Abstract: A cis-TEVP fusion protein including a TEVP protease, a TEVP cleavage site and a target protein provide a platform for expression of the target protein. A trans-TEVP fusion protein including a TEVP cleavage site and a target protein, the amino-terminal portion of the target protein adjacent to the C-terminal portion of the TEVP cleavage site, the amino acidic residue in position P2 of the TEVP cleavage site being a Valine also produces the target protein by the same process. A cis-TEVP fusion protein system comprising the first fusion protein and a suitable host cell; a trans-TEVP fusion protein system comprising the second fusion protein and a suitable host cell; associated methods to produce target proteins, and kits of parts are also disclosed herein.

Abstract: An adhesive tape adhering device includes a table unit, a wafer bearing unit, an adhesive tape pull-tight unit, an adhesive tape clipping unit, and a rolling unit. The wafer bearing unit movably disposes on the table unit upwardly and downwardly for bearing a wafer. The adhesive tape pull-tight unit has a bundle of adhesive tape, and the adhesive tape pull-tight unit disposes on the table unit and next to one side of the wafer bearing unit. The adhesive tape clipping unit disposes on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape.

Abstract: An apparatus and method of vacuum metallic sintering for a semiconductor uses a quartz tube, a vacuum air-extracting apparatus, a furnace and a gas injection pipe. The metal sintered does not produce metal oxide in a vacuum established by the vacuum air-extracting apparatus. After sintering, a movable furnace can withdraw from the quartz tube immediately to decrease cooling time.