Patents by Inventor Hua Jin

Hua Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250057968
    Abstract: An anti-DLL3 antibody and a pharmaceutical use thereof, and an antibody-drug conjugate containing the anti-DLL3 antibody. The present disclosure relates to an anti-DLL3 antibody-ecteinascidin drug conjugate represented by general formula (Pc-L-D), wherein Pc is the anti-DLL3 antibody.
    Type: Application
    Filed: December 23, 2022
    Publication date: February 20, 2025
    Inventors: Xin Ye, Qingqing Yao, Xinsheng Jin, Hua Ying, Weikang Tao
  • Publication number: 20250043022
    Abstract: Provided are an antigen-binding molecule specifically binding to PSMA and CD3, and a pharmaceutical use thereof. The antigen-binding molecule can be used for treating tumor-related diseases.
    Type: Application
    Filed: February 7, 2023
    Publication date: February 6, 2025
    Inventors: Hua YING, Jinping SHI, Hao YANG, Xiaomin ZHANG, Xinsheng JIN, Weikang TAO
  • Publication number: 20250033096
    Abstract: A liquid storage tank may include a body with an inner cavity, wherein a first liquid storage area and a second liquid storage area are provided in the body, and a partition is provided between the first liquid storage area and the second liquid storage area. A heater for heating solution is provided in the first liquid storage area. A liquid outlet is provided in the second liquid storage area.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 30, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Lihui JIN, Hua YANG, Zhigao REN, Huan WANG, Liang REN, Chuanling AI, Dawei WANG, Zhijun WU, Hongxia CEN, Chen WEI
  • Publication number: 20250018447
    Abstract: A lifting control apparatus may include: a base for holding a basket containing silicon wafers; brackets provided on an outside of both ends of the base; and a driver for driving the brackets to move up and down. The driver is provided with a lead screw. The lead screw is connected with the bracket on a same side. The lead screw on one side is driven to rotate the lead screw on another side synchronously, and the lead screws on both sides are driven to move the brackets on both sides and the base between the brackets up and down together. Or the lead screws on both sides are driven to rotate synchronously, so that the lead screws on both sides drive the base between the brackets through the correspondingly brackets to move up and down together.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 16, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Lihui JIN, Hua YANG, Zhigao REN, Xiaoguang ZHAO, Hao GUO, Chuanling AI, Dawei WANG, Zhijun WU, Hongxia CEN, Chen WEI
  • Publication number: 20250018434
    Abstract: A silicon wafer sorting mechanism includes a wafer distribution unit, a sorting unit, and a transmission unit disposed sequentially. The sorting unit includes a sorting table with one terminal hinged to the wafer distribution unit. The sorting table rotates and tilts with a point where the sorting table is hinged to the wafer distribution unit. The sorting table and the transmission unit are arranged up and down in dislocation or the sorting table is placed horizontally against the transmission unit, thereby forming two transmission lines in different directions to sort silicon wafers of different types.
    Type: Application
    Filed: July 18, 2023
    Publication date: January 16, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Lihui JIN, Hua YANG, Zhigao REN, Huan WANG, Chuanling AI, Dawei WANG, Zhijun WU, Hongxia CEN, Chen WEI
  • Publication number: 20250018449
    Abstract: An apparatus for supplying cleaning liquid may include: a stock solution unit configured with a plurality of stock solution tanks; a cleaning unit configured with a plurality of cleaning tanks; and a transfer unit disposed between the stock solution unit and the cleaning unit. The transfer unit is configured with a plurality of independent transfer tanks. Each of the stock solution tanks communicates with at least one of the transfer tanks, each of the transfer tanks communicates with one of the cleaning tanks, and each of the cleaning tanks communicates with at least one of the transfer tanks.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 16, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Lihui JIN, Hua YANG, Zhigao REN, Huan WANG, Chuanling AI, Dawei WANG, Zhijun WU, Hongxia CEN, Chen WEI
  • Publication number: 20250022519
    Abstract: The present application discloses a memory, a memory system, and a method for operating memory, which belongs to the memory techniques field. The method for operating memory comprises determining a storage state of a reference memory cell, determining a discharge duration of a sensing node corresponding to a target memory cell based on the storage state of the reference memory cell, and reading the target memory cell based on the discharge duration of the sensing node corresponding to the target memory cell to obtain read results. The target memory cell and the reference memory cell are located in the same string and are adjacent, and the programming order of the reference memory cell is after that of the target memory cell. The present application may reduce the influence on reading memory cells by interlayer interference and improve the accuracy of reading memory cells.
    Type: Application
    Filed: December 4, 2023
    Publication date: January 16, 2025
    Inventors: Xiangnan ZHAO, Hongtao LIU, Chenhui LI, Lei JIN, Hua TAN
  • Publication number: 20240222640
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first weight retention rate of 0.1% or less, and a second weight retention rate of 0.3% or less.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 4, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213492
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a room temperature MIT 1 of 280 or more, a high-temperature MIT 1 of 130 or more, a room temperature MIT 2 of 14 or more, and a high-temperature MIT 2 of 25 or more. The room temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm at room temperature, the high-temperature MIT 1 refers to an MIT number when a bending radius (R) is 0.38 mm after heat treatment at 190° C. for one hour, the room temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm at room temperature, and the high-temperature MIT 2 refers to an MIT number when a bending radius (R) is 0.1 mm after heat treatment at 190° C. for one hour.
    Type: Application
    Filed: December 18, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213493
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has an A-value in a range of 1.1 to 1.6. “A” is calculated by Equation 1 below, A = P / Q [ Equation ? 1 ] wherein “P” in Equation 1 is a peak intensity at 1650 cm?1 of the copper film, “Q” in Equation 1 is a peak intensity at 1460 cm?1 of the copper film, and the peak intensity is measured by Fourier-transform infrared spectroscopy (FT-IR).
    Type: Application
    Filed: December 18, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240213490
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper foil has a first stress factor in a range of 2.8 to 3.2, a second stress factor in a range of 2.5 to 3.0, and a third stress factor in a range of 3.5 to 4.5, and a method for manufacturing the copper foil.
    Type: Application
    Filed: December 21, 2023
    Publication date: June 27, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240204167
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, wherein the copper film has a room temperature loss factor of 0.05 or less, wherein the room temperature loss factor is calculated by Equation 1 below, room temperature loss factor=room temperature loss modulus/room temperature storage modulus.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 20, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240194891
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature puncture strength in a range of 5.0 N to 7.0 N, and a high-temperature puncture strength in a range of 8.0 N to 12.5 N. At this time, the high-temperature puncture strength is a puncture strength measured after heat treatment at 190° C. for one hour.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 13, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240194890
    Abstract: According one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a tensile strength index of 3.0 kgf/mm2 or less, and an elongation index of 2.1% or less.
    Type: Application
    Filed: November 22, 2023
    Publication date: June 13, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240186526
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and a protective layer formed on the copper film, wherein the copper foil has a room temperature water contact angle in a range of 60° to 70°, and a room temperature surface resistivity in a range of 2.4 m?/cm to 2.7 m?/cm.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240186527
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film having 99.9 wt % or more of copper, wherein the copper foil has a color difference coefficient in a range of 0.38 to 0.7 based on the Lab color system.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240178404
    Abstract: According to one embodiment of the present disclosure, there is provided a copper foil including a copper film including 99.9 wt % or more of copper, and having an R value in a range of 2.0 to 3.5.
    Type: Application
    Filed: November 22, 2023
    Publication date: May 30, 2024
    Inventors: Shan Hua JIN, Min Seok YOON
  • Publication number: 20240132473
    Abstract: The present invention relates to the technical field of biomedicine, in particular to a sulfoximide substituted indazole compound, an isomer thereof, or a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: Shanghai Xunhe Pharmaceutical Technology Co. Ltd.
    Inventors: Nongnong WEI, Hua JIN, Yongyong ZHENG, Feng ZHOU, Meihua HUANG
  • Patent number: 11946082
    Abstract: The present invention features fusion polypeptides comprising an RNA binding polypeptide operationally linked to an RNA modifying enzyme (e.g., adenosine deaminase, cytidine deaminase), and methods of use therefore.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 2, 2024
    Assignee: Brandeis University
    Inventors: Michael Rosbash, Aoife McMahon, Weijin Xu, Hua Jin
  • Patent number: 11844948
    Abstract: Provided is an accurate, fast and long-term stable fused CRAP. The electrode includes a positioning anchor, a silicone catheter, a sensor compartment and a connecting wire. The method monitors physiological information such as blood PPG, blood oxygen saturation, temperature and impedance of blood in the right ventricular cavity, and monitors blood temperature information, which is also a slowly changing metabolic rate, to provide cross-comparison with blood oxygen saturation information, improving monitoring accuracy of blood oxygen saturation. The rapidly changing right ventricular apical impedance information is monitored to improve rapid response ability of CRAP. The LEDs driving current is dynamically adjusted by monitoring the internal temperature of the PPG sensor and the impedance change of the attached biological tissue, which indirectly reflects thickness change of the attached biological tissue, thereby delaying the failure time of the PPG sensor.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: December 19, 2023
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Xiang Chen, Jin Li, Zhongbo Bai, Hua Jin, Quangui Qu, Fenghu Zhou, Feng Yun, Ke Han