slots, proceeding a heat procedure, forming a plurality of bump isolation layers on the copper bumps, forming a plurality of connective layers on the bump isolation layers, removing the photoresist layer, removing the second areas and enabling each the first areas to form an under bump metallurgy layer.
    Type: Application
    Filed: January 18, 2012
    Publication date: July 18, 2013
    Applicant: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Chih-Ming Kuo, Hua-An Dai, Cheng-Fan Lin, Yie-Chuan Chiu, Yung-Wei Hsieh
  • Publication number: 20130050201
    Abstract: A method and an apparatus of image depth estimation are provided. The method includes the following steps. First, a hue value of each pixel in an image is calculated by comparing all color components of each pixel in the image. The hue value of each pixel in the image is associated with a corresponding value, wherein the corresponding value is a first numerical value or a second numerical value. Then, according to the corresponding value of each pixel in the image, a depth value of each pixel in the image is calculated, in which the depth value is used to convert the image into a three-dimensional (3D) image to be displayed on a 3D display apparatus.
    Type: Application
    Filed: July 4, 2012
    Publication date: February 28, 2013
    Applicant: VIA TECHNOLOGIES, INC.
    Inventor: Qing-Hua Dai
  • Publication number: 20120320304
    Abstract: A liquid crystal display device is disclosed. The liquid crystal display device includes a panel, a first frame, and a second frame. The panel has a side face. At least one first locking hole is disposed on the side face. The first frame includes a first side edge and a second side edge. The first side edge has at least one second locking hole and at least one slot. The at least one first locking hole and the at least one second locking hole are locked with each other via at least one locking element, so as to fix the panel and the first frame. The second frame has at least one hook part used for matching the at least one slot of the first side edge such that the second frame and the first frame can be fixed to each other.
    Type: Application
    Filed: March 9, 2012
    Publication date: December 20, 2012
    Inventor: Shu-Hua DAI
  • Publication number: 20120196188
    Abstract: A polymer ion exchange membrane for acidic electrolyte flow battery. The membrane is nitrogen heterocycles aromatic polymer, especially polybenzimidazole type polymer. A nitrogen heterocycles in the membrane interact with acid in the electrolyte to form donor-receptor proton transport network, so as to keep the proton transport performance of the membrane. The preparation condition for the membrane is mild, and the process is simplicity. The preparation method is suitable for mass production. The membrane is used in acidic electrolyte flow battery, especially in vanadium flow energy storage battery. The membrane has excellent mechanical stability and thermostability. In vanadium redox flow battery, the membrane has excellent proton conduct performance and excellent resistance to the permeation of vanadium ions.
    Type: Application
    Filed: June 25, 2010
    Publication date: August 2, 2012
    Applicants: Dalian Institute of Chemical Physics, Chinese Academy of Sciences, DALIAN RONGKE POWER CO., LTD.
    Inventors: Huamin Zhang, Xianfeng Li, Hua Dai, Cheng Bi
  • Patent number: 6441958
    Abstract: A compact digital imaging microscope includes a stage for holding a specimen, a lens assembly for collecting a beam of light transmitted through the specimen, and an adjustable beamsplitter assembly for splitting the beam between an eyepiece for viewing an image of the specimen and a CCD image detector to provide both a digital and an analog signal representing an image of the specimen. The use of a lens positioned along an optical path between the lens assembly and the image detector allows the image detector to be integrated compactly within the microscope and also allows the image detector to capture an image whose viewable area is roughly the same as that viewable through the eyepiece. Furthermore, all electrical connections (other than output and power supply connections which are located at the base of the microscope) are internalized within the microscope.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: August 27, 2002
    Inventors: Chak Sing Richard Yeung, Shao Hua Dai, Qian Xiao