Patents by Inventor Hua Jin

Hua Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12281394
    Abstract: Provided in one embodiment of the present disclosure is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: April 22, 2025
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Shan Hua Jin, An Na Lee, Seung Min Kim
  • Patent number: 12246291
    Abstract: A metal organic framework glass membrane and a preparation method thereof are provided. The preparation method includes a step of heating a crystalline metal organic framework material to the melting temperature at a rate of 1-15° C./min and then naturally cooling the crystalline metal organic framework material. The crystalline metal organic framework material contains a metal node and a ligand A. The metal node is a zinc ion and/or a cobalt ion and the ligand A is imidazole or phosphoric acid. The metal organic framework glass membrane has a wide range of membrane-forming conditions, and the material thereof can be melted without being decomposed within a control range to form a continuous glass layer with good repeatability.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: March 11, 2025
    Assignee: NINGBO UNIVERSITY
    Inventors: Yanshuo Li, Hua Jin
  • Publication number: 20240222640
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first weight retention rate of 0.1% or less, and a second weight retention rate of 0.3% or less.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 4, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213492
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a room temperature MIT 1 of 280 or more, a high-temperature MIT 1 of 130 or more, a room temperature MIT 2 of 14 or more, and a high-temperature MIT 2 of 25 or more. The room temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm at room temperature, the high-temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm after heat treatment at 190° C. for one hour, the room temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm at room temperature, and the high-temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm after heat treatment at 190° C. for one hour.
    Type: Application
    Filed: December 18, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213493
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has an A-value in a range of 1.1 to 1.6. “A” is calculated by Equation 1 below, A = P / Q [ Equation ? 1 ] wherein “P” in Equation 1 is a peak intensity at 1650 cm?1 of the copper film, “Q” in Equation 1 is a peak intensity at 1460 cm?1 of the copper film, and the peak intensity is measured by Fourier-transform infrared spectroscopy (FT-IR).
    Type: Application
    Filed: December 18, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213490
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first stress factor in a range of 2.8 to 3.2, a second stress factor in a range of 2.5 to 3.0, and a third stress factor in a range of 3.5 to 4.5, and a method for manufacturing the copper foil.
    Type: Application
    Filed: December 21, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240204167
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has a room temperature loss factor of 0.05 or less, wherein the room temperature loss factor is calculated by Equation 1 below, room temperature loss factor=room temperature loss modulus/room temperature storage modulus.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 20, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240194891
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature puncture strength in a range of 5.0 N to 7.0 N, and a high-temperature puncture strength in a range of 8.0 N to 12.5 N. At this time, the high-temperature puncture strength is a puncture strength measured after heat treatment at 190° C. for one hour.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 13, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240194890
    Abstract: According one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a tensile strength index of 3.0 kgf/mm2 or less, and an elongation index of 2.1% or less.
    Type: Application
    Filed: November 22, 2023
    Publication date: June 13, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240186526
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature water contact angle in a range of 60° to 70°, and a room temperature surface resistivity in a range of 2.4 m?/cm to 2.7 m?/cm.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240186527
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film having 99.9 wt % or more of copper, wherein the copper foil has a color difference coefficient in a range of 0.38 to 0.7 based on the Lab color system.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240178404
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and having an R value in a range of 2.0 to 3.5.
    Type: Application
    Filed: November 22, 2023
    Publication date: May 30, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240132473
    Abstract: The present invention relates to the technical field of biomedicine, in particular to a sulfoximide substituted indazole compound, an isomer thereof, or a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: Shanghai Xunhe Pharmaceutical Technology Co. Ltd.
    Inventors: Nongnong WEI, Hua JIN, Yongyong ZHENG, Feng ZHOU, Meihua HUANG
  • Patent number: 11946082
    Abstract: The present invention features fusion polypeptides comprising an RNA binding polypeptide operationally linked to an RNA modifying enzyme (e.g., adenosine deaminase, cytidine deaminase), and methods of use therefore.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 2, 2024
    Assignee: Brandeis University
    Inventors: Michael Rosbash, Aoife McMahon, Weijin Xu, Hua Jin
  • Patent number: 11844948
    Abstract: Provided is an accurate, fast and long-term stable fused CRAP. The electrode includes a positioning anchor, a silicone catheter, a sensor compartment and a connecting wire. The method monitors physiological information such as blood PPG, blood oxygen saturation, temperature and impedance of blood in the right ventricular cavity, and monitors blood temperature information, which is also a slowly changing metabolic rate, to provide cross-comparison with blood oxygen saturation information, improving monitoring accuracy of blood oxygen saturation. The rapidly changing right ventricular apical impedance information is monitored to improve rapid response ability of CRAP. The LEDs driving current is dynamically adjusted by monitoring the internal temperature of the PPG sensor and the impedance change of the attached biological tissue, which indirectly reflects thickness change of the attached biological tissue, thereby delaying the failure time of the PPG sensor.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: December 19, 2023
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Xiang Chen, Jin Li, Zhongbo Bai, Hua Jin, Quangui Qu, Fenghu Zhou, Feng Yun, Ke Han
  • Patent number: 11814405
    Abstract: The present invention relates to the technical field of biomedicine, particularly to a pyridine sulfonamide phosphate compound, a preparation method therefor, and a use thereof. The invention provides the following technical benefits: the pyridine sulfonamide phosphate compound has characteristics of high solubility, high stability, ease of being made into preparations, etc., which is easy to be industrially scaled up for medical use.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: November 14, 2023
    Assignee: Shanghai Xunhe Pharmaceutical Technology Co. Ltd.
    Inventors: Nongnong Wei, Hua Jin, Yongyong Zheng, Feng Zhou, Meihua Huang
  • Patent number: 11640658
    Abstract: The present disclosure discloses a multi-path image processing apparatus. An image merging circuit is configured to receive image frames that at least one of the image frames has a largest row number, generate redundant pixel row for each of the image frames that has a row number smaller than the largest row number such that the row number of each of the image frames equals to the largest row number, generate redundant pixel columns for each of the image frames having the number thereof determined by a size of a largest operation window, and merge each two of the image frames through the redundant columns thereof to generate a merged image frame. An image processing circuit performs image processing procedure on the merged image frame to generate a processed merged image frame, wherein at least a part of the image processing procedure is operated according to the largest operation window. An image segmentation circuit segments the processed merged image frame to generate processed image frames.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 2, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Qing-Zhe Qiu, Dong-Yu He, Shao-Hua Jin, Hong-Hai Dai
  • Patent number: 11591706
    Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: February 28, 2023
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Seung Min Kim, Shan Hua Jin
  • Publication number: 20230045462
    Abstract: The present invention features fusion polypeptides comprising an RNA binding polypeptide operationally linked to an RNA modifying enzyme (e.g., adenosine deaminase, cytidine deaminase), and methods of use therefore.
    Type: Application
    Filed: May 13, 2022
    Publication date: February 9, 2023
    Inventors: Michael Rosbash, Aoife McMahon, Weijin Xu, Hua Jin
  • Patent number: 11505873
    Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: November 22, 2022
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Shan Hua Jin, An Na Lee, Seung Min Kim