Patents by Inventor HUI-CHI TANG

HUI-CHI TANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230215798
    Abstract: A board-level pad pattern includes a corner pad unit disposed at a corner of a surface mount region for mounting a multi-row QFN package. The corner pad unit includes at least a reversed-L-shaped pad. The reversed-L-shaped pad is disposed in proximity to an apex of the corner of the surface mount region.
    Type: Application
    Filed: December 8, 2022
    Publication date: July 6, 2023
    Applicant: MEDIATEK INC.
    Inventors: Hui-Chi Tang, Shao-Chun Ho, Hsuan-Yi Lin, Pu-Shan Huang
  • Publication number: 20230217591
    Abstract: A board-level pad pattern includes a printed circuit board (PCB) substrate; an exposed pad region disposed within a surface mount region of the base substrate; and multiple staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region. The staggered ball pads includes first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch. Multiple square-shaped ball pads are arranged in a third row between the exposed pad region and the staggered ball pads.
    Type: Application
    Filed: December 8, 2022
    Publication date: July 6, 2023
    Applicant: MEDIATEK INC.
    Inventors: Hui-Chi Tang, Shao-Chun Ho, Hsuan-Yi Lin, Pu-Shan Huang
  • Publication number: 20230215797
    Abstract: A board-level pad pattern includes staggered ball pads disposed within a surface mount region for mounting a multi-row QFN package. The staggered ball pads include first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch.
    Type: Application
    Filed: December 6, 2022
    Publication date: July 6, 2023
    Applicant: MEDIATEK INC.
    Inventors: Hui-Chi Tang, Hsuan-Yi Lin, Shao-Chun Ho, Yi-Wen Chiang, Pu-Shan Huang
  • Patent number: 9846756
    Abstract: A layout method for a printed circuit board (PCB) is provided. The method obtains a memory type of a dynamic random access memory (DRAM) to be mounted on the PCB, obtains a module group from a database according to the memory type of the DRAM, wherein the module group comprises a plurality of routing modules, obtains a plurality of PCB parameters, selects a specific routing module from the module group according to the PCB parameters, and implements the specific routing module into a layout design for PCB fabrication. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: December 19, 2017
    Assignee: MEDIATEK INC
    Inventors: Fu-Kang Pan, Nan-Cheng Chen, Shih-Chieh Lin, Hui-Chi Tang, Ying Liu, Yang Liu, Ching-Chih Li
  • Publication number: 20150379180
    Abstract: A layout method for a printed circuit board (PCB) is provided. The method obtains a memory type of a dynamic random access memory (DRAM) to be mounted on the PCB, obtains a module group from a database according to the memory type of the DRAM, wherein the module group comprises a plurality of routing modules, obtains a plurality of PCB parameters, selects a specific routing module from the module group according to the PCB parameters, and implements the specific routing module into a layout design for PCB fabrication. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
    Type: Application
    Filed: September 2, 2015
    Publication date: December 31, 2015
    Inventors: Fu-Kang PAN, Nan-Cheng CHEN, Shih-Chieh LIN, HUI-CHI TANG, Ying LIU, Yang LIU, Ching-Chih Li
  • Publication number: 20150379184
    Abstract: A printed circuit board (PCB) is provided. The PCB has a specific routing module, having a first chip, a memory chip, and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip. The memory chip is a dynamic random access memory (DRAM) with a memory type, the specific routing module is obtained from a module group comprising a plurality of routing modules according to a plurality of PCB parameters, and module group is obtained from a database according to the memory type of the DRAM.
    Type: Application
    Filed: September 2, 2015
    Publication date: December 31, 2015
    Inventors: Fu-Kang PAN, Nan-Cheng CHEN, Shih-Chieh LIN, HUI-CHI TANG, Ying LIU, Yang LIU, Ching-Chih Li
  • Patent number: 9158880
    Abstract: A layout method for a printed circuit board (PCB) is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group includes a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module includes layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: October 13, 2015
    Assignee: MEDIATEK INC.
    Inventors: Fu-Kang Pan, Nan-Cheng Chen, Shih-Chieh Lin, Hui-Chi Tang, Ying Liu, Yang Liu
  • Publication number: 20140109035
    Abstract: A layout method for a printed circuit board (PCB) is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group includes a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module includes layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 17, 2014
    Applicant: MEDIATEK INC.
    Inventors: Fu-Kang PAN, Nan-Cheng CHEN, Shih-Chieh LIN, HUI-CHI TANG, Ying LIU, Yang LIU