Abstract: A semiconductor package structure includes a base material, at least one semiconductor chip, an encapsulant, a depression structure, a redistribution layer and at least one conductive via. The semiconductor chip is disposed on the base material. The encapsulant is disposed on the base material and covers the at least one semiconductor chip. The encapsulant has an outer side surface. The depression structure is disposed adjacent to and exposed from of the outer side surface the encapsulant. The redistribution layer is disposed on the encapsulant. The conductive via is disposed in the encapsulant and electrically connects the semiconductor chip and the redistribution layer.

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

Abstract: A semiconductor device package includes: (1) a conductive base comprising a sidewall, a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth; (2) a semiconductor die disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface, the second surface of the semiconductor die bonded to the bottom surface of the cavity; and (3) a first insulating material covering the sidewall of the conductive base and extending to a bottom surface of the conductive base.

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

Abstract: A frame assembly and display device are provided. The frame assembly includes a mounting member, a sliding member, a top cover and a bottom cover. The sliding member is slidably disposed on the mounting member, in which the sliding member has at least one mounting hole and at least one engaging plate. The top cover has at least one protruding lug, in which the protruding lug is accommodated in the mounting hole, and at least one portion of the protruding lug is positioned by the engaging plate. The bottom cover has at least one engaging hook, in which the engaging hook is engaged in the mounting hole.

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

Abstract: The present invention provides an urinary crystal detection method, which is used with a crystal collecting unit and a crystal detecting unit. The method comprises steps of using magnetic particles to attach urinary crystals from a sample. Then, providing a magnetic field to separate the urinary crystals. Further to analyz their constituent by the Raman signals of the urinary crystal to access an urinary calculus result for urinary stone patient.

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

Abstract: The present invention provides an ultrasonic probe scanning device comprising: a disposable part and a fixed part. In the disposable part, an ultrasonic probe with a magnetic end attaches to a slide rail encapsulated in a water-containing closed area. Otherwise, in the fixed part, a magnetic holder attached to a track, and a motor for driving the magnetic holder to move back and forth on the track. When the disposable part and the fixed part be combined, it can drive the motion of ultrasonic scanning device by magnetic attraction force.

Abstract: A frame assembly and display device are provided. The frame assembly includes a mounting member, a sliding member, a top cover and a bottom cover. The sliding member is slidably disposed on the mounting member, in which the sliding member has at least one mounting hole and at least one engaging plate. The top cover has at least one protruding lug, in which the protruding lug is accommodated in the mounting hole, and at least one portion of the protruding lug is positioned by the engaging plate. The bottom cover has at least one engaging hook, in which the engaging hook is engaged in the mounting hole.

Abstract: A semiconductor device package includes: (1) a conductive base comprising a sidewall, a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth; (2) a semiconductor die disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface, the second surface of the semiconductor die bonded to the bottom surface of the cavity; and (3) a first insulating material covering the sidewall of the conductive base and extending to a bottom surface of the conductive base.

Abstract: An inner static electricity eliminating control valve for organic solvent delivery pipelines is disclosed. The inner static electricity eliminating control valve is to be installed on and connected to an organic solvent delivery pipeline, to eliminate the inner static electricity generated by the organic solvent inside the organic solvent delivery pipeline. The inner static electricity eliminating control valve includes a valve casing, a main valve chamber, a pneumatic valve, a subsidiary valve chamber, a check valve, a static electricity export mechanism and a solvent export portion, wherein, the pneumatic valve can periodically apply pressure toward the organic solvent inside the main valve chamber, so that the organic solvent inside the main valve chamber can be delivered periodically through the check valve to the subsidiary valve chamber, and during this process, the static electricity export mechanism will export and eliminate the static electricity existing in the organic solvent.

Abstract: A semiconductor device package includes a conductive base, and a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth. A semiconductor die is disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface. The second surface of the semiconductor die is bonded to the bottom surface of the cavity. A distance between the first surface of the semiconductor die and the first surface of the conductive base is about 20% of the depth of the cavity.

Abstract: A semiconductor device package includes a first conductive base, a first semiconductor die, a dielectric layer, a first patterned conductive layer, and a second patterned conductive layer. The first conductive base defines a first cavity. The first semiconductor die is on a bottom surface of the first cavity. The dielectric layer covers the first semiconductor die, the first surface and the second surface of the first conductive base and fills the first cavity. The first patterned conductive layer is on a first surface of the dielectric layer. The second patterned conductive layer is on a second surface of the dielectric layer.

Abstract: The imaging system includes a wire, a second signal transmission unit and a computer system. At least one first signal transmission unit is disposed on the wire which is configured to enter a blood vessel in a human body. The second signal transmission unit is disposed outside of the human body. The computer system is electrically connected to the second signal transmission unit. The first signal transmission unit emits a first signal, the second signal transmission unit receives the first signal, and the computer system generates a first image according to the first signal. The second signal transmission unit emits a second signal, and receives a reflection signal corresponding to the second signal. The computer system generates a second image according to the reflection signal, and merges the first image with the second image as a third image for rendering a position of the wire in the human body.

Abstract: A semiconductor device package includes a first conductive base, a first semiconductor die, a dielectric layer, a first patterned conductive layer, and a second patterned conductive layer. The first conductive base defines a first cavity. The first semiconductor die is on a bottom surface of the first cavity. The dielectric layer covers the first semiconductor die, the first surface and the second surface of the first conductive base and fills the first cavity. The first patterned conductive layer is on a first surface of the dielectric layer. The second patterned conductive layer is on a second surface of the dielectric layer.

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

Abstract: A method of measuring ocular surface temperature includes steps as follows. Using a built-in temperature sensor called a black plate herein, an infrared heat sensor is provided and the temperature sensor contacts the black plate. The temperature sensor measures an actual black plate temperature. The infrared heat sensor detects a radiation emitted by the black plate, and the radiation is computed according to a temperature rising curve through a computing unit of a work station to generate a computed black plate temperature. A value of temperature shifting error is determined by subtracting the actual black plate temperature from the computed black plate temperature.

Abstract: An improved ultrasound probe (100) has an ultrasound transducer as a body (10) and is capable of accurate positioning on target operative regions of a patient after being improved.