Patents by Inventor Hugh Dick

Hugh Dick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SCRIBE BASED BOND PADS FOR INTEGRATED CIRCUITS
    Publication number: 20090278124
    Abstract: An apparatus including a semiconductor substrate is disclosed. A first semiconductor die is disposed on the semiconductor substrate. A first bond out pad is disposed on the semiconductor substrate adjacent to the first semiconductor die. A first sawn semiconductor die is disposed on the semiconductor substrate adjacent to the first semiconductor die and the first bond out pad.
    Type: Application
    Filed: July 20, 2009
    Publication date: November 12, 2009
    Inventors: Andrew Burnside, Albert Dye, Hugh Dick
  • Scribe based bond pads for integrated circuits
    Patent number: 7563694
    Abstract: A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and system comprises forming bond out pads in the scribe areas such that the bond out pads are disposed on the semiconductor wafer between the plurality of semiconductor die. Additionally, the method and system comprises separating the semiconductor wafer into individual die such that when the semiconductor wafer is separated in a first manner at least one product die is provided. Furthermore, when the semiconductor wafer is separated in a second manner at least one test die is provided.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: July 21, 2009
    Assignee: Atmel Corporation
    Inventors: Andrew Burnside, Albert Dye, Hugh Dick
  • Scribe based bond pads for integrated circuits
    Publication number: 20080128690
    Abstract: A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and system comprises forming bond out pads in the scribe areas such that the bond out pads are disposed on the semiconductor wafer between the plurality of semiconductor die. Additionally, the method and system comprises separating the semiconductor wafer into individual die such that when the semiconductor wafer is separated in a first manner at least one product die is provided. Furthermore, when the semiconductor wafer is separated in a second manner at least one test die is provided.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Inventors: Andrew Burnside, Albert Dye, Hugh Dick