LAYOUT METHOD FOR PRINTED CIRCUIT BOARD
A printed circuit board (PCB) is provided. The PCB has a specific routing module, having a first chip, a memory chip, and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip. The memory chip is a dynamic random access memory (DRAM) with a memory type, the specific routing module is obtained from a module group comprising a plurality of routing modules according to a plurality of PCB parameters, and module group is obtained from a database according to the memory type of the DRAM.
This application is a Continuation of pending U.S. patent application Ser. No. 14/043,197, filed on Oct. 01, 2013 and entitled “LAYOUT METHOD FOR PRINTED CIRCUIT BOARD”, which claims the benefit of China Patent Application No. PCT/CN2012/082884, filed on Oct. 12, 2012, the entirety of which is incorporated by reference herein.
BACKGROUND OF THE INVENTION1. Field of the Invention
The invention relates to a layout method for a printed circuit board (PCB), and more particularly, to a layout method of an embedded multi-chip package (eMCP) for a PCB.
2. Description of the Related Art
Recently, electrical products tend to have higher efficiencies and be smaller. Therefore, sizes of printed circuit boards (PCB) and chips mounted on the PCBs are continuing to be miniaturized, while frequencies of electronic signals transmitted on the PCBs are being increased.
A PCB layout diagram file (design) is created based on a circuit schematic diagram, and includes a plurality of layout modules. When designing a PCB using layout software (e.g. an electronic design automation (EDA) tool), signal performances of the components should be considered. For example, time is needed to arrange the placement of a memory and other related chips and the traces of high speed buses between the memory and the chips for a product manufacturer.
BRIEF SUMMARY OF THE INVENTIONLayout methods for a printed circuit board (PCB) are provided. An embodiment of a layout method for a PCB is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group comprises a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
Furthermore, another embodiment of a layout method for a PCB is provided. Electronic design automation (EDA) information regarding a PCB EDA tool is obtained. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM and the EDA information, wherein the module group comprises a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB provided by the PCB EDA tool. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
Moreover, another embodiment of a layout method for a PCB is provided, wherein the layout method is performed by a server. A project ID corresponding to the PCB from a client is obtained. The project ID is recognized to determine whether the project ID exists in an account list. At least one module group from a database of a server is obtained according to the project ID when the project ID does not exist in the account list, wherein the module group comprises a plurality of routing modules. A plurality of PCB parameters are obtained. At least one specific routing module is selected from the module group according to the PCB parameters. The specific routing module is provided to the client. The project ID is added into the account list. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip. The client implements the specific routing module into a layout design of the PCB.
A detailed description is given in the following embodiments with reference to the accompanying drawings.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.
Furthermore, the amount of the chips of a layout module can be more than two.
Furthermore, the module groups and the look up table, and the PCB parameters can be stored in a storage media, such as a Flash memory device or an optical disc. Thus, the storage media can be delivered to various users. The routing modules of the module groups are compatible with the user's PCB EDA tool, thereby the users can easily copy and use the routing modules on various PCB layout design.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Claims
1. A printed circuit board (PCB), comprising:
- a specific routing module, comprises: a first chip; a memory chip; and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip,
- wherein the memory chip is a dynamic random access memory (DRAM) with a memory type,
- wherein the specific routing module is obtained from a module group comprising a plurality of routing modules according to a plurality of PCB parameters,
- wherein the module group is obtained from a database according to the memory type of the DRAM.
2. The PCB as claimed in claim 1, wherein the DRAM is a mobile memory, and the DRAM and a flash memory are packaged in the memory chip, and the first chip is a system on chip (SOC) chip.
3. The PCB as claimed in claim 2, wherein the specific routing module further comprises a second chip, wherein the second chip is a power management chip for providing a plurality of voltages to the first chip and the memory chip, and the traces are designed for interconnection between the first chip, the second chip and the memory chip according to the routing configuration between the first chip, second chip and memory chip.
4. The PCB as claimed in claim 1, wherein the specific routing module further comprises a second chip, and the second chip and the DRAM are implemented in a package-on-package (POP) device, wherein the second chip is a system on chip (SOC) chip, and the first chip is a power management chip for providing a plurality of voltages to the POP device.
5. The PCB as claimed in claim 1, wherein the database is disposed in a server, and the server provides the routing modules in response to a requirement corresponding to the memory type of the DRAM.
6. The PCB as claimed in claim 5, wherein the requirement comprises information regarding a PCB electronic design automation (EDA) tool.
7. The PCB as claimed in claim 1, wherein the PCB parameters comprises a layer count, a stack-up setting, a via type and component placement information of the PCB.
8. The PCB as claimed in claim 7, wherein the via type of the PCB represents whether a plurality of vias of the PCB are stagger vias or stacked vias.
9. The PCB as claimed in claim 7, wherein the component placement information represents whether the PCB is a single-sided PCB or a double-sided PCB.
10. The PCB as claimed in claim 1, wherein the first chip, the memory chip and the traces corresponding to the routing configuration are completely implemented into the PCB when the specific routing module is fully implemented in the PCB, or the first chip and the memory chip are completely implemented into the PCB and the traces corresponding to the routing configuration are partially implemented into the PCB when the specific routing module is partially implemented in the PCB.
11. A printed circuit board (PCB), comprising:
- a specific routing module, comprises: a first chip; a memory chip; and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip,
- wherein the memory chip is a dynamic random access memory (DRAM) with a memory type,
- wherein the specific routing module is obtained from a module group comprising a plurality of routing modules according to a plurality of PCB parameters,
- wherein the module group is obtained from a database according to the memory type of the DRAM and electronic design automation (EDA) information regarding a PCB EDA tool.
12. The PCB as claimed in claim 11, wherein the DRAM is a mobile memory, and the DRAM and a flash memory are packaged in the memory chip, and the first chip is a system on chip (SOC) chip.
13. The PCB as claimed in claim 12, wherein the specific routing module further comprises a second chip, wherein the second chip is a power management chip for providing a plurality of voltages to the first chip and the memory chip, and the traces are designed for interconnection between the first chip, the second chip and the memory chip according to the routing configuration between the first chip, second chip and memory chip.
14. The PCB as claimed in claim 11, wherein the specific routing module further comprises a second chip, and the second chip and the DRAM are implemented in a package-on-package (POP) device, wherein the second chip is a system on chip (SOC) chip, and the first chip is a power management chip for providing a plurality of voltages to the POP device.
15. The PCB as claimed in claim 11, wherein the database is disposed in a server, and the server provides the routing modules in response to a requirement corresponding to the memory type of the DRAM and the EDA information.
16. The PCB as claimed in claim 11, wherein the PCB parameters comprises a layer count, a stack-up setting, a via type and component placement information of the PCB.
17. The PCB as claimed in claim 16, wherein the via type of the PCB represents whether a plurality of vias of the PCB are stagger vias or stacked vias.
18. The PCB as claimed in claim 16, wherein the component placement information represents whether the PCB is a single-sided PCB or a double-sided PCB.
19. The PCB as claimed in claim 11, wherein the first chip, the memory chip and the traces corresponding to the routing configuration are completely implemented into the PCB when the specific routing module is fully implemented in the PCB, or the first chip and the memory chip are completely implemented into the PCB and the traces corresponding to the routing configuration are partially implemented into the PCB when the specific routing module is partially implemented in the PCB.
20. A printed circuit board (PCB), comprising:
- a specific routing module, comprises: a first chip; a memory chip; and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip,
- wherein the memory chip is a dynamic random access memory (DRAM) with a memory type,
- wherein the specific routing module is obtained from a module group comprising a plurality of routing modules according to a plurality of PCB parameters,
- wherein the module group is obtained from a database according to a project ID corresponding to the PCB from a client.
21. The PCB as claimed in claim 20, wherein the DRAM is a mobile memory, and the DRAM and a flash memory are packaged in the memory chip, and the first chip is a system on chip (SOC) chip.
22. The PCB as claimed in claim 21, wherein the specific routing module further comprises a second chip, wherein the second chip is a power management chip for providing a plurality of voltages to the first chip and the memory chip, and the traces are designed for interconnection between the first chip, the second chip and the memory chip according to the routing configuration between the first chip, second chip and memory chip.
23. The PCB as claimed in claim 20, wherein the specific routing module further comprises a second chip, and the second chip and the DRAM are implemented in a package-on-package (POP) device, wherein the second chip is a system on chip (SOC) chip, and the first chip is a power management chip for providing a plurality of voltages to the POP device.
24. The PCB as claimed in claim 20, wherein the module group is obtained according to the project ID and a PCB electronic design automation (EDA) tool.
25. The PCB as claimed in claim 20, wherein the PCB parameters is provided by the database or the client.
26. The PCB as claimed in claim 20, wherein the PCB parameters comprises a layer count, a stack-up setting, a via type and component placement information of the PCB.
27. The PCB as claimed in claim 26, wherein the via type of the PCB represents whether a plurality of vias of the PCB are stagger vias or stacked vias.
28. The PCB as claimed in claim 26, wherein the component placement information represents whether the PCB is a single-sided PCB or a double-sided PCB.
29. The PCB as claimed in claim 20, wherein the first chip, the memory chip and the traces corresponding to the routing configuration are completely implemented into the PCB when the specific routing module is fully implemented in the PCB, or the first chip and the memory chip are completely implemented into the PCB and the traces corresponding to the routing configuration are partially implemented into the PCB when the specific routing module is partially implemented in the PCB.
Type: Application
Filed: Sep 2, 2015
Publication Date: Dec 31, 2015
Inventors: Fu-Kang PAN (New Taipei City), Nan-Cheng CHEN (Hsin-Chu City), Shih-Chieh LIN (Taipei City), HUI-CHI TANG (Hsinchu City), Ying LIU (Shenzhen City), Yang LIU (Shenzhen City), Ching-Chih Li (New Taipei City)
Application Number: 14/843,094