Abstract: This application discloses a back contact solar cell and method for manufacturing the same, which relates to the field of photovoltaic technology and is used to simplify the manufacturing process of back contact solar cell while ensuring high photovoltaic conversion efficiency. The back contact solar cell comprises: a substrate having opposing first and second surfaces, with the first surface having staggered first doped regions and second doped regions, and a third region between the first doped region and the second doped region. The back contact solar cell further includes a first doped layer and a second doped layer formed on the first doped region, with the first doped layer having a conductivity type opposite to that of the second doped layer; a third doped layer formed on the second doped region and having a conductivity type opposite to that of the first doped layer.

Abstract: A semiconductor structure includes a circuit with a redistribution layer (RDL) formed over the circuit. The redistribution layer comprises a plurality of metal layers. An inductor is formed in a topmost metal layer, and the circuit is located directly under the inductor. An under bump metallization (UBM) layer formed on the topmost metal layer and a conductive connector formed on the UBM layer.

Abstract: A back contact solar cell is disclosed by the present disclosure, thus the problem of electric leakage of the back contact solar cell is solved and the power conversion efficiency of the back contact solar cell is improved. The back contact solar cell includes: a substrate, a first doped layer, a second doped layer, a first electrode and a second electrode, wherein the substrate has a first surface and a second surface opposite to each other; there are a first doped region, a second doped region and an overlapping region on the first surface, the first doped region and the second doped region are arranged in a staggered manner, and the overlapping region is located between the first doped region and the second doped region; the overlapping region has an isolating trench for insulating contact between the first doped region and the second doped region.

Abstract: The present disclosure discloses a solar cell and methods of fabricating a solar cell. In one aspect, a solar cell includes a substrate, a first doped layer arranged on a first surface of the substrate in a first region of the substrate, and a second doped layer arranged on the first surface of the substrate in a second region of the substrate. The first doped layer includes a first dopant. The second doped layer includes a second dopant. A conductivity type of the second doped layer is opposite to a conductivity type of the first doped layer. The solar cell further includes a third doped layer arranged on the first doped layer. The third doped layer includes the first dopant and the second dopant.

Abstract: The present disclosure provides an ultra-high temperature resistant cement slurry system for cementing and the preparation method and use thereof. The cement slurry system comprises cement, an ultra-high temperature strength stabilizer, an ultra-high temperature reinforcing material, a density regulator, an ultra-high temperature suspension stabilizer, a dispersant, a fluid loss additive, a retarder, a defoaming agent and water, wherein the ultra-high temperature suspension stabilizer comprises an ether-based starch, an aluminosilicate and a polyalcohol polymer. The method for preparing the cement slurry system includes dry mixing and wet mixing raw materials homogeneously, respectively, and then homogeneously mixing the dry mix and wet mix to obtain the cement slurry system. The present disclosure further provides use of the cement slurry system for cementing in deep wells and ultra-deep wells at high and ultra-high temperatures.

Abstract: The present application relates to a truncated TACI polypeptide and a fusion protein and use thereof. Specifically, provided are a TACI polypeptide as shown in SEQ ID NO: 8, a truncated fragment thereof, a mutation sequence thereof, and a fusion protein comprising the TACI polypeptide and use thereof.

Abstract: The present disclosure relates to anti-KLB antibodies and uses.

Abstract: A continuous heating control system and method, and an air-conditioning device. The system includes a defrosting solenoid valve (1) arranged on a bypass pipeline, wherein one end of the bypass pipeline is connected to an oil separator (2), and the other end of the bypass pipeline is connected to an outdoor heat exchanger (3); and a heating structure which is arranged at the bottom of a gas separator (4) and used for heating the gas separator (4).

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first weight retention rate of 0.1% or less, and a second weight retention rate of 0.3% or less.

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a room temperature MIT 1 of 280 or more, a high-temperature MIT 1 of 130 or more, a room temperature MIT 2 of 14 or more, and a high-temperature MIT 2 of 25 or more. The room temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm at room temperature, the high-temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm after heat treatment at 190° C. for one hour, the room temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm at room temperature, and the high-temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm after heat treatment at 190° C. for one hour.

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first stress factor in a range of 2.8 to 3.2, a second stress factor in a range of 2.5 to 3.0, and a third stress factor in a range of 3.5 to 4.5, and a method for manufacturing the copper foil.

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has an A-value in a range of 1.1 to 1.6. “A” is calculated by Equation 1 below, A = P / Q [ Equation ? 1 ] wherein “P” in Equation 1 is a peak intensity at 1650 cm?1 of the copper film, “Q” in Equation 1 is a peak intensity at 1460 cm?1 of the copper film, and the peak intensity is measured by Fourier-transform infrared spectroscopy (FT-IR).

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has a room temperature loss factor of 0.05 or less, wherein the room temperature loss factor is calculated by Equation 1 below, room temperature loss factor=room temperature loss modulus/room temperature storage modulus.

Abstract: According one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a tensile strength index of 3.0 kgf/mm2 or less, and an elongation index of 2.1% or less.

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature puncture strength in a range of 5.0 N to 7.0 N, and a high-temperature puncture strength in a range of 8.0 N to 12.5 N. At this time, the high-temperature puncture strength is a puncture strength measured after heat treatment at 190° C. for one hour.

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature water contact angle in a range of 60° to 70°, and a room temperature surface resistivity in a range of 2.4 m?/cm to 2.7 m?/cm.

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film having 99.9 wt % or more of copper, wherein the copper foil has a color difference coefficient in a range of 0.38 to 0.7 based on the Lab color system.

Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and having an R value in a range of 2.0 to 3.5.

Abstract: The present invention relates to the technical field of biomedicine, in particular to a sulfoximide substituted indazole compound, an isomer thereof, or a pharmaceutically acceptable salt thereof.

Abstract: The present invention features fusion polypeptides comprising an RNA binding polypeptide operationally linked to an RNA modifying enzyme (e.g., adenosine deaminase, cytidine deaminase), and methods of use therefore.