HEAT DISSIPATION MODULE

- INVENTEC CORPORATION

A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.

Skip to: Description  ·  Claims  · Patent History  ·  Patent History

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201210427755.0 filed in China, P.R.C. on Oct. 31, 2012, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

The disclosure relates to a heat dissipation module, and more particularly to a heat dissipation module with an increased heat dissipation area.

2. Description of the Related Art

With the constant development of technologies in the electronics field, the performance of electronic component products continuously improves. However, generally speaking, as the performance of an electronic component improves, more heat is generated. Accumulation of the heat on the electronic component leads to a temperature increase of the electronic component. When the heat cannot be effectively dissipated from the electronic component to lower the temperature of the electronic component, the electronic component may break down, or even burn out. Therefore, compared with the issue of improving performance of the electronic component, how to effectively dissipate the heat thereof is a more common problem encountered in the electronics field.

Generally, water-cooled heat dissipation devices and air-cooled heat dissipation devices are used to dissipate the heat generated by the electronic components in the industry. The heat dissipation principle of the water-cooled heat dissipation device is to use a compressor or pump to drive a cooling fluid in a cooling tube to exchange heat with the electronic component. Thereby, the heat of the electronic component is dissipated. The heat dissipation principle of the air-cooled heat dissipation device is to use a fan to guide cool air to flow by the electronic component for heat exchange to dissipate the heat of the electronic component. Compared with the water-cooled heat dissipation device, the air-cooled heat dissipation device does not require the compressor, the pump and the cooling fluid. Thus, the air-cooled heat dissipation device is more competitive in terms of cost. Therefore, the air-cooled heat dissipation device is commonly used to dissipate the heat of the electronic component in the industry.

However, the existing air-cooled heat dissipation device still cannot effectively dissipate the heat generated by high-level electronic components that are available on the market. Therefore, given the cost and the heat dissipation performance, it is necessary to develop an air-cooled heat dissipation device with higher heat dissipation performance.

SUMMARY OF THE INVENTION

An embodiment of the disclosure provides a heat dissipation module comprising a plurality of heat sink fins. The heat sink fins are assembled to one another along an assembly axis. Each of the heat sink fins comprises a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus does not limit the disclosure, wherein:

FIG. 1 is a perspective view of a heat dissipation module according to a first embodiment of the disclosure;

FIG. 2 is a sectional view in FIG. 1;

FIG. 3 is a sectional view of a heat sink fin in FIG. 1;

FIG. 4 is a sectional view of a heat sink fin according to a second embodiment;

FIG. 5A is a sectional view of a heat sink fin according to a third embodiment;

FIG. 5B is a sectional view of a heat sink fin according to a fourth embodiment;

FIG. 5C is a sectional view of a heat sink fin according to a fifth embodiment; and

FIG. 6 is a sectional view of a heat sink fin according to a sixth embodiment.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

Please refer to FIG. 1 to FIG. 3. FIG. 1 is a perspective view of a heat dissipation module according to a first embodiment of the disclosure. FIG. 2 is a sectional view in FIG. 1. FIG. 3 is a sectional view of a heat sink fin in FIG. 1.

A heat dissipation module 10 of this embodiment comprises multiple heat sink fins 100 and a heat pipe 200. The heat sink fins 100 are assembled to one another along an assembly axis (the direction indicated by an arrow ‘a’), and the heat pipe 200 runs through the heat sink fins 100 along the assembly axis. Each of the heat sink fins 100 comprises a main body 105 and an extension plate 140. The extension plate 140 extends from one side of the main body 105 towards an opposite side of the main body 105, and an acute angle θ is formed between the extension plate 140 and the main body 105. Each of the extension plates 140 is located between the main bodies 105 of the two heat sink fins 100 adjacent to each other.

Specifically, the main body 105 comprises a first plate body 110, a second plate body 120 and a third plate body 130. The second plate body 120 and the third plate body 130 are connected to the two opposite sides of the first plate body 110 respectively. Therefore, in this embodiment, the cross section of the main body 105 is U-shaped. The extension plate 140 is connected to the second plate body 120, and extends from the second plate body 120 towards the third plate body 130. Thereby, the heat dissipation area of the heat sink fin 100 is increased. An acute angle θ is formed between the extension plate 140 and the first plate body 110. In this embodiment, the extension plate 140 is leaned against the third plate body 130. An acute angle θ is formed between the extension plate 140 and the second plate body 120. In other words, a clearance between one end of the extension plate 140 adjacent to the second plate body 120 and the first plate body 110 is greater than that between one end of the extension plate 140 adjacent to the third plate body 130 and the first plate body 110. In addition, the assembly axis is towards a direction perpendicular to the first plate body.

In this embodiment, since an acute angle is formed between the extension plate 140 and the second plate body 120, a sufficient space is provided for air flowing between the extension plate 140 and the two first plate bodies 110 adjacent to each other. Thereby, a high heat dissipation efficiency is achieved. Therefore, in a limited space, the extension plate 140 of the heat dissipation module 10 of this embodiment increases the heat dissipation area of the heat dissipation module 10 and the angle between the extension plate 140 and the second plate body 120 maintains an air-flow space inside the heat sink fins 100 such that an airflow may flow through the heat sink fins 100. Thereby the heat dissipation efficiency of the heat dissipation module 10 is improved.

In this embodiment, the heat pipe 200 runs through the first plate bodies 110 and the extension plates 140 at the same time, so as to transfer heat absorbed by the heat pipe 200 to the first plate bodies 110 and the extension plates 140 for dissipation.

In this embodiment, the heat dissipation module 10 comprises the heat pipe 200, but the disclosure is not limited thereto. In other embodiments, the heat dissipation module 10 may not comprise the heat pipe 200.

The extension plate 140 according to the embodiment in FIG. 1 is leaned against the third plate body 130, but the disclosure is not limited thereto. In other embodiments, the extension plate 140 also may not be leaned against the third plate body 130. Referring to FIG. 4, FIG. 4 is a sectional view of a heat sink fin according to a second embodiment. The heat dissipation module 10 of this embodiment comprises multiple heat sink fins 100 and a heat pipe 200. The heat sink fins 100 are assembled to one another along an assembly axis (the direction indicated by the arrow ‘a’). Moreover, the heat pipe 200 runs through the heat sink fins 100 along the assembly axis.

Each of the heat sink fins 100 comprises a main body 105 and an extension plate 140. Specifically, the main body 105 comprises a first plate body 110, a second plate body 120 and a third plate body 130. The second plate body 120 and the third plate body 130 extend from the two opposite ends of the first plate body 110 towards the same side of the first plate body 110 respectively. The extension plate 140 is connected to the second plate body 120 as well as extends towards the third plate body 130. Thereby, the heat dissipation area of the heat sink fin 100 is increased. In this embodiment, the extension plate 140 is not pressed against the third plate body 130. That is, the extension plate 140 is separated from the third plate body 130. In addition, in this embodiment, the length of the extension plate 140 is about half of that of the first plate body 110, but the disclosure is not limited thereto. In other embodiments, the length of the extension plate 140 may be adjusted according to actual needs.

In the embodiment in FIG. 1, the cross section of the main body 105 is a U-shaped structure, but the disclosure is not limited thereto. In other embodiments, the cross section of the main body 105 may be an L-shaped structure, an L-like shaped structure or an I-shaped structure. Please refer to FIG. 5A, FIG. 5B, FIG. 5C and FIG. 6. FIG. 5A is a sectional view of a heat sink fin according to a third embodiment. FIG. 5B is a sectional view of a heat sink fin according to a fourth embodiment. FIG. 5C is a sectional view of a heat sink fin according to a fifth embodiment. FIG. 6 is a sectional view of a heat sink fin according to a sixth embodiment. As shown in FIG. 5A, the heat sink fin 100 of this embodiment comprises a main body 105 and an extension plate 140. The main body 105 comprises a first plate body 110 and a second plate body 120. The second plate body 120 is disposed on one side of the first plate body 110. That is, the cross section of the main body 105 is an L-shaped structure. The extension plate 140 extends from the second plate body 120 towards the other side of the first plate body 100. Moreover, an acute angle θ is formed between the extension plate 140 and the second plate body 120.

As shown in FIG. 5B, the heat sink fin 100 of this embodiment comprises a main body 105 and an extension plate 140. The main body 105 comprises a first plate body 110 and a second plate body 120. The second plate body 120 is disposed on one side of the first plate body 110. That is, the cross section of the main body 105 is an L-shaped structure. One side of the first plate body 110 of the extension plate 140 away from the second plate body 120 extends towards the second plate body 120. Furthermore, an acute angle θ is formed between the extension plate 140 and the first plate body 110.

As shown in FIG. 5C, the heat sink fin 100 of this embodiment comprises a main body 105 and an extension plate 140. The main body 105 comprises a first plate body 110 and a second plate body 120. The second plate body 120 is connected to one side of the first plate body 110. An obtuse angle is formed between the second plate body 120 and the first plate body 110. That is, the cross section of the main body 105 is an L-like shaped structure. The extension plate 140 extends from the second plate body 120 towards the other side of the first plate body 110. Moreover, an acute angle θ is formed between the extension plate 140 and the second plate body 120.

As shown in FIG. 6, the heat sink fin 100 of this embodiment comprises a main body 105 and an extension plate 140. The main body 105 comprises a first plate body 110. That is, the cross section of the main body 105 is an I-shaped structure. The extension plate 140 extends from one side of the first plate body 110 towards the other side of the first plate body 110. Also, an acute angle θ is formed between the extension plate 140 and the first plate body 110.

According to the heat dissipation module of the disclosure, the heat sink fin is provided with the extension plate to increase the heat dissipation area of the heat sink fin, and an acute angle is formed between the extension plate and the main body. Therefore, a sufficient space is provided for air flowing between the extension plate and the main body, so as to enable the heat dissipation module to achieve a higher heat dissipation efficiency.

Claims

1. A heat dissipation module, comprising a plurality of heat sink fins, the heat sink fins being assembled to one another along an assembly axis, and each of the heat sink fins comprising:

a main body; and
an extension plate, extending from one side of the main body towards an opposite side of the main body, an acute angle being formed between the extension plate and the main body;
wherein each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.

2. The heat dissipation module according to claim 1, wherein the main body comprises a first plate body and a second plate body, the second plate body is connected to one side of the first plate body, and an obtuse angle is formed between the second plate body and the first plate body, the extension plate extends from the second plate body towards the other side of the first plate body, and an acute angle is formed between the extension plate and the second plate body.

3. The heat dissipation module according to claim 1, wherein the main body comprises a first plate body and a second plate body, the second plate body is disposed on one side of the first plate body, the extension plate extends from the second plate body towards the other side of the first plate body, and an acute angle is formed between the extension plate and the second plate body.

4. The heat dissipation module according to claim 3, wherein one side of the first plate body of the extension plate away from the second plate body extends towards the second plate body, and an acute angle is formed between the extension plate and the first plate body.

5. The heat dissipation module according to claim 1, wherein the main body comprises a first plate body, a second plate body and a third plate body, the second plate body and the third plate body are connected to two opposite sides of the first plate body respectively, the extension plate is connected to the second plate body as well as extends from the second plate body towards the third plate body, and an acute angle is formed between the extension plate and the second plate body.

6. The heat dissipation module according to claim 5, wherein the extension plate is separated from the second plate body.

7. The heat dissipation module according to claim 5, wherein the extension plate is against the third plate body.

8. The heat dissipation module according to claim 1, further comprising a heat pipe, the heat pipe running through the heat sink fins along the assembly axis

9. The heat dissipation module according to claim 1, wherein the main body is an I-shaped module, a C-shaped module, an L-shaped module or an L-like shaped module.

Patent History

Publication number: 20140116655
Type: Application
Filed: Mar 13, 2013
Publication Date: May 1, 2014
Applicants: INVENTEC CORPORATION (Taipei), Inventec (Pudong) Technology Corporation (Shanghai)
Inventors: Yi-Lun Cheng (Taipei), Chih-Kai Yang (Taipei), Hua-Feng Chen (Taipei)
Application Number: 13/798,606

Classifications

Current U.S. Class: Utilizing Capillary Attraction (165/104.26); With Means Spacing Fins On Structure (165/182)
International Classification: F28F 1/14 (20060101); F28D 15/04 (20060101);