Abstract: Systems and methods are provided for point cloud processing with an equivariant neural network and implicit shape learning that may produce correspondence-free registration. The systems and methods may provide for feature space preservation with the same rotation operation as a Euclidean input space, due to the equivariance property, which may provide for solving the feature-space registration in a closed form.

Abstract: The present disclosure provides a structure and method of fabricating the structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the feature, wherein the dielectric layer includes a first surface in contact with the feature and a second surface opposite to the first surface is positioned toward the cavity.

Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.

Abstract: Various embodiments of the present disclosure are directed towards a camera module comprising flat lenses. Flat lenses have reduced thicknesses compared to other types of lenses, whereby the camera module may have a small size and camera bumps may be omitted or reduced in size on cell phones and the like incorporating the camera module. The flat lenses are configured to focus visible light into a beam of white light, split the beam into sub-beams of red, green, and blue light, and guide the sub-beams respectively to separate image sensors for red, green, and blue light. The image sensors generate images for corresponding colors and the images are combined into a full-color image. Optically splitting the beam into the sub-beams and using separate image sensors for the sub-beams allows color filters to be omitted and smaller pixel sensors. This, in turn, allows higher quality imaging.

Abstract: An augmented virtual vehicle testing system and method for presenting graphics to a vehicle operator during operation of a vehicle. The method includes: determining a position of a vehicle operator within a vehicle testing environment; executing an augmentative simulation of the vehicle testing environment, wherein the augmentative simulation is used to provide a position of one or more virtual objects within the vehicle testing environment; generating graphics representing the one or more virtual objects based on the position of the vehicle operator and the position of the one or more virtual objects within the vehicle testing environment; and presenting the graphics on an electronic display and to the vehicle operator during operation of the vehicle.

Abstract: An optical device includes a substrate, a first electrode, a second electrode, and a first lens. The first electrode and the second electrode are over the substrate and configured to generate a first electric field. The first lens is between the first electrode and the second electrode and has a focal length that varies in response to the first electric field applied to the first lens.

Abstract: The present disclosure provides a structure and method of fabricating the structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the feature, wherein the dielectric layer includes a first surface in contact with the feature and a second surface opposite to the first surface is positioned toward the cavity.

Abstract: Optical modules and methods of forming the same are provided. In an embodiment, an exemplary method includes forming multiple first optical elements over a first wafer, forming multiple second optical elements over a second wafer, forming multiple third optical elements over a third wafer, aligning the first wafer with the second wafer such that, upon the aligning of the first wafer with the second wafer, each first optical element is vertically overlapped with a corresponding second optical element. The method also includes bonding the first wafer with the second wafer to form a first bonded structure, aligning the second wafer with the third wafer such that, and upon bonding the second wafer of the first bonded structure to the third wafer, where upon the aligning of the second wafer with the third wafer, each second optical element is vertically overlapped with a corresponding third optical element.

Abstract: The present disclosure provides a structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the feature, wherein the dielectric layer includes a first surface in contact with the feature and a second surface opposite to the first surface is positioned toward the cavity.

Abstract: A roadmanship system comprises a computational device and a vehicle comprising a plurality of sensors and a vehicle control system in communication with the computational device and the plurality of sensors. The computational device can be configured to: (i) receive driving data from a group of vehicles; (ii) calculate a regression curve based on the driving data; (iii) calculate a threshold value of an engineering parameter based on the regression curve and a predetermined roadmanship level; and (iv) output the threshold value to the vehicle control system. The vehicle control system can be configured to: (a) receive the threshold value from the computational device; (b) receive operational information associated with at least one of the vehicle and a driving environment surrounding the vehicle from the plurality of sensors; and (c) cause the vehicle to perform a vehicle maneuver based on the threshold value and the operational information.

Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

Abstract: An augmented virtual vehicle testing system and method for presenting graphics to a vehicle operator during operation of a vehicle. The method includes: determining a position of a vehicle operator within a vehicle testing environment; executing an augmentative simulation of the vehicle testing environment, wherein the augmentative simulation is used to provide a position of one or more virtual objects within the vehicle testing environment; generating graphics representing the one or more virtual objects based on the position of the vehicle operator and the position of the one or more virtual objects within the vehicle testing environment; and presenting the graphics on an electronic display and to the vehicle operator during operation of the vehicle.

Abstract: A system and method for determining a predicted trajectory of a human-driven host vehicle as the human-driven host vehicle approaches a traffic signal. The method includes: obtaining a host vehicle-traffic light distance dx and a longitudinal host vehicle speed vx that are each taken when the human-driven host vehicle approaches the traffic signal; obtaining a traffic light signal phase Pt and an traffic light signal timing Tt; obtaining a time of day TOD; providing the host vehicle-traffic light distance dx, the longitudinal host vehicle speed vx, the traffic light signal phase Pt, the traffic light signal timing Tt, and the time of day TOD as input into an artificial intelligence (AI) vehicle trajectory prediction application, wherein the AI vehicle trajectory prediction application implements an AI vehicle trajectory prediction model; and determining the predicted trajectory of the human-driven host vehicle using the AI vehicle trajectory prediction application.

Abstract: Systems and methods are provided for point cloud processing with an equivariant neural network and implicit shape learning that may produce correspondence-free registration. The systems and methods may provide for feature space preservation with the same rotation operation as a Euclidean input space, due to the equivariance property, which may provide for solving the feature-space registration in a closed form.

Abstract: Methods and systems for calibrating a hybrid vehicle system for simplified control of the powertrain to optimize fuel efficiency of the hybrid vehicle and for operating a hybrid vehicle powertrain accordingly. The optimization mechanism reduces the optimized control problem to a single degree-of-freedom. Accordingly, during real-time operation of the hybrid vehicle, the system is able to quickly identify and apply optimized operating settings for a particular driver demand and, in some implementations, to provide a particular rate of change of the state-of-charge of the battery of the hybrid vehicle.

Abstract: A method for manufacturing a MEMS structure is provided. The method includes providing a MEMS substrate having a first surface, forming a first buffer layer on the first surface of the MEMS substrate, and forming a first roughening layer on the first buffer layer. Also, a MEMS structure is provided. The MEMS structure includes a MEMS substrate, a first buffer layer, a first roughening layer, and a CMOS substrate. The MEMS substrate has a first surface and a pillar is on the first surface. The first buffer layer is on the first surface. The first roughening layer is on the first buffer layer. The CMOS substrate has a second surface and is bonded to the MEMS substrate via the pillar. Moreover, an air gap is between the first roughening layer and the second surface of the CMOS substrate.

Abstract: A roadmanship system comprises a computational device and a vehicle comprising a plurality of sensors and a vehicle control system in communication with the computational device and the plurality of sensors. The computational device can be configured to: (i) receive driving data from a group of vehicles; (ii) calculate a regression curve based on the driving data; (iii) calculate a threshold value of an engineering parameter based on the regression curve and a predetermined roadmanship level; and (iv) output the threshold value to the vehicle control system. The vehicle control system can be configured to: (a) receive the threshold value from the computational device; (b) receive operational information associated with at least one of the vehicle and a driving environment surrounding the vehicle from the plurality of sensors; and (c) cause the vehicle to perform a vehicle maneuver based on the threshold value and the operational information.

Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.

Abstract: A flow cell includes: a first substrate; a second substrate; a first resin layer disposed over an inner surface of the first substrate; a second resin layer disposed over an inner surface of the second substrate; a first plurality of biological capture sites located at the first resin layer; a second plurality of biological capture sites located at the second resin layer; and a polymer layer interposed between the first resin layer and the second resin layer, such that the first substrate is attached to the second substrate via at least the first resin layer, the polymer layer, and the second resin layer, wherein the polymer layer defines a plurality of microfluidic channels that extend through polymer layer.

Abstract: The present disclosure relates to a method of forming an integrated chip structure. The method includes forming a plurality of interconnect layers within a dielectric structure over a substrate. A dielectric layer arranged along a top of the dielectric structure is patterned to define a via hole exposing an uppermost one of the plurality of interconnect layers. An extension via is formed within the via hole and one or more conductive materials are formed over the dielectric layer and the extension via. The one or more conductive materials are patterned to define a sensing electrode over and electrically coupled to the extension via. A microelectromechanical systems (MEMS) substrate is bonded to the substrate. The MEMs substrate is vertically separated from the sensing electrode.