Abstract: A successive-approximation register (SAR) analog-to-digital converter (ADC) circuit includes a comparator circuit and a plurality of latch circuits. The comparator circuit is configured to compare an analog signal with a plurality of reference levels. The latch circuits, coupled to the comparator circuit and connected in series, are triggered sequentially in response to a plurality of trigger signals, respectively, to store a comparator output of the comparator circuit and accordingly generate a digital signal. A first latch circuit and a second latch circuit of the latch circuits are triggered in response to a first trigger signal and a second trigger signal of the trigger signals, respectively. The first latch circuit is configured to generate the second trigger signal according to the comparator output stored in the first latch circuit.

Abstract: A cooling device includes a cabinet, a coolant circulation mechanism, and a heat exchange mechanism. The coolant circulation mechanism includes a first conduit, a second conduit, a control conduit, and a circulation conduit. The circulation conduit is connected to the cabinet and the heat exchange mechanism. The first conduit and the second conduit are connected to the heat exchange mechanism. The control conduit is connected to the cabinet and selectively connects to the first conduit or the second conduit. When the control conduit connects to the second conduit, coolant from the cabinet flows to the heat exchange mechanism through the second conduit. When the control conduit connects to the first conduit, coolant from the heat exchange mechanism flows to the cabinet through the first conduit. Coolant in the cabinet flows through the circulation conduit to the heat exchange mechanism when a level of the coolant reaches the circulation conduit.

Abstract: A cooling device for data center includes: a housing chamber configured for housing the data center; an air inlet plenum positioned at one side of the housing chamber and configured for inflowing of external natural wind; an air outlet plenum positioned at another side of the housing chamber; an air return plenum defining two opposite ends communicated with the air inlet plenum and the air outlet plenum, and comprising a return air damper; a controller connected to the return air damper and adapted for controlling the opening and closing of the return air damper; and a refrigeration module located in the air inlet plenum and connected to the controller. A cooling system for data center is also provided.

Abstract: A data communication system able to provide a speedy response to a user equipment transmitting data includes a base station and a data center. The base station is disposed adjacent to the data center, the base station is coupled between the data center and the user equipment, and the base station transmits data provided by the user equipment to the data center. The data center processes first data from the user equipment, and transmits a second data to the user equipment through the base station. Therefore, the data transmission time between the data center and the user equipment is shortened, and the data can be quickly fed back to the user equipment.

Abstract: A cooling device includes a cabinet, a coolant circulation mechanism, and a heat exchange mechanism. The coolant circulation mechanism includes a first conduit, a second conduit, a control conduit, and a circulation conduit. The circulation conduit is connected to the cabinet and the heat exchange mechanism. The first conduit and the second conduit are connected to the heat exchange mechanism. The control conduit is connected to the cabinet and selectively connects to the first conduit or the second conduit. When the control conduit connects to the second conduit, coolant from the cabinet flows to the heat exchange mechanism through the second conduit. When the control conduit connects to the first conduit, coolant from the heat exchange mechanism flows to the cabinet through the first conduit. Coolant in the cabinet flows through the circulation conduit to the heat exchange mechanism when a level of the coolant reaches the circulation conduit.

Abstract: A data communication system able to provide a speedy response to a user equipment transmitting data includes a base station and a data center. The base station is disposed adjacent to the data center, the base station is coupled between the data center and the user equipment, and the base station transmits data provided by the user equipment to the data center. The data center processes first data from the user equipment, and transmits a second data to the user equipment through the base station. Therefore, the data transmission time between the data center and the user equipment is shortened, and the data can be quickly fed back to the user equipment.

Abstract: A cooling device for data center includes: a housing chamber configured for housing the data center; an air inlet plenum positioned at one side of the housing chamber and configured for inflowing of external natural wind; an air outlet plenum positioned at another side of the housing chamber; an air return plenum defining two opposite ends communicated with the air inlet plenum and the air outlet plenum, and comprising a return air damper; a controller connected to the return air damper and adapted for controlling the opening and closing of the return air damper; and a refrigeration module located in the air inlet plenum and connected to the controller. A cooling system for data center is also provided.

Abstract: A method for performing system power control within an electronic device and an associated apparatus are provided. The method includes the steps of: utilizing a power consumption index generator positioned in a specific subsystem to generate a power consumption index corresponding to the specific subsystem, where the electronic device includes a plurality of subsystems, and the specific subsystem is one of the plurality of subsystems; and triggering a power limiter protection operation for the electronic device according to the power consumption index. For example, the power consumption index corresponding to the specific subsystem may represent a power consumption value of the specific subsystem, and the method may further include: comparing the power consumption value of the specific subsystem with a peak power threshold to determine whether the power consumed by the specific subsystem reaches the peak power threshold to generate a determining result, for triggering the power limiter protection operation.

Abstract: A method for performing system power control within an electronic device and an associated apparatus are provided. The method includes the steps of: utilizing a power consumption index generator positioned in a specific subsystem to generate a power consumption index corresponding to the specific subsystem, where the electronic device includes a plurality of subsystems, and the specific subsystem is one of the plurality of subsystems; and triggering a power limiter protection operation for the electronic device according to the power consumption index. For example, the power consumption index corresponding to the specific subsystem may represent a power consumption value of the specific subsystem, and the method may further include: comparing the power consumption value of the specific subsystem with a peak power threshold to determine whether the power consumed by the specific subsystem reaches the peak power threshold to generate a determining result, for triggering the power limiter protection operation.

Abstract: A controller coupled to a plurality of hardware modules is arranged for determining activities of at least two of the hardware modules in real time, and determining a voltage and a frequency for one of the hardware modules according to the activities of the at least two of the hardware modules.

Abstract: A method for performing system power budgeting within an electronic device and an associated apparatus are provided. The method includes the steps of: utilizing a power consumption index generator positioned in a specific subsystem to generate a power consumption index corresponding to the specific subsystem, where the electronic device includes a plurality of subsystems, and the specific subsystem is one of the plurality of subsystems; and performing configuration adjustment on at least one portion of the electronic device according to the power consumption index corresponding to the specific subsystem.

Abstract: A method for performing system power budgeting within an electronic device and an associated apparatus are provided. The method includes the steps of: utilizing a power consumption index generator positioned in a specific subsystem to generate a power consumption index corresponding to the specific subsystem, where the electronic device includes a plurality of subsystems, and the specific subsystem is one of the plurality of subsystems; and performing configuration adjustment on at least one portion of the electronic device according to the power consumption index corresponding to the specific subsystem.

Abstract: Method and apparatus are provided for thermal management of mobile devices. In one novel aspect, a throttle method is used to control the fast rising temperature for the device. In one embodiment, the thermal management method determines a temperature of the mobile device and compares the temperature with a plurality of predefined temperature thresholds. The thermal management applies a first throttle solution upon detecting the temperature reaches a first predefined temperature threshold and applies a second throttle solution upon detecting the temperature reaches a second predefined temperature threshold. In one embodiment, the first and the second throttle solutions control the slope of the rising temperature to be below a first predefined slope and a second predefined slope, respectively. In one embodiment, the temperature is controlled by adjusting the operating frequency and/or voltage of at least one heat-generating component of the mobile device.

Abstract: Method and apparatus are provided for thermal management of mobile devices. In one novel aspect, a micro-throttle method is used to control the fast rising temperature for the device. In one embodiment, the thermal management method determines a temperature of the mobile device and compares the temperature with a plurality of predefined temperature thresholds. The thermal management applies a first micro-throttle solution upon detecting the temperature reaches a first predefined temperature threshold and applies a second micro-throttle solution upon detecting the temperature reaches a second predefined temperature threshold. In one embodiment, the first and the second micro-throttle solution control the slope of the rising temperature to be below a first predefined slope and a second predefined slope, respectively. In one embodiment, the temperature is controlled by adjusting the operating frequency or voltage of at least one heat-generating component of the mobile device.

Abstract: A method for performing system power budgeting within an electronic device and an associated apparatus are provided. The method includes the steps of: utilizing a power consumption index generator positioned in a specific subsystem to generate a power consumption index corresponding to the specific subsystem, where the electronic device includes a plurality of subsystems, and the specific subsystem is one of the plurality of subsystems; and performing configuration adjustment on at least one portion of the electronic device according to the power consumption index corresponding to the specific subsystem.

Abstract: A method for performing system power control within an electronic device and an associated apparatus are provided. The method includes the steps of: utilizing a power consumption index generator positioned in a specific subsystem to generate a power consumption index corresponding to the specific subsystem, where the electronic device includes a plurality of subsystems, and the specific subsystem is one of the plurality of subsystems; and triggering a power limiter protection operation for the electronic device according to the power consumption index. For example, the power consumption index corresponding to the specific subsystem may represent a power consumption value of the specific subsystem, and the method may further include: comparing the power consumption value of the specific subsystem with a peak power threshold to determine whether the power consumed by the specific subsystem reaches the peak power threshold to generate a determining result, for triggering the power limiter protection operation.

Abstract: Method and apparatus are provided for thermal management of mobile devices. In one novel aspect, a micro-throttle method is used to control the fast rising temperature for the device. In one embodiment, the thermal management method determines a temperature of the mobile device and compares the temperature with a plurality of predefined temperature thresholds. The thermal management applies a first micro-throttle solution upon detecting the temperature reaches a first predefined temperature threshold and applies a second micro-throttle solution upon detecting the temperature reaches a second predefined temperature threshold. In one embodiment, the first and the second micro-throttle solution control the slope of the rising temperature to be below a first predefined slope and a second predefined slope, respectively. In one embodiment, the temperature is controlled by adjusting the operating frequency or voltage of at least one heat-generating components of the mobile device.

Abstract: A MOSFET device is provided. An N-type epitaxial layer is disposed on an N-type substrate. An insulating trench is disposed in the epitaxial layer. A P-type well region is disposed in the epitaxial layer at one side of the insulating trench. An N-type heavily doped region is disposed in the well region. A gate structure is disposed on the epitaxial layer and partially overlaps with the heavily doped region. At least two P-type first doped regions are disposed in the epitaxial layer below the well region. At least one P-type second doped region is disposed in the epitaxial layer and located between the first doped regions. Besides, the first and second doped regions are separated from each other. The first doped regions extend along a first direction, and the second doped region extends along a second direction different from the first direction.

Abstract: A MOSFET device is provided. An N-type epitaxial layer is disposed on an N-type substrate. An insulating trench is disposed in the epitaxial layer. A P-type well region is disposed in the epitaxial layer at one side of the insulating trench. An N-type heavily doped region is disposed in the well region. A gate structure is disposed on the epitaxial layer and partially overlaps with the heavily doped region. At least two P-type first doped regions are disposed in the epitaxial layer below the well region. At least one P-type second doped region is disposed in the epitaxial layer and located between the first doped regions. Besides, the first and second doped regions are separated from each other. The first doped regions extend along a first direction, and the second doped region extends along a second direction different from the first direction.

Abstract: A silicon carbide Schottky diode device with mesa terminations and the manufacturing method thereof are provided. The silicon carbide Schottky diode device includes an n-type epitaxial silicon carbide layer with mesa terminations on an n-type silicon carbide substrate, two p-type regions in the n-type epitaxial silicon carbide layer and a Schottky metal contact on the n-type epitaxial silicon carbide layer and the p-type regions, a dielectric layer on sidewalls and planes of the mesa terminations.