Abstract: A DIMA semiconductor structure is disclosed. The DIMA semiconductor structure includes a frontend including a semiconductor substrate, a transistor switch of a memory cell coupled to the semiconductor substrate and a computation circuit on the periphery of the frontend coupled to the semiconductor substrate. Additionally, the DIMA includes a backend that includes an RRAM component of the memory cell that is coupled to the transistor switch.

Abstract: IC interconnect structures including subtractively patterned features. Feature ends may be defined through multiple patterning of multiple cap materials for reduced misregistration. Subtractively patterned features may be lines integrated with damascene vias or with subtractively patterned vias, or may be vias integrated with damascene lines or with subtractively patterned lines. Subtractively patterned vias may be deposited as part of a planar metal layer and defined currently with interconnect lines. Subtractively patterned features may be integrated with air gap isolation structures. Subtractively patterned features may be include a barrier material on the bottom, top, or sidewall. A bottom barrier of a subtractively patterned features may be deposited with an area selective technique to be absent from an underlying interconnect feature. A barrier of a subtractively patterned feature may comprise graphene or a chalcogenide of a metal in the feature or in a seed layer.

Abstract: Backside contact structures include etch selective materials to facilitate backside contact formation. An integrated circuit structure includes a frontside contact region, a device region below the frontside contact region, and a backside contact region below the device region. The device region includes a transistor. The backside contact region includes a first dielectric material under a source or drain region of the transistor, a second dielectric material laterally adjacent to the first dielectric material and under a gate structure of the transistor. A non-conductive spacer is between the first and second dielectric materials. The first and second dielectric materials are selectively etchable with respect to one another and the spacer. The backside contact region may include an interconnect feature that, for instance, passes through the first dielectric material and contacts a bottom side of the source/drain region, and/or passes through the second dielectric material and contacts the gate structure.

Abstract: A stacked device structure includes a first device structure including a first body that includes a semiconductor material, and a plurality of terminals coupled with the first body. The stacked device structure further includes an insulator between the first device structure and a second device structure. The second device structure includes a second body such as a fin structure directly above the insulator. The second device structure further includes a gate coupled to the fin structure, a spacer including a dielectric material adjacent to the gate, and an epitaxial structure adjacent to a sidewall of the fin structure and between the spacer and the insulator. A metallization structure is coupled to a sidewall surface of the epitaxial structure, and further coupled with one of the terminals of the first device.

Abstract: Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.

Abstract: IC interconnect structures including subtractively patterned features. Feature ends may be defined through multiple patterning of multiple cap materials for reduced misregistration. Subtractively patterned features may be lines integrated with damascene vias or with subtractively patterned vias, or may be vias integrated with damascene lines or with subtractively patterned lines. Subtractively patterned vias may be deposited as part of a planar metal layer and defined currently with interconnect lines. Subtractively patterned features may be integrated with air gap isolation structures. Subtractively patterned features may be include a barrier material on the bottom, top, or sidewall. A bottom barrier of a subtractively patterned features may be deposited with an area selective technique to be absent from an underlying interconnect feature. A barrier of a subtractively patterned feature may comprise graphene or a chalcogenide of a metal in the feature or in a seed layer.

Abstract: Backside contact structures include etch selective materials to facilitate backside contact formation. An integrated circuit structure includes a frontside contact region, a device region below the frontside contact region, and a backside contact region below the device region. The device region includes a transistor. The backside contact region includes a first dielectric material under a source or drain region of the transistor, a second dielectric material laterally adjacent to the first dielectric material and under a gate structure of the transistor. A non-conductive spacer is between the first and second dielectric materials. The first and second dielectric materials are selectively etchable with respect to one another and the spacer. The backside contact region may include an interconnect feature that, for instance, passes through the first dielectric material and contacts a bottom side of the source/drain region, and/or passes through the second dielectric material and contacts the gate structure.

Abstract: Embodiments herein describe techniques for an integrated circuit (IC). The IC may include a first transistor, an insulator layer above the first transistor, and a second transistor above the insulator layer. The first transistor may be a p-type transistor including a channel in a substrate, a first source electrode, and a first drain electrode. A first metal contact may be coupled to the first source electrode, while a second metal contact may be coupled to the first drain electrode. The insulator layer may be next to the first metal contact, and next to the second metal contact. The second transistor may include a second source electrode, and a second drain electrode. The second source electrode may be coupled to the first metal contact, or the second drain electrode may be coupled to the second metal contact. Other embodiments may be described and/or claimed.

Abstract: A stacked device structure includes a first device structure including a first body that includes a semiconductor material, and a plurality of terminals coupled with the first body. The stacked device structure further includes an insulator between the first device structure and a second device structure. The second device structure includes a second body such as a fin structure directly above the insulator. The second device structure further includes a gate coupled to the fin structure, a spacer including a dielectric material adjacent to the gate, and an epitaxial structure adjacent to a sidewall of the fin structure and between the spacer and the insulator. A metallization structure is coupled to a sidewall surface of the epitaxial structure, and further coupled with one of the terminals of the first device.

Abstract: In some embodiments, a semiconductor device structure is formed by using an angled etch to remove material so as to expose a portion of an adjacent conductor. The space formed upon removing the material can then be filled with a conductive material during formation of a contact or other conductive structure (e.g., and interconnection). In this way, the contact formation also fills the space to form an angled local interconnect portion that connects adjacent structures (e.g., a source/drain contact to an adjacent source/drain contact, a source/drain contact to an adjacent gate contact, a source/drain contact to an adjacent device level conductor also connected to a gate/source/drain contact). In other embodiments, an interconnection structure herein termed a “jogged via” establishes and electrical connection from laterally adjacent peripheral surfaces of conductive structures that are not coaxially or concentrically aligned with one another.

Abstract: An integrated circuit structure includes a first material block comprising a first block insulator layer and a first multilayer stack on the first block insulator layer, the first multilayer stack comprising interleaved pillar electrodes and insulator layers. A second material block is stacked on the first material block and comprises a second block insulator layer, and a second multilayer stack on the second block insulator layer, the second multilayer stack comprising interleaved pillar electrodes and insulator layers. At least one pillar extends through the first material block and the second material block, wherein the at least one pillar has a top width at a top of the first and second material blocks that is greater than a bottom width at a bottom of the first and second material blocks.

Abstract: An integrated circuit structure comprises a lower device layer that includes a first structure comprising a plurality of PMOS transistors. An upper device layer is formed on the lower device layer, wherein the upper device layer includes a second structure comprising a plurality of NMOS thin-film transistors (TFT).

Abstract: Stacked transistor structures including one or more thin film transistor (TFT) material nanowire or nanoribbon channel regions and methods of forming same are disclosed. In an embodiment, a second transistor structure has a TFT material nanowire or nanoribbon stacked on a first transistor structure which also includes nanowires or nanoribbons comprising TFT material or group IV semiconductor. The top and bottom channel regions may be configured the same or differently, with respect to shape and/or semiconductor materials. Top and bottom transistor structures (e.g., NMOS/PMOS) may be formed using the top and bottom channel region structures. An insulator region may be interposed between the upper and lower channel regions.

Abstract: Thin film transistors fabricated using a spacer as a fin are described. In an example, a method of forming a fin transistor structure includes patterning a plurality of backbone pillars on a semiconductor substrate. The method may then include conformally depositing a spacer layer over the plurality of backbone pillars and the semiconductor substrate. A spacer etch of the spacer layer is then performed to leave a sidewall of the spacer layer on a backbone pillar to form a fin of the fin transistor structure.

Abstract: An integrated circuit (IC) structure in a memory device is described. In an example, the IC structure includes a memory cell including a bitline (BL) extending along a first direction and a channel extending along a second direction above and diagonal to the BL. In the example, a wordline (WL) extends in a third direction perpendicular to the first direction of the BL and intersects with the channel to control a current in the channel along a gated channel length. In some examples, the channel is electrically coupled on a first side to a storage capacitor via a storage node contact (SNC) and on a second side to the BL via a bit line contact (BLC) located on an underside or backside of the channel.

Abstract: An integrated circuit (IC) structure having a plurality of backend double-walled capacitors (DWCs) are described. In an example, a first interconnect layer is disposed over a substrate and a second interconnect layer is disposed over the first interconnect layer. In the example, a plurality of DWCs are disposed in the first interconnect layer or the second interconnect layer to provide capacitance to assist the first interconnect layer and the second interconnect layer in providing electrical signal routing and power distribution to one or more devices in the IC structure. In examples, the IC structure includes a logic IC or a coupling substrate.

Abstract: A spin orbit torque (SOT) memory device includes a magnetic tunnel junction (MTJ) device with one end coupled with a first electrode and an opposite end coupled with a second electrode including a spin orbit torque material. In an embodiment, a second electrode is coupled with the free magnet and coupled between a pair of interconnect line segments. The second electrode and the pair of interconnect line segments include a spin orbit torque material. The second electrode has a conductive path cross-section that is smaller than a cross section of the conductive path in at least one of the interconnect line segments.

Abstract: Disclosed herein are transistor channel materials, and related methods and devices. For example, in some embodiments, a transistor may include a channel material including a semiconductor material having a first conductivity type, and the channel material may further include a dopant including (1) an insulating material and/or (2) a material having a second conductivity type opposite to the first conductivity type.

Abstract: Disclosed herein are transistors, memory cells, and arrangements thereof. For example, in some embodiments, an integrated circuit (IC) structure may include a plurality of transistors, wherein the transistors are distributed in a hexagonally packed arrangement. In another example, in some embodiments, an IC structure may include a memory cell including an axially symmetric transistor coupled to an axially symmetric capacitor, wherein the axis of the transistor is aligned with the axis of the capacitor.

Abstract: Disclosed herein are transistors, memory cells, and arrangements thereof. For example, in some embodiments, an integrated circuit (IC) structure may include a plurality of transistors, wherein the transistors are distributed in a hexagonally packed arrangement. In another example, in some embodiments, an IC structure may include a memory cell including an axially symmetric transistor coupled to an axially symmetric capacitor, wherein the axis of the transistor is aligned with the axis of the capacitor.