Patents by Inventor Huei-Che Yu

Huei-Che Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10962569
    Abstract: Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: March 30, 2021
    Assignees: Nidec-Read Corporation, SV Probe Technology Taiwan Co., Ltd.
    Inventors: Michio Kaida, Huei Che Yu
  • Publication number: 20190353684
    Abstract: Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 21, 2019
    Applicants: Nidec-Read Corporation, SV Probe Technology Taiwan Co., Ltd.
    Inventors: Michio KAIDA, Huei Che Yu
  • Patent number: 9130317
    Abstract: A connector assembly includes a first connector and a second connector. The first connector is coupled to a first electronic device, and the second connector is coupled to a second electronic device and detachably mated with the first connector. The first connector includes a first housing and a magnetic member. The magnetic member is installed inside the first housing and for generating magnetic field. The second connector includes a second housing and a magnetic sensor disposed in the second housing. The magnetic sensor senses the magnetic field generated by the magnetic member when the second connector is mated with the first connector, so as to drive the second electronic device to power the first electronic device.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: September 8, 2015
    Assignee: C.C.P. Contact Probes Co., Ltd.
    Inventors: Hsin-Chieh Wang, Wei-Chu Chen, Yuan-Hsiang Shen, Hsiao-Wei Liu, Yu-Min Cheng, Yen-Ching Su, Huei-Che Yu, Bor-Chen Tsai
  • Publication number: 20150017831
    Abstract: A connector assembly includes a first connector and a second connector. The first connector is coupled to a first electronic device, and the second connector is coupled to a second electronic device and detachably mated with the first connector. The first connector includes a first housing and a magnetic member. The magnetic member is installed inside the first housing and for generating magnetic field. The second connector includes a second housing and a magnetic sensor disposed in the second housing. The magnetic sensor senses the magnetic field generated by the magnetic member when the second connector is mated with the first connector, so as to drive the second electronic device to power the first electronic device.
    Type: Application
    Filed: January 23, 2014
    Publication date: January 15, 2015
    Inventors: Hsin-Chieh Wang, Wei-Chu Chen, Yuan-Hsiang Shen, Hsiao-Wei Liu, Yu-Min Cheng, Yen-Ching Su, Huei-Che Yu, Bor-Chen Tsai
  • Publication number: 20020063520
    Abstract: An LED device has a light emitting chip covered by a pre-formed fluorescent plate for emitting white light. The light emitting chip is located in a chip holder. The pre-formed fluorescent plate is positioned above the light emitting chip and supported by the chip holder. Transparent resin is used to seal the void formed between the chip holder and the pre-formed fluorescent plate. Because the thickness and flatness of the pre-formed fluorescent plate can be easily controlled, white light emitted from the LED device has high quality as well as good uniformity.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 30, 2002
    Inventors: Huei-Che Yu, Yen-Cheng Chen, Kuo-Hsin Huang, Sheng-Bang Huang, Jyh-Jong Luo
  • Patent number: D894025
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: August 25, 2020
    Assignees: NIDEC-READ CORPORATION, SV PROBE TECHNOLOGY TAIWAN CO., LTD.
    Inventors: Michio Kaida, Huei Che Yu