Abstract: System, methods, and other embodiments described herein relate to accurately distinguishing a traffic light from other illuminated objects in the traffic scene and detecting states using hierarchical modeling. In one embodiment, a method includes detecting, using a machine learning (ML) model, two-dimensional (2D) coordinates of illuminated objects identified from a monocular image of a traffic scene for control adaptation by a control model. The method also includes assigning, using the ML model, computed probabilities to the illuminated objects for categories within a hierarchical ontology of environmental lights associated with the traffic scene, wherein one of the probabilities indicates existence of a traffic light instead of a brake light in the traffic scene. The method also includes executing a task by the control model for a vehicle according to the 2D coordinates and the computed probabilities.

Abstract: The present specification relates to an organic light emitting device, and a composition for forming an organic material layer.

Abstract: A method for an end-to-end boundary lane detection system is described. The method includes gridding a red-green-blue (RGB) image captured by a camera sensor mounted on an ego vehicle into a plurality of image patches. The method also includes generating different image patch embeddings to provide correlations between the plurality of image patches and the RGB image. The method further includes encoding the different image patch embeddings into predetermined categories, grid offsets, and instance identifications. The method also includes generating lane boundary keypoints of the RGB image based on the encoding of the different image patch embeddings.

Abstract: A method and a device for compensating for sensor drift are disclosed. A method for compensating for sensor drift, according to one embodiment, comprises the steps of: confirming the suitability of sensor data; defining a transformation model for transforming the sensor data; setting a loss function on the basis of the transformation model; and optimizing the transformation model on the basis of the loss function.

Abstract: The present disclosure discloses an adhesive glue, curing method therefor, and application thereof. The adhesive glue comprises the following components in percentage by weight: 50% to 80% of a polyurethane-modified acrylate, 0.1% to 10% of a thixotropic agent, 0.2% to 8% of a thermal initiator, and 2% to 30% of a diluent, wherein the thixotropic agent is a carbon nanotube. The adhesive glue is soft and resilient; it has a high viscosity, good thixotropy, low curing temperature, and high curing degree. Silicon precipitation can be prevented because silicon is not a component of the adhesive glue. The adhesive glue has strong adhesion and meets the production and performance requirements of the HDD binding process. In addition, the adhesive glue can effectively prevent hard disk damage and scratching.

Abstract: A projection picture correction system, and an electronic equipment and a projector thereof are provided. The projection picture correction system includes a projector and a processing device. The projector is for providing keystone correction parameters. The processing device connects to the projector through a data transfer interface to receive the keystone correction parameters from the projector, performs a keystone correction on at least one picture according to the keystone correction parameters and generates a corrected picture, and connects to the projector through an image transmission interface to transmit the corrected picture to the projector for projection.

Abstract: A double-sided display device includes a first panel, a second panel, a light guide plate and a light source. The second panel is arranged opposite to the first panel. The light guide plate is arranged between the first panel and the second panel, and includes a main body portion including a first surface and a second surface, a first pattern arranged on the first surface, and a second pattern arranged on the second surface. The light source is arranged adjacent to the light guide plate. The first pattern is different from the second pattern.

Abstract: A traffic light classification system for a vehicle includes an image capture device to capture an image of a scene that includes a traffic light with multiple light signals, a processor, and a memory communicably coupled to the processor and storing a first neural network module including instructions that when executed by the processor cause the processor to determine, based on inputting the image into a neural network, a semantic keypoint for each light signal in the traffic light, and determine, based on each semantic keypoint, a classification state of each light signal.

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

Abstract: A target measurement device is provided. The target measurement device includes a fixing ring, a main body, and a transceiver. The fixing ring has a first surface. The main body is over the first surface of the fixing ring. The transceiver is coupled to the main body. The transceiver is at least movable between a center of the fixing ring to an edge of the fixing ring from a top view perspective. A method for measuring a target is also provided.

Abstract: A method of fabricating a semiconductor chip includes the following steps. A bonding material layer is formed on a first wafer substrate and is patterned to form a first bonding layer having a strength adjustment pattern. A semiconductor component layer and a first interconnect structure layer are formed on a second wafer substrate. The first interconnect structure layer is located. A second bonding layer is formed on the first interconnect structure layer. The second wafer substrate is bonded to the first wafer substrate by contacting the second bonding layer with the first bonding layer. A bonding interface of the second bonding layer and the first bonding layer is smaller than an area of the second bonding layer. A second interconnect structure layer is formed on the semiconductor component layer. A conductor terminal is formed on the second interconnect structure layer.

Abstract: A measuring method is provided. A probe and a first sensor are disposed over a jig including a bar protruding from the jig. The probe is moved until a first surface of the probe is laterally aligned with a second surface of the bar facing the jig. A first distance between the second surface of the bar and the first sensor is obtained by the first sensor. The probe and the first sensor are disposed over a magnetron. Magnetic field intensities at different elevations above the magnetron are measured by the probe. A method for forming a semiconductor structure is also provided.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a thermoplastic resin including a polyester resin; about 50-150 parts by weight of glass fibers; and about 1-10 parts by weight of a polyether-ester copolymer, wherein the polyether-ester copolymer has a melt volume flow rate (MVR) of about 30-120 cm3/10 min as measured under conditions of 230° C. and 2.16 kg based on ISO 1133. The thermoplastic resin composition is excellent in impact resistance, appearance characteristics, metal joining properties, and the like.

Abstract: An improved structure of a universal socket with polarity correction comprising: a cover, a wedging body disposed under the cover, and a shell disposed under the wedging body. The cover is formed with first neutral, first live wire, second neutral, and second live wire electrode socket holes. The wedging body is formed with first neutral electrode, first live wire electrode, second neutral electrode, and second live wire electrode holding holes. Neutral and live wire electrode plate accommodating grooves, and an electrode plate assembly are disposed in the shell. The electrode plate assembly comprises a first neutral electrode plate and a second neutral electrode plate electrically connected to each other and disposed in the neutral electrode plate accommodating groove, and further comprises a first live wire electrode plate and a second live wire electrode plate electrically connected to each other and disposed in the live wire electrode plate accommodating groove.

Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.

Abstract: In a method for recovering an active metal of a lithium secondary battery, a sulfuric acid solution is added to a lithium metal composite oxide so as to prepare a sulfated active material solution. A transition metal is extracted from the sulfated active material solution. A lithium precursor is recovered by adding a lithium extracting agent to the solution remaining after the transition metal has been extracted from the sulfated active material solution. In the method, the amount of impurities is reduced, and sulfuric acid and the neutralizing agent can be recycled so that a high-yield lithium precursor recovery is enabled.

Abstract: In one embodiment, a signal light state detection system includes one or more processors, an a non-transitory memory module storing computer-readable instructions. The computer-readable instructions are configured to cause the one or more processors to receive a first image of a vehicle and receiving a second image of the vehicle, wherein the second image is later in time from the first image, and generate a warped image from the first image and the second image, wherein the warped image has individual pixels of one of the first image and the second image that are shifted to locations of corresponding pixels of the other of the first image and the second image. The one or more processors further generate a difference image from the warped image and one of the first image and the second image, and determine, using a classifier module, a probability of a state of vehicle signal lights.

Abstract: A method for 3D object modeling includes linking 2D semantic keypoints of an object within a video stream into a 2D structured object geometry. The method includes inputting, to a neural network, the object to generate a 2D NOCS image and a shape vector, the shape vector being mapped to a continuously traversable coordinate shape. The method includes applying a differentiable shape renderer to the SDF shape and the 2D NOCS image to render a shape of the object corresponding to a 3D object model in the continuously traversable coordinate shape space. The method includes lifting the linked, 2D semantic keypoints of the 2D structured object geometry to a 3D structured object geometry. The method includes geometrically and projectively aligning the 3D object model, the 3D structured object geometry, and the rendered shape to form a rendered object. The method includes generating 3D bounding boxes from the rendered object.

Abstract: An improved structure of a universal socket with polarity correction comprising: a cover, a wedging body disposed under the cover, and a shell disposed under the wedging body. The cover is formed with first neutral, first live wire, second neutral, and second live wire electrode socket holes. The wedging body is formed with first neutral electrode, first live wire electrode, second neutral electrode, and second live wire electrode holding holes. Neutral and live wire electrode plate accommodating grooves, and an electrode plate assembly are disposed in the shell. The electrode plate assembly comprises a first neutral electrode plate and a second neutral electrode plate electrically connected to each other and disposed in the neutral electrode plate accommodating groove, and further comprises a first live wire electrode plate and a second live wire electrode plate electrically connected to each other and disposed in the live wire electrode plate accommodating groove.

Abstract: A semiconductor structure includes a substrate having a memory device region and a logic device region, a first dielectric layer on the substrate, a plurality of memory stack structures on the first dielectric layer on the memory device region, an insulating layer conformally covering the memory stack structures and the first dielectric layer, a second dielectric layer on the insulating layer and completely filling the spaces between the memory stack structures, and a first interconnecting structure formed in the second dielectric layer on the logic device region. A top surface of the first interconnecting structure is flush with a top surface of the second dielectric layer and higher than top surfaces of the memory stack structures.