Abstract: A semiconductor device includes a substrate, an epitaxial structure over the substrate, a conductive structure, and a dielectric liner. The conductive structure extends from within the epitaxial structure to above the epitaxial structure. The dielectric liner extends along a sidewall of the conductive structure. The dielectric liner has a top end capped by the conductive structure.

Abstract: A semiconductor device includes a substrate, an epitaxial structure over the substrate, a conductive structure, and a dielectric liner. The conductive structure extends from within the epitaxial structure to above the epitaxial structure. The dielectric liner extends along a sidewall of the conductive structure. The dielectric liner has a top end capped by the conductive structure.

Abstract: A method comprises forming a source/drain region on a substrate; forming a dielectric layer over the source/drain region; forming a contact hole in the dielectric layer; forming a contact hole liner in the contact hole; removing a first portion of the contact hole liner to expose a sidewall of the contact hole; etching the exposed sidewall of the contact hole to laterally expand the contact hole; and forming a contact plug in the laterally expanded contact hole.

Abstract: A method comprises forming a source/drain region on a substrate; forming a dielectric layer over the source/drain region; forming a contact hole in the dielectric layer; forming a contact hole liner in the contact hole; removing a first portion of the contact hole liner to expose a sidewall of the contact hole; etching the exposed sidewall of the contact hole to laterally expand the contact hole; and forming a contact plug in the laterally expanded contact hole.

Abstract: A semiconductor device includes a substrate, an inter-layer dielectric layer, a contact plug, and a contact hole liner. The substrate has a source/drain region. The inter-layer dielectric layer is over the substrate and has a contact hole therein. The contact plug is electrically connected to the source/drain region through the contact hole of the inter-layer dielectric layer. The contact hole liner extends between the contact plug and a sidewall of a first portion of the contact hole. The contact hole liner terminates prior to reaching a second portion of the contact hole. The first portion is between the second portion and the source/drain region.

Abstract: A heat-dissipating module having an elastic mounting structure includes a carrier circuit board, a main circuit board, a heat dissipating module, and a plurality of elastic mounting components configured to mount mounting holes of the carrier circuit board and mounting grooves of the heat dissipating module in series, so as to fix the carrier circuit board, the main circuit board and the heat dissipating module. As a result, the plurality of elastic mounting components can provide stress buffer and good bonding effect for the thermally conductive device of the heat dissipating module bonded on an upper surface of the heat source device.

Abstract: A thermal module mounting structure includes a thermal module having a first bracket with mounting holes fixedly mounted at each of two opposite sides of a bottom wall thereof, a circuit board having one or multiple heat source components located on a top wall thereof and a second bracket with through holes fixedly mounted at each of two opposite sides of the top wall, and a plurality of fasteners respectively inserted through the through holes of the second brackets and fastened to the respective mounting holes of the first brackets to secure the circuit board to the thermal module in a vertically floatable manner and to keep the heat source components in contact with the bottom wall of the thermal module.

Abstract: A method for manufacturing a semiconductor device includes forming a gate stack over a substrate; forming an interlayer dielectric over the substrate to cover the gate stack; forming an opening in the interlayer dielectric to expose to the gate stack; forming a glue layer over the interlayer dielectric and in the opening; partially removing the glue layer, in which a portion of the glue layer remain in the opening; and tuning a profile of the remained portion of the glue layer.

Abstract: A method for manufacturing a semiconductor device includes forming a gate stack over a substrate; forming an interlayer dielectric over the substrate to cover the gate stack; forming an opening in the interlayer dielectric to expose to the gate stack; forming a glue layer over the interlayer dielectric and in the opening; partially removing the glue layer, in which a portion of the glue layer remain in the opening; and tuning a profile of the remained portion of the glue layer.

Abstract: A semiconductor device includes a substrate, an inter-layer dielectric layer, a contact plug, and a contact hole liner. The substrate has a source/drain region. The inter-layer dielectric layer is over the substrate and has a contact hole therein. The contact plug is electrically connected to the source/drain region through the contact hole of the inter-layer dielectric layer. The contact hole liner extends between the contact plug and a sidewall of a first portion of the contact hole. The contact hole liner terminates prior to reaching a second portion of the contact hole. The first portion is between the second portion and the source/drain region.

Abstract: A heat dissipation estimating method is disclosed. The heat dissipation estimating method includes following steps: providing an input heat to a fin of a heat sink unit; obtaining an average temperature of the fin according to the input heat; obtaining an output heat according to the average temperature; determining whether the input heat is the same as the output heat or not; while the input heat is different from the output heat, updating the input heat according to the output heat and repeating the above steps until the input heat is the same as the output heat; and while the input heat is the same as the output heat, obtaining a total heat dissipation value of the heat sink unit according to the input heat and a ratio value.

Abstract: The present disclosure provides a method that includes forming an isolation feature in a semiconductor substrate; forming a first fin and a second fin on the semiconductor substrate, wherein the first and second fins are laterally separated by the isolation feature; and forming an elongated contact feature landing on the first and second fins. The elongated contact feature is further embedded in the isolation feature, enclosing an air gap vertically between the contact feature and the isolation feature.

Abstract: A heat dissipation estimating method is disclosed. The heat dissipation estimating method includes following steps: providing an input heat to a fin of a heat sink unit; obtaining an average temperature of the fin according to the input heat; obtaining an output heat according to the average temperature; determining whether the input heat is the same as the output heat or not; while the input heat is different from the output heat, updating the input heat according to the output heat and repeating the above steps until the input heat is the same as the output heat; and while the input heat is the same as the output heat, obtaining a total heat dissipation value of the heat sink unit according to the input heat and a ratio value.

Abstract: A fan includes a first motor, a second motor, a rotating shaft and a fan blade. The first motor includes a first coil. A first current flows through the first coil when the fan is electrified. The second motor includes a second coil. A second current flows through the second coil when the fan is electrified. The fan blade is affixed to the rotating shaft. The first motor and the second motor drive the rotating shaft to rotate the fan blade when the fan is electrified.

Abstract: An electronic device includes a case, a control module, a plurality of heat sinks and at least one airflow guiding structure. The case includes a bottom plate, a top plate, and at least one side plate. The bottom plate has a plurality of bottom holes for guiding air into the case. The top plate has a plurality of top holes for exhausting air in the case. The side plate connects the top plate and the bottom plate and has a plurality of side holes for exhausting air in the case. The control module is disposed in the case. The heat sinks are thermally connected to the control module. The airflow guiding structure is disposed between the heat sinks for guiding a part of the air in the case to the exterior of the case through the side holes.

Abstract: A fan structure used for connecting with a plate body includes a main body, a fan blade, a sliding member and a locating member. The main body has an accommodating space and an adjustment slot. The fan blade is pivotally disposed on the main body and is located inside the accommodating space. The sliding member has a base and a joining portion. The base is accommodated in the adjustment slot. The sliding member is joined to the plate body through the joining portion. The locating member is used for joining the sliding member and the main body together, so as to fix the relative position of the sliding member and the main body.

Abstract: According to an exemplary embodiment, a serializer includes upper and lower shift registers configured to perform a load function where parallel input data is loaded from a parallel input bus and a shift function where the parallel input data is shifted to an output register. The upper shift register is configured to perform the load function while the lower shift register performs the shift function, and the lower shift register is configured to perform the load function while the upper shift register performs the shift function. An output register is configured to alternately receive the parallel input data from the upper shift register and the parallel input data from the lower shift register. The upper and lower shift registers and the output register can comprise scan flip-flops.

Abstract: An electronic device includes a case, a control module, a plurality of heat sinks and at least one airflow guiding structure. The case includes a bottom plate, a top plate, and at least one side plate. The bottom plate has a plurality of bottom holes for guiding air into the case. The top plate has a plurality of top holes for exhausting air in the case. The side plate connects the top plate and the bottom plate and has a plurality of side holes for exhausting air in the case. The control module is disposed in the case. The heat sinks are thermally connected to the control module. The airflow guiding structure is disposed between the heat sinks for guiding a part of the air in the case to the exterior of the case through the side holes.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.