Patents by Inventor Hua Xia

Hua Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260043396
    Abstract: A hydrogen getter assembly designed to address significant hydrogen outgassing and scavenging challenges may incorporate a triple-layered structure created through plating techniques. In this setup, the middle layer is made of a highly reactive metal foil from rolling mills that absorbs hydrogen by forming hydrides, while the plated foil surfaces are tailored for hydrogen adsorption. The combination of electroless plating and pulsed electroplating processes facilitates rapid hydrogen diffusion from the nano-scale grain layers to the micro-scale grain gettering layer. This design effectively reduces the interface kinetic energy barrier and enhances the absorption rate, especially at low temperatures, without needing thermal activation or regeneration. The materials and structural design allow these getters to function over a broad temperature range, from as low as ?162° C. in cryogenic conditions to elevated temperatures of 200-300° C.
    Type: Application
    Filed: August 11, 2024
    Publication date: February 12, 2026
    Inventors: Hua Xia, David Lee DeWire
  • Publication number: 20250108356
    Abstract: This invention reveals functional particle co-embedded multi-phase hierarchical porous nanostructured polymer composites, along with all-in-one getter assemblies tailored to manage particulate and gaseous emissions, particularly from microelectronic and electronic packages, as well as various industrial systems. The getter assemblies, available in single-layered, bilayered, and multilayered configurations, offer customized solutions to address specific emission control challenges in diverse environments.
    Type: Application
    Filed: December 11, 2024
    Publication date: April 3, 2025
    Inventors: Hua Xia, David DeWire, Tian Xia
  • Publication number: 20250091030
    Abstract: This disclosure presents multi-phase hierarchical porous nanostructure-based polymer composites and associated getter assemblies designed for scavenging multi-gas and organic compounds outgassed from electronic packages, devices, and modules. The composites integrate hydrophilic microporous, hydrophobic microporous, and hydrophobic mesoporous nanoparticles within a polymer matrix to form binary, ternary, or quaternary multi-phase structures. These polymer composites are utilized to fabricate getter assemblies featuring single-layer, bi-layer, or multi-layer configurations on a substrate. The assemblies are tailored to selectively target specific polar and non-polar gases and organic compounds or to adsorb a broad spectrum of outgassed emissions, irrespective of their polarity, molecular size, or surface energy characteristics.
    Type: Application
    Filed: December 1, 2024
    Publication date: March 20, 2025
    Inventors: Hua Xia, David DeWire
  • Publication number: 20250073666
    Abstract: Getters for hydrocarbons (HCs) and volatile organic compounds (VOCs) designed for microelectronic and electronic packages are disclosed. These getters feature a hierarchical porous nanostructured polymer composite layer supported by a substrate. The composite layer integrates hydrophilic microporous nanoparticles and hydrophobic mesoporous nanoparticles, enabling the modulation of hydrophilic and hydrophobic properties. This tailored structure facilitates the effective absorption of a broad spectrum of polar and non-polar HCs and VOCs, for enhancing the reliability and performance of electronic packages by controlling outgassed emissions.
    Type: Application
    Filed: November 19, 2024
    Publication date: March 6, 2025
    Inventors: hua Xia, David DeWire
  • Publication number: 20250060310
    Abstract: Provided is a method for analyzing aliased spectra of alkane gases, including the following steps: firstly separately acquiring second harmonic signals of specified gases at known gas concentrations and calculating an absorbance of each gas; subsequently constructing a low concentration prediction model regarding second harmonic signals and gas concentrations; next constructing a high concentration prediction model regarding absorbances and gas concentrations, immediately followed by acquiring a second harmonic signal of a gas to be measured with an unknown gas concentration and calculating an absorbance of the gas to be measured; and if an absorbance peak of the gas to be measured is less than or equal to a threshold A0, predicting the gas concentration of the gas to be measured using the low concentration prediction model; otherwise, predicting the gas concentration of the gas to be measured using the high concentration prediction model.
    Type: Application
    Filed: August 13, 2024
    Publication date: February 20, 2025
    Applicant: Hefei Institutes of Physical Science, CAS
    Inventors: Zhirong Zhang, Yuntao Peng, Hua Xia, Pengshuai Sun, Qianjin Wang, Tao Pang, Bian Wu
  • Patent number: 11536132
    Abstract: A multiple parameter sensing leak detection system may include one or more multi-parameter sensing modules capable of simultaneously measuring downhole temperature, pressure, and acoustic signals. The temperature and pressure detectors may include quartz based sensing elements, and the acoustic detector may include piezoelectric based sensing elements. In one or more embodiments, a plurality of sensing modules may be carried on a caliper for allowing radial identification of leak location. In one or more embodiments, multiple calipers, each carrying a circumferential arrangement of sensing modules may be used to identify annular or inter-annular leakage beyond production tubing using triangulation techniques. A leak analysis method identifies if relative pressure and temperature variation amplitudes fall outside leak thresholds and if power spectral density from noise has anomalous frequency signatures.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: December 27, 2022
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Hua Xia, Clovis S. Bonavides, Avinash V. Taware
  • Patent number: 11382224
    Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: July 5, 2022
    Assignee: PA&E, HERMETIC SOLUTIONS GROUP, LLC
    Inventors: Hua Xia, Nathan Foster, Nelson Settles, Steve Hall, David DeWire
  • Patent number: 10921476
    Abstract: A downhole formation fluid identification sensing module for measuring averaged gas molecular weight of wellbore formation fluid acquires simultaneous temperature, pressure, and density measurements. The sensing module includes two venturi-type gas sensors that both contain vibrating tubes. During operation, formation fluid flows through the vibrating tubes whereby resonant frequency measurements are acquired simultaneously with temperature and pressure measurements. Each measurement is then utilized to determine the gas molecular weight of the dry, wet or saturated formation fluid.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: February 16, 2021
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Hua Xia, Christopher Michael Jones, Robert Atkinson, Tian He, Bin Dai, Jing Shen
  • Publication number: 20210014986
    Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.
    Type: Application
    Filed: September 22, 2020
    Publication date: January 14, 2021
    Applicant: PA&E, Hermetic Solutions Group, LLC
    Inventors: Hua Xia, Nathan Foster, Nelson Settles, Steve Hall, David DeWire
  • Patent number: 10811331
    Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: October 20, 2020
    Assignee: PA&E, HERMETIC SOLUTIONS GROUP, LLC
    Inventors: Hua Xia, Nathan Foster, Nelson Settles, Steve Hall
  • Publication number: 20200312142
    Abstract: Provided is a system for improving road safety of a vehicle. The system comprises a central management platform for managing a plurality of network cooperation engine (NCE) modules. Each NCE module manages a plurality of edge gateway devices (EGWs) which are each located in a respective defined geographical area of limited size. Each EGW communicates with multiple roadside units (RSUs) in its area and exchanges real-time and low latency information with said RSUs and with any vehicle on-board data processing units (ICGWs) in vehicles presently within its area. Each ICGW is adapted to be installable in a vehicle. The ICGW is configured to receive real-time data from one or more on-board vehicle modules. The ICGW is also configured to receive data from its EGW and the RSUs which are themselves configured to receive data from a plurality of sources located within said defined geographical area and to transmit said received data and/or data derived from said received data to said ICGW.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 1, 2020
    Inventors: Dongzhe Su, Hang Chen, Hua Xia, Siu Ping Chan, Ka Ho Mui
  • Publication number: 20200273769
    Abstract: A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.
    Type: Application
    Filed: February 26, 2019
    Publication date: August 27, 2020
    Applicant: PA&E, Hermetic Solutions Group, LLC
    Inventors: Hua Xia, Nathan Foster, Nelson Settles, Steve Hall
  • Publication number: 20200032644
    Abstract: In distributed fiber-optic sensing within a borehole, the accuracy of correlating signal channels with depth along the borehole can be improved by taking the thermo-optic effect on the group velocity of light into account. In an example application, this allows, in turn, to more accurately localize acoustic sources via distributed acoustic sensing. Additional embodiments are disclosed.
    Type: Application
    Filed: November 17, 2016
    Publication date: January 30, 2020
    Inventors: Hua Xia, Kristoffer Thomas Walker, David Andrew Barfoot, Yinghui Lu
  • Publication number: 20190376359
    Abstract: A hydrophobic dielectric sealing material is provided that is especially suitable for use in extreme environments such as for enabling downhole electrical feedthrough integrated logging tools reliable operation, especially, in a water or water-mud filled wellbore as first scenario or in moisture-rich oil-mud filled wellbores. In some embodiments, a hydrophobic dielectric sealing material may include: H3BO3 10-60 mol %; Bi2O3 10-50 mol %; MO 10-50 mol %; SiO2 0-15 mol %; and optionally one or more rare earth oxides 0-5 mol %. A method for making hydrophobic sealing material includes selecting water insoluble raw materials, form tetragonal phase dominated phase, and enlarge band-gap with wide-band-gap material. The morphology of the sealing material is preferably a tetrahedral phase dominated covalent bond network for obtaining high electrical insulation resistance, dielectric strength and hydrophobicity, and high mechanical strength in against downhole 30,000 PSI/300° C. water-based hostile environments.
    Type: Application
    Filed: June 10, 2018
    Publication date: December 12, 2019
    Applicant: PA&E, Hermetic Solutions Group, LLC
    Inventors: Hua Xia, Nelson Settles, Gaery Rutherford
  • Patent number: 10483745
    Abstract: A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: November 19, 2019
    Assignee: PA&E, Hermetic Solutions Group, LLC
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Don Larson
  • Publication number: 20190339410
    Abstract: A downhole formation fluid identification sensing module for measuring averaged gas molecular weight of wellbore formation fluid acquires simultaneous temperature, pressure, and density measurements. The sensing module includes two venturi-type gas sensors that both contain vibrating tubes. During operation, formation fluid flows through the vibrating tubes whereby resonant frequency measurements are acquired simultaneously with temperature and pressure measurements. Each measurement is then utilized to determine the gas molecular weight of the dry, wet or saturated formation fluid.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Hua Xia, Christopher Michael Jones, Robert Atkinson, Tian He, Bin Dai, Jing Shen
  • Patent number: 10458233
    Abstract: A downhole tool including a tube having an inner bore that receives a sample of fluid from a subterranean formation, a vibration source and a vibration receiver each at least partially coupled to the tube, and a controller coupled to the vibration source and the vibration receiver is provided. In situ measurements of thermo-physical properties including, but not limited to, fluid density/viscosity, thermal conductivity and heat capacity, and hydrocarbon molecular weight may be provided through the system. The vibrating sensor may include a sensor platform that can be incorporated into sensors purpose built to test different in situ thermo-physical properties that are technically difficult or expensive to test using typical sensors. The vibrating sensors may be modularized and incorporated as a suite of in situ downhole sensors into existing downhole fluid sampling tools, reducing the overall expense of in situ testing.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 29, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventor: Hua Xia
  • Patent number: 10428648
    Abstract: A downhole formation fluid viscometer sensor and method therefor include a viscometer sensing package, a flexible diaphragm, a magnet and electric coil, and a signal pickup assembly. The viscometer sensor may also include a first cavity and a second cavity for mechanical and electric energy transfer. The magnet and electric coil may be driven by external alternating current to generate an electromagnetic force. Silicon oil may be used to fill the first cavity and/or a pressure balance hole may connect the first cavity to an external area. The diaphragm may be a titanium alloy and a ferromagnetic magnet may be attached to the diaphragm. The diaphragm preferably has a thickness from about 0.030 to about 0.040 inches and the magnet and electric coil can propel the diaphragm to vibrate at a frequency from 0 to 100 kHz. Formation fluid viscosity is determined using resonant frequency linewidth, with contributions from the sensor package intrinsic properties removed.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: October 1, 2019
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Hua Xia, Lizheng Zhang, Robert Atkinson, Nestor Rodriguez, Christopher Michael Jones, Darren Gascooke
  • Publication number: 20190229515
    Abstract: A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.
    Type: Application
    Filed: April 3, 2019
    Publication date: July 25, 2019
    Applicant: PA&E, Hermetic Solutions Group, LLC
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Don Larson
  • Patent number: 10291008
    Abstract: A downhole electrical feedthrough package and method for making the same. The feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: May 14, 2019
    Assignee: PA&E, HERMETIC SOLUTIONS GROUP, LLC
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Don Larson