Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: An optical device includes an objective module, a prism module and an ocular module. The prism module includes a first prism, a second prism, a third prism and a first coating. The prism module is disposed between the objective module and the ocular module. A first light beam emitted by an object sequentially passes through the objective module, the prism module and the ocular module. Central axes of the objective module and the ocular module are in parallel without overlapping.

Abstract: In an embodiment, a structure includes a core substrate, a redistribution structure coupled, the redistribution structure including a plurality of redistribution layers, the plurality of redistribution layers comprising a dielectric layer and a metallization layer, a first local interconnect component embedded in a first redistribution layer of the plurality of redistribution layers, the first local interconnect component comprising conductive connectors, the conductive connectors being bonded to a metallization pattern of the first redistribution layer, the dielectric layer of the first redistribution layer encapsulating the first local interconnect component, a first integrated circuit die coupled to the redistribution structure, a second integrated circuit die coupled to the redistribution structure, an interconnect structure of the first local interconnect component electrically coupling the first integrated circuit die to the second integrated circuit die, and a set of conductive connectors coupled to a

Abstract: In a method of cleaning a lithography system, during idle mode, a stream of air is directed, through a first opening, into a chamber of a wafer table of an EUV lithography system. One or more particles is extracted by the directed stream of air from surfaces of one or more wafer chucks in the chamber of the wafer table. The stream of air and the extracted one or more particle are drawn, through a second opening, out of the chamber of the wafer table.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: The present invention provides a flexible glass and manufacturing method thereof. The flexible glass includes a first straight part and a second straight part on two opposite ends thereof, a recess formed between the first straight part and the second straight part, and a pre-bent curve connection part disposed corresponding to the recess. The first straight part and the second straight part are not arranged on the same plane. The flexible glass has a first lateral side and a second lateral side, and the recess sinks from the first lateral side toward the second lateral side. Therefore, the flexible glass is provided with a greater bendability.

Abstract: A rotor assembly, a compressor and an air conditioner. The rotor assembly includes a first rotor, including a first working portion and a second working portion coaxially arranged, wherein the first working portion and the second working portion are rotatable about a first axis; the first working portion includes a plurality of first helical blades, with a first blade groove being formed between adjacent two of the plurality of first helical blades; at least one first air pressure groove is provided on a first end face of the first working portion away from the second working portion; and the first air pressure groove is configured to form a force in a predetermined direction along the first axis when rotating. The rotor assembly can reduce costs of the compressor, simplify structures of moving parts of the compressor, and improve performance and reliability of the compressor.

Abstract: A method for determining a three-dimensional tortuosity of a loose and broken rock-soil mass, includes the following steps: a particle grading curve of the loose and broken rock-soil mass is obtained by utilizing a particle size analysis, and followed by calculating an equivalent particle size and an average particle size; a porosity of the loose and broken rock-soil mass is obtained by utilizing a moisture content test, a density test, and a specific gravity test; the three-dimensional tortuosity of the loose and broken rock-soil mass is obtained by utilizing the equivalent particle size, the average particle size and the porosity of the loose and broken rock-soil mass. The method has the advantages of simple logic, accuracy and reliability, simple and fast parameter determination, and has high practical value and promotion value in the field of environmental protection and ecological restoration technology.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A handwriting data processing method is applied to a pen display having wireless communication function and a data processing device. The handwriting data processing method includes the steps of: the data processing device obtaining a handwriting data from the pen display in a wireless communication manner; the data processing device generating a compressed screen image and transmitting the data of the compressed screen image and the handwriting data, which is not compressed, to the pen display in the wireless communication manner; the pen display uncompressing the data of the compressed screen image and overlapping the uncompressed screen image and the handwriting data to form a complete screen image and displaying the complete screen image. By the handwriting processing method, the machine time of the processor of the pen display is effectively lowered, significantly reducing the delay phenomenon of the displayed handwriting.

Abstract: The present disclosure provides a compressor rotor, a compressor and a refrigerant circulation system. The compressor rotor includes: a motor rotor including a plurality of rotor sections, a locking rod, a compression unit rotating part and a locking member. The rotor sections are fixedly connected in an axial direction and are provided with an axial through hole and the locking rod penetrates through the axial through hole. The compression unit rotating part is located at the end part of the motor rotor and is connected to the locking rod. The locking member is configured to lock the compression unit rotating part on the locking rod. The locking rod, the compression unit rotating part and the locking member form a pressing structure which applies a pressure toward an axial inner side to the motor rotor.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: In one embodiment, a method for auditing the results of a machine learning model includes: retrieving a set of state estimates for original time series data values from a database under audit; reversing the state estimation computation for each of the state estimates to produce reconstituted time series data values for each of the state estimates; retrieving the original time series data values from the database under audit; comparing the original time series data values pairwise with the reconstituted time series data values to determine whether the original time series and reconstituted time series match; and generating a signal that the database under audit (i) has not been modified where the original time series and reconstituted time series match, and (ii) has been modified where the original time series and reconstituted time series do not match.

Abstract: A semiconductor device includes an insulating base layer, a semiconductor layer, an insulating layer, an isolation trench and a gettering site. The semiconductor layer and the insulating layer are disposed on the insulating base layer in sequence, and the isolation trench is disposed in the semiconductor layer and passes through the insulating layer. The isolation trench includes a first cross-section, a second cross-section and a third cross-section from top to bottom. The first cross-section is higher than the bottom surface of the insulating layer, and the second cross-section and the third cross-section are lower than the bottom surface of the insulating layer. The gettering site is disposed in the semiconductor layer and in contact with the isolation trench, and the vertex of the gettering site is lower than the second cross-section.

Abstract: Systems and methods are described for generating record clusters. The methods comprise receiving a plurality of records from data sources and providing at least a subset of the records to a scoring model that determines scores for various pairings of the records, a score for a given pair of the records representing a probability that the given pair of records contain data elements about the same entity. The method further comprises generating a graph data structure that includes a plurality of nodes, individual nodes representing a different record from the records. The method also comprises assigning a different unique identifier to individual clusters of the final clusters and responding to a request for data regarding a given entity by providing aggregated data elements from those records of the records associated with a cluster of the final clusters having an identifier that represents the given entity.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.