Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a substrate of a first conductivity; a first region of the first conductivity formed in the substrate; a second region of the first conductivity formed in the first region, wherein the second region has a higher doping density than the first region; a source region of a second conductivity formed in the second region; a drain region of the second conductivity formed in the substrate; a pickup region of the first conductivity formed in the second region and adjacent to the source region; and a resist protective oxide (RPO) layer formed on a top surface of the second region. An associated fabricating method is also disclosed.

Abstract: The present disclosure relates an integrated circuit (IC) and a method for manufacturing same. A polysilicon layer is formed over a first region of a substrate and has a plurality of polysilicon structures that are packed with respect to one another to define a first packing density. A dummy layer is formed over a second region of the substrate and has a plurality of dummy structures that are packed with respect to one another to define a second packing density, where the first packing density and second packing density are substantially similar. An inter-layer dielectric layer is formed over the first region and second region of the substrate. Dishing of at least the second region of the substrate concurrent with a chemical-mechanical polish is generally inhibited by the first packing density and second packing density after forming the inter-layer dielectric layer.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a substrate of a first conductivity; a first region of the first conductivity formed in the substrate; a second region of the first conductivity formed in the first region, wherein the second region has a higher doping density than the first region; a source region of a second conductivity formed in the second region; a drain region of the second conductivity formed in the substrate; a pickup region of the first conductivity formed in the second region and adjacent to the source region; and a resist protective oxide (RPO) layer formed on a top surface of the second region. An associated fabricating method is also disclosed.

Abstract: A semiconductor package includes a cover, a substrate, at least one semiconductor device and at least one corner stiffener. The cover has at least one corner portion. The substrate is in force communication with the cover. The substrate has at least one corner portion. The semiconductor device is present between the cover and the substrate. The corner stiffener is present on at least one of the corner portion of the cover and the corner portion of the substrate.

Abstract: The present invention provides a door access management method applicable to a building. The building includes a plurality of areas. The door access management method includes setting access information of an access card, the access information marking accessible entrances of the access card in the building; arranging an electronic lock on a door for controlling access of an entrance of a corresponding area in the building; the electronic lock storing information of the entrance controlled by the electronic lock; the electronic lock sensing the access card for receiving the access information of the access card; the electronic lock comparing the access information with the information of the entrance controlled by the electronic lock; and unlocking the electronic lock when an accessible entrance marked by the access information corresponds to the information of the entrance controlled by the electronic lock.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a substrate of a first conductivity; a first region of the first conductivity formed in the substrate; a second region of the first conductivity formed in the first region, wherein the second region has a higher doping density than the first region; a source region of a second conductivity formed in the second region; a drain region of the second conductivity formed in the substrate; a pickup region of the first conductivity formed in the second region and adjacent to the source region; and a resist protective oxide (RPO) layer formed on a top surface of the second region. An associated fabricating method is also disclosed.

Abstract: A semiconductor device includes a transistor. The transistor includes an active region in a substrate, a patterned conductive layer being a portion of an interconnection layer for routing, and an insulating layer extending over the substrate and configured to insulate the active region from the patterned conductive layer. The patterned conductive layer and the insulating layer serve as a gate of the transistor.

Abstract: A method includes forming an isolation region extending into a semiconductor substrate, etching a top portion of the isolation region to form a recess in the isolation region, and forming a gate stack extending into the recess and overlapping a lower portion of the isolation region. A source region and a drain region are formed on opposite sides of the gate stack. The gate stack, the source region, and the drain region are parts of a Metal-Oxide-Semiconductor (MOS) device.

Abstract: A polyurethane based asphalt composition includes an asphalt component and a polyurethane resin system that is the reaction product of an isocyanate component that includes at least one polyisocyanate and an isocyanate-reactive component that includes a cardanol-modified epoxy polyol. The cardanol-modified epoxy polyol is a reaction product of an epoxy component and an epoxy-reactive component at a ratio of epoxy groups to epoxy reactive groups from 1:0.95 to 1:5. The epoxy-reactive component includes a cardanol component.

Abstract: A method and device for estimating central aortic pulse pressure by cuff pressure pulse wave oscillation signals. The method comprises (I) providing an equation for estimating central aortic pulse pressure; (II) measuring pressure pulse wave oscillation signals in a cuff, which comprise a brachial systolic blood pressure, a diastolic blood pressure and a waveform of the pressure pulse wave oscillation signals in the cuff; (III) averaging the waveform of the pressure pulse wave oscillation signals and calibrating the averaged waveform; (IV) analyzing the calibrated pressure pulse wave oscillation signal waveform to obtain a plurality of predicting variables; and (V) obtaining an estimate of the central aortic pulse pressure by values of predicting variables in step (IV) and the equation in step (I).

Abstract: An electrical connector (500) includes a transformer (100) including a magnetic core (3), a first wire group (1), and a second wire group (2). The magnetic core has a left half (31), a right half (32), and an opening (30). The first and second wire groups each have four wires with different colors. Each wire has a first end, a second end, and a central portion. The central portion of the first wire group is only wound around the left half. The central portion of the second wire group is only wound around the right half.

Abstract: A projection screen includes a substrate and an optical microstructure. The substrate has a projection area for projecting an image onto the projection area. The projection area includes a plurality of arrayed optical regions. Each of the optical regions includes a first and second optical sub-region with optical characteristics of reflective scattering/transmissive scattering/specular reflection and simple transmission, wherein an area of the second optical sub-region is larger than that of the first optical sub-region. The optical microstructure is arranged on the substrate for guiding the light of the image to a specific direction. The above-mentioned projection screen with two or more optical characteristics, for example, can be at the same time as the front projection screen and the rear projection screen, or allows the user to watch background image behind the projection screen. A projection system including the above-mentioned projection screen is also disclosed.

Abstract: An electric rivet nut tool has a motor, a torque adjuster and a control device. The control device drives the motor to rotate a driving shaft so as to set a rivet nut. The torque adjuster serves to adjust a preset torque value. When a torque generated by the driving shaft exceeds the preset torque value of the torque adjuster and it represents that the rivet nut setting job is completed, the torque adjuster then displace for the control device to detect the displacement and drive the motor to reversely rotate. Given the torque adjuster and the control device, the problems of being time-consuming, inefficient, increasing in cost and damage prone to rivet nut or motor upon setting rivet nut because of the manual switch of forward or reverse rotation of an electric rivet nut tool can be effectively resolved.

Abstract: A polyurethane based asphalt composition includes an asphalt component and a polyurethane resin system that is the reaction product of an isocyanate component that includes at least one polyisocyanate and an isocyanate-reactive component that includes a cardanol-modified epoxy polyol. The cardanol-modified epoxy polyol is a reaction product of an epoxy component and an epoxy-reactive component at a ratio of epoxy groups to epoxy reactive groups from 1:0.95 to 1:5. The epoxy-reactive component includes a cardanol component.

Abstract: A modular jack has an insulative housing, two adjacent internal modules, and a middle shield disposed between the adjacent internal modules. The insulative housing has a front wall and a plurality of openings therein configured as pairs of first and second aligned openings, and a receptacle located behind the openings. Each opening is configured to receive a plug connector therein in a front-to-back direction. The middle shield extends towards a front wall of the insulative to define two module receiving cavities each receiving one internal module. The middle shield includes a conductive plate and an insulative sheet affixed thereto. The insulative sheet faces to the internal modules for insulation between the internal modules and the conductive plate. The insulative sheet is very thin that it occupies little space of the receptacle, thereby reducing a size of the modular jack.

Abstract: A programming system for device control is disclosed. The system includes a development board scanning module, a web server, and a working host. An application programming interface packaging module in the working host is a key part to translate high-level programming language codes into low-level programming language codes. Thus, using high-level programming language or interface to implement equipment control or development work becomes feasible.

Abstract: A sunlight manipulating device includes a light focusing module and a light deflection module. The light focusing module is configured for converging incident sunlight on a focal region. The light deflection module is arranged on the focal region or adjacent to the focal region and configured for deflecting the converged sunlight to a target area, wherein the target area is diverged from an optical axis of the light focusing module. The above-mentioned sunlight manipulating device allows more diverse configurations for solar cells, heating devices and light guide elements or the like means.

Abstract: A process for producing a circuit-breaker pole part for use in a medium-voltage or high-voltage circuit-breaker comprising adjoining (a) an inner vacuum interrupter layer, (b) an intermediate compensation layer, and (c) an outer insulating sleeve layer, wherein the intermediate compensation layer is disposed between the inner vacuum interrupter layer and the outer insulating sleeve layer; wherein said layers are integrated with each other to form a circuit-breaker pole part; and wherein the intermediate compensation layer comprises the reaction product of (I) an epoxy-terminated prepolymer and (II) a curing agent; and a circuit-breaker pole part produced by the above process.

Abstract: The present invention provides a multi-spiral optical device, which comprises a base and a plurality of spiral channels. The plurality of spiral channels are formed on the base and include a first port and a second port, respectively. The plurality of first ports are located at the center of the base; the plurality of second ports are located at the periphery of the base. Thereby, the multi-spiral optical device can form a light concentrating device. In addition, a fluid can be filled to or drawn from one or more of the plurality of spiral channels for switching the optical state of the multi-spiral optical device. By filling or drawing the fluid to or from the plurality of spiral channels selectively, they can be switched to a light-pervious, a sheltering, or a light-concentrating state according to users' requirements.

Abstract: An intelligent device is configured to provide relevant information related to an image. The intelligent device includes a sensor module, an activation module, an image capture module, an image recognition module, and an information providing module. The sensor module includes a magnetometer and a gyroscope. The magnetometer detects a direction of a gesture relative to the intelligent device. The gyroscope detects at least one angular velocity of the gesture. The activation module determines the gesture according to the direction and the angular velocities, and generates an activating signal according to the gesture determined. The image capture module captures the image according to the activation signal. The image recognition module identifies the image to retrieve relevant information related to the image. The information providing module provides the relevant information.