Abstract: A method for manufacturing a memory device is provided. The method includes etching an opening in a first dielectric layer; forming a bottom electrode, a resistance switching element, and a top electrode in the opening in the first dielectric layer; forming a second dielectric layer over the bottom electrode, the resistance switching element, and the top electrode; and forming an electrode via connected to a top surface of the top electrode in the second dielectric layer.

Abstract: A method of forming a semiconductor structure includes forming a first conductive contact in a first dielectric layer coupled to a first device and forming a second conductive contact in the first dielectric layer coupled to a second device. A first trench is formed in the first dielectric layer having a first depth and exposing at least a portion of the first conductive contact. A second trench is formed in the first dielectric layer having a second depth different than the first depth and exposing at least a portion of the second conductive contact. A first conductive layer is formed in the first trench and the second trench. A second dielectric layer is formed in the first trench and the second trench over the first conductive layer.

Abstract: Devices and methods of manufacture for a graduated, “step-like,” semiconductor structure having two or more resonator trenches. A semiconductor structure may comprise a first resonator and a second resonator. The first resonator comprising a first metallic resonance layer and a capping plate having a bottom surface that is a first distance from a distal end of the first metallic resonance layer 128. The second resonator comprising a second metallic resonance layer and the capping plate, in which the bottom surface is a second distance from a from a distal end of the second metallic resonance layer 128b, and in which first distance is different from the second distance.

Abstract: In an example implementation according to aspects of the present disclosure, a method may include monitoring a measurement from a sensor disposed within a computing device, filtering out noise from the measurement that is generated by a component of the computing device, determining a usage of the computing device, based on the post-filtered measurement, and adjusting a parameter of the computing device, based on the determined usage.

Abstract: A memory device includes a substrate, an etch stop layer, a protective layer, and a resistance switching element. The substrate has a memory region and a logic region, and includes a metallization pattern therein. The etch stop layer is over the substrate, and has a first portion over the memory region and a second portion over the logic region. The protective layer covers the first portion of the etch stop layer. The protective layer does not cover the second portion of the etch stop layer. The resistance switching element is over the memory region, and the resistance switching element is electrically connected to the metallization pattern through the etch stop layer and the protective layer.

Abstract: An example electronic device includes a wireless communication component and a controller. The controller is to set an output power of the wireless communication component based on: whether a first external object is in proximity to a first side of the electronic device; whether the electronic device is stationary; and whether a second external object is in proximity to a second side of the electronic device, where the second side is opposite to the first side.

Abstract: Examples described herein relate to flexible antenna belts. For instance, a system may comprise a flexible antenna belt, where the flexible antenna belt is to transition between a closed position and an open position, and a flexible display coupled to the flexible antenna belt.

Abstract: An antenna includes a conductive monopole and a non-conductive slot. The non-conductive slot of the antenna has a shape complementary to a shape of the conductive monopole of the antenna. The conductive monopole of the antenna and the non-conductive slot of the antenna are 180-degree rotationally symmetric to one another about a center of the antenna.

Abstract: The present subject matter relates to examples of an antenna assembly that may include a SAR correction element. The antenna assembly may include a radiation body that can have transceiver portion and non-transceiver portion, such that the transceiver portion may send and receive a wireless signal. In one example, the SAR correction element may be electrically coupled between the non-transceiver portion and a ground plane in order to dissipate energy from the non-transceiver portion to the ground in way that the SAR correction element does not accumulate energy therein while dissipating the energy to the ground.

Abstract: Examples of slot antennas are described herein. In an example, the slot antenna includes a substrate and an antenna element disposed on the substrate to transmit and receive signals. The substrate is porous.

Abstract: A dual-mode signal amplifying circuit includes: a first and a second input terminals for receiving differential input signals; two output terminals for providing differential output signals; a first through a third current sources; a first switch positioned between the first current source and a first node, and controlled by the first input terminal; a second switch positioned between the first current source and a second node, and controlled by the second input terminal; a third switch positioned between the first node and a fixed-voltage terminal, and controlled by a third node; a fourth switch positioned between the second node and a fixed-voltage terminal and controlled by the third node; a fifth switch positioned between the second current source and a fixed-voltage terminal, and controlled by the first node; and a sixth switch positioned between the third current source and a fixed-voltage terminal, and controlled by the second node.

Abstract: An apparatus is provided for testing a PCIe interface on a printed circuit assembly. The apparatus can include a plurality of electrical contacts to couple to a PCIe interface of the printed circuit assembly, wherein a respective electrical contact corresponds to a pin of the PCIe interface. The apparatus can also include a plurality of resistors. Each resistor is coupled between two adjacent electrical contacts. At least one electrical contact corresponds to a ground, power, or not connected (NC) pin of the PCIe interface, thereby allowing a loopback test to determine connectivity between the pins of the PCIe interface and the printed circuit assembly.

Abstract: The present disclosure relates to an electromagnetic interference shield. The electromagnetic interference shield comprises a composite film that comprises a first carbon layer comprising an electrically conducting carbon material; a second carbon layer comprising an electrically conducting carbon material; and a porous layer between the first carbon layer and second carbon layer.

Abstract: An example electronic device includes a wireless communication component and a controller. The controller is to set an output power of the wireless communication component based on: whether a first external object is in proximity to a first side of the electronic device; whether the electronic device is stationary; and whether a second external object is in proximity to a second side of the electronic device, where the second side is opposite to the first side.

Abstract: Dual band slot antenna is described. The dual band slot antenna includes a ground plane having a slot, a conductive patch, a dielectric substrate disposed between the conductive patch and the ground plane, and a coaxial cable fastened on the conductive patch to form a first loop region and a second loop region of different sizes for dual band operation.

Abstract: A memory device includes a substrate, an etch stop layer, a protective layer, and a resistance switching element. The substrate has a memory region and a logic region, and includes a metallization pattern therein. The etch stop layer is over the substrate, and has a first portion over the memory region and a second portion over the logic region. The protective layer covers the first portion of the etch stop layer. The protective layer does not cover the second portion of the etch stop layer. The resistance switching element is over the memory region, and the resistance switching element is electrically connected to the metallization pattern through the etch stop layer and the protective layer.

Abstract: The present disclosure is drawn to an electronic device including a substrate, an electronic component carried by the substrate, an EMI protection film over-molded on the electronic component, and an adhesive layer directly adhering the EMI protection film to the electronic component. The EMI protection film includes a ferromagnetic material.

Abstract: A receiving device comprises a first receiving circuit, for receiving a plurality of signals and comparing a plurality of signal powers of the plurality of signals with a first threshold, to generate a first plurality of comparison results; a second receiving circuit, for receiving the plurality of signals and comparing the plurality of signal powers of the plurality of signals with a second threshold, to generate a second plurality of comparison results, wherein the first threshold is smaller than the second threshold; and a control circuit, coupled to the first receiving circuit and the second receiving circuit, for determining whether an average signal power of the plurality of signals is greater than a reference power according to the first plurality of comparison results and the second plurality of comparison results, to generate a determination result.

Abstract: An example base cover for a lower housing of a convertible computing device includes a first metallic structure positioned in the lower housing, and a second metallic structure electrically isolated from the first metallic structure. The second metallic structure is positioned in the lower housing and directly below an antenna slot defined in an upper housing of the convertible computing device when the upper housing is positioned over and parallel to the lower housing.

Abstract: Examples of an antenna are described herein. Some examples of the antenna include an antenna holder. In some examples, the antenna holder is situated on a metal cover and a metal surface is situated on a side of the antenna holder to create an in-phase image current on the metal cover.