Patents by Inventor Hui Ling Chen
Hui Ling Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240335493Abstract: The present invention is a mung bean hull extract with antiviral effect, and the mung bean hull extract achieves antiviral effect by inhibiting ?-glucosidase and neuraminidase. The present invention also relates to a method for extracting the mung bean hull extract with antiviral effect and applications of the extract obtained by the method.Type: ApplicationFiled: June 18, 2024Publication date: October 10, 2024Inventors: Hui-Wen CHEN, Feng-Ling YU, Ying-Nien HUNG, Chia-Chen PI
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Publication number: 20240293407Abstract: Disclosed herein are methods for treating cancers in a subject. The method includes determining the plasma level of arginine in the subject, followed by administering to the subject an arginine deprivation therapy alone or in combination with an anti-cancer agent based on the determined plasma level of arginine. According to some embodiments of the present disclosure, the anti-cancer agent is selected from the group consisting of FOLFOX, docetaxel, cisplatin, pemetrexed, pembrolizumab, and a combination thereof.Type: ApplicationFiled: March 3, 2023Publication date: September 5, 2024Inventors: Hung-Wen CHEN, Shaw Tsen CHEN, Hui-Fen LIU, Chih-Ling KUO, Chiung-Fang SHIU
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Patent number: 12027629Abstract: An oxide semiconductor field effect transistor (OSFET) includes a first insulating layer, a source, a drain, a U-shaped channel layer and a metal gate. The first insulating layer is disposed on a substrate. The source and the drain are disposed in the first insulating layer. The U-shaped channel layer is sandwiched by the source and the drain. The metal gate is disposed on the U-shaped channel layer, wherein the U-shaped channel layer includes at least an oxide semiconductor layer. The present invention also provides a method for forming said oxide semiconductor field effect transistor.Type: GrantFiled: January 31, 2023Date of Patent: July 2, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chien-Ming Lai, Yen-Chen Chen, Jen-Po Huang, Sheng-Yao Huang, Hui-Ling Chen, Qinggang Xing, Ding-Lung Chen, Li Li Ding, Yao-Hung Liu
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Patent number: 11869854Abstract: A semiconductor structure in which the upper and lower semiconductor wafers are bonded by a hybrid bonding method is provided. The two semiconductor wafers each have discontinuous multiple metal traces or spiral coil-shaped metal traces. By hybrid bonding the two semiconductor wafers, multiple discontinuous metal traces are bonded together to form an inductance element with a continuous and non-intersecting path, or the two spiral coil-shaped metal traces are bonded together to form an inductance element. In this semiconductor structure, the inductance element formed by hybrid bonding has the advantage that the inductance value is easily adjusted.Type: GrantFiled: January 27, 2021Date of Patent: January 9, 2024Assignee: UNITED MICROELECTRONICS CORPORATIONInventors: Chien-Ming Lai, Hui-Ling Chen, Zhi-Rui Sheng
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Patent number: 11676682Abstract: Disclosed herein are methods of determining the sequence and/or positions of modified bases in a nucleic acid sample present in a circular molecule with a nucleic acid insert of known sequence comprising obtaining sequence data of at least two insert-sample units. In some embodiments, the methods comprise obtaining sequence data using circular pair-locked molecules. In some embodiments, the methods comprise calculating scores of sequences of the nucleic acid inserts by comparing the sequences to the known sequence of the nucleic acid insert, and accepting or rejecting repeats of the sequence of the nucleic acid sample according to the scores of one or both of the sequences of the inserts immediately upstream or downstream of the repeats of the sequence of the nucleic acid sample.Type: GrantFiled: November 1, 2019Date of Patent: June 13, 2023Assignee: Industrial Technology Research InstituteInventors: Chao-Chi Pan, Jenn-Yeh Fann, Chung-Fan Chiou, Hung-Chi Chien, Hui-Ling Chen
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Publication number: 20230178657Abstract: An oxide semiconductor field effect transistor (OSFET) includes a first insulating layer, a source, a drain, a U-shaped channel layer and a metal gate. The first insulating layer is disposed on a substrate. The source and the drain are disposed in the first insulating layer. The U-shaped channel layer is sandwiched by the source and the drain. The metal gate is disposed on the U-shaped channel layer, wherein the U-shaped channel layer includes at least an oxide semiconductor layer. The present invention also provides a method for forming said oxide semiconductor field effect transistor.Type: ApplicationFiled: January 31, 2023Publication date: June 8, 2023Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chien-Ming Lai, Yen-Chen Chen, Jen-Po Huang, Sheng-Yao Huang, Hui-Ling Chen, Qinggang Xing, Ding-Lung Chen, Li Li Ding, Yao-Hung Liu
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Patent number: 11631771Abstract: An oxide semiconductor field effect transistor (OSFET) includes a first insulating layer, a source, a drain, a U-shaped channel layer and a metal gate. The first insulating layer is disposed on a substrate. The source and the drain are disposed in the first insulating layer. The U-shaped channel layer is sandwiched by the source and the drain. The metal gate is disposed on the U-shaped channel layer, wherein the U-shaped channel layer includes at least an oxide semiconductor layer. The present invention also provides a method for forming said oxide semiconductor field effect transistor.Type: GrantFiled: July 6, 2021Date of Patent: April 18, 2023Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chien-Ming Lai, Yen-Chen Chen, Jen-Po Huang, Sheng-Yao Huang, Hui-Ling Chen, Qinggang Xing, Ding-Lung Chen, Li Li Ding, Yao-Hung Liu
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Publication number: 20230101900Abstract: A structure of semiconductor device is provided, including a first circuit structure, formed on a first substrate. A first test pad is disposed on the first substrate. A second circuit structure is formed on a second substrate. A second test pad is disposed on the second substrate. A first bonding pad of the first circuit structure is bonded to a second bonding pad of the second circuit structure. One of the first test pad and the second test pad is an inner pad while another one of the first test pad and the second test pad is an outer pad, wherein the outer pad surrounds the inner pad.Type: ApplicationFiled: December 7, 2022Publication date: March 30, 2023Applicant: United Microelectronics Corp.Inventors: Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Ming-Tse Lin, Chien En Hsu
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Publication number: 20230052327Abstract: Described are methods and systems for calibrating simulation models to generate digital twins for physical entities. In some embodiments, a method includes receiving a plurality of datasets for a plurality of corresponding physical entities. A calibration request is enqueued to a calibration requests queue for each received dataset and includes information indicating a dataset and a corresponding physical entity. A plurality of calibration engines and a plurality of corresponding simulation clusters for generating a plurality of calibration results for a plurality of calibration requests dequeued from the calibration requests queue can be deployed.Type: ApplicationFiled: November 3, 2022Publication date: February 16, 2023Applicant: PricewaterhouseCoopers LLPInventors: Sai Phanindra VENKATAPURAPU, Mrinal Kanti MANDAL, Jerome Patrick OFFNER, Rakesh Vidya Chandra KAPILA, Gaurav DWIVEDI, Qian CHEN, Julia Hui-ling CHEN, Samuel Pierce BURNS, Paul M. D'ALESSANDRO
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Patent number: 11557558Abstract: A structure of semiconductor device is provided, including a first circuit structure, formed on a first substrate. A first test pad is disposed on the first substrate. A second circuit structure is formed on a second substrate. A second test pad is disposed on the second substrate. A first bonding pad of the first circuit structure is bonded to a second bonding pad of the second circuit structure. One of the first test pad and the second test pad is an inner pad while another one of the first test pad and the second test pad is an outer pad, wherein the outer pad surrounds the inner pad.Type: GrantFiled: August 4, 2020Date of Patent: January 17, 2023Assignee: UNITED MICROELECTRONICS CORP.Inventors: Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Ming-Tse Lin, Chien En Hsu
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Patent number: 11520957Abstract: Described are methods and systems for calibrating simulation models to generate digital twins for physical entities. In some embodiments, a method includes receiving a plurality of datasets for a plurality of corresponding physical entities. A calibration request is enqueued to a calibration requests queue for each received dataset and includes information indicating a dataset and a corresponding physical entity. A plurality of calibration engines and a plurality of corresponding simulation clusters for generating a plurality of calibration results for a plurality of calibration requests dequeued from the calibration requests queue can be deployed.Type: GrantFiled: May 14, 2020Date of Patent: December 6, 2022Assignee: PricewaterhouseCoopers LLPInventors: Sai Phanindra Venkatapurapu, Mrinal Kanti Mandal, Jerome Patrick Offner, Rakesh Vidya Chandra Kapila, Gaurav Dwivedi, Qian Chen, Julia Hui-ling Chen, Samuel Pierce Burns, Paul M. D'Alessandro
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Publication number: 20220384376Abstract: A package structure of a semiconductor device includes a first substrate, a second substrate, and a bonding layer. The bonding layer bonds the first substrate and the second substrate. The bonding layer includes an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer. The outer bonding pad pattern surrounds the inner bonding pad pattern. The outer bonding pad pattern includes first bonding pads, the inner bonding pad pattern includes second bonding pads, a density of the first bonding pads is greater than that of the second bonding pads. The first bonding pads of the outer bonding pad pattern is distributed to form a plurality of pad rings surrounding the inner bonding pad pattern, and the first bonding pads of the plurality of pad rings are aligned in a horizontal direction or a vertical direction.Type: ApplicationFiled: August 4, 2022Publication date: December 1, 2022Applicant: United Microelectronics Corp.Inventors: Ming-Tse Lin, Chung-Hsing Kuo, Hui-Ling Chen
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Patent number: 11450633Abstract: A package structure of a semiconductor device includes a first substrate, a second substrate, and a bonding layer. The bonding layer bonds the first substrate and the second substrate. The bonding layer includes an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer. The outer bonding pad pattern surrounds the inner bonding pad pattern. A first bonding pad density of the outer bonding pad pattern is greater than a second bonding pad density of the inner bonding pad pattern.Type: GrantFiled: February 4, 2020Date of Patent: September 20, 2022Assignee: UNITED MICROELECTRONICS CORP.Inventors: Ming-Tse Lin, Chung-Hsing Kuo, Hui-Ling Chen
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Publication number: 20220262752Abstract: A semiconductor structure includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. The first layer includes an upper passive component pattern, and the second layer includes a lower passive component pattern, wherein the upper passive component pattern is opposite to the lower passive component pattern. The first interconnection layer includes at least one first interconnect structure electrically connected on the upper passive component pattern. The second interconnection layer includes at least one second interconnect structure electrically connected on the passive component pattern. The first interconnect structure on the upper passive component pattern is hybrid bonded with the second interconnect structure on the lower passive component pattern. Therefore, the upper passive component pattern and the lower passive component pattern are joined by hybrid bonding to form a passive device.Type: ApplicationFiled: May 9, 2022Publication date: August 18, 2022Inventors: Chien-Ming Lai, Zhi-Rui Sheng, Hui-Ling Chen
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Publication number: 20220189888Abstract: A semiconductor structure in which the upper and lower semiconductor wafers are bonded by a hybrid bonding method is provided. The two semiconductor wafers each have discontinuous multiple metal traces or spiral coil-shaped metal traces. By hybrid bonding the two semiconductor wafers, multiple discontinuous metal traces are bonded together to form an inductance element with a continuous and non-intersecting path, or the two spiral coil-shaped metal traces are bonded together to form an inductance element. In this semiconductor structure, the inductance element formed by hybrid bonding has the advantage that the inductance value is easily adjusted.Type: ApplicationFiled: January 27, 2021Publication date: June 16, 2022Inventors: Chien-Ming Lai, Hui-Ling Chen, Zhi-Rui Sheng
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Patent number: 11355431Abstract: A semiconductor structure includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. The first layer includes an upper electrode pattern, and the second layer includes a lower electrode pattern, wherein the upper electrode pattern is opposite to the lower electrode pattern. The first interconnection layer includes a plurality of first interconnect structures electrically connected on the upper electrode pattern. The second interconnection layer includes a plurality of second interconnect structures electrically connected on the lower electrode pattern. The first interconnect structures on the upper electrode pattern are hybrid bonded with the second interconnect structures on the lower electrode pattern. Therefore, the upper electrode patterns and the lower electrode patterns are joined by hybrid bonding to form a capacitor element.Type: GrantFiled: October 7, 2020Date of Patent: June 7, 2022Assignee: UNITED MICROELECTRONICS CORPORATIONInventors: Chien-Ming Lai, Zhi-Rui Sheng, Hui-Ling Chen
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Patent number: 11354210Abstract: A system includes a host and a display. The host includes a programmable logic device (PIP), a baseboard management controller (BMC) and a switch. The PLD performs a power-on procedure based on a power-on sequence code, generates variable character information in the power-on procedure, and fills the variable character information into a variable field in a preset log text file to result in an updated log text file. When it is determined that the power-on procedure is not normally completed, the PLD controls the switch to switch to a debug mode, and transmits a video signal containing debug information corresponding to the updated log text file to the switch so that the video signal is outputted to the display.Type: GrantFiled: August 10, 2020Date of Patent: June 7, 2022Assignee: Mitac Computing Technology CorporationInventors: Yen-Hui Chang, Hui-Ling Chen
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Patent number: 11342465Abstract: An oxide semiconductor field effect transistor (OSFET) includes a first insulating layer, a source, a drain, a U-shaped channel layer and a metal gate. The first insulating layer is disposed on a substrate. The source and the drain are disposed in the first insulating layer. The U-shaped channel layer is sandwiched by the source and the drain. The metal gate is disposed on the U-shaped channel layer, wherein the U-shaped channel layer includes at least an oxide semiconductor layer. The present invention also provides a method for forming said oxide semiconductor field effect transistor.Type: GrantFiled: January 3, 2021Date of Patent: May 24, 2022Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chien-Ming Lai, Yen-Chen Chen, Jen-Po Huang, Sheng-Yao Huang, Hui-Ling Chen, Qinggang Xing, Ding-Lung Chen, Li Li Ding, Yao-Hung Liu
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Publication number: 20220108946Abstract: A semiconductor structure includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. The first layer includes an upper electrode pattern, and the second layer includes a lower electrode pattern, wherein the upper electrode pattern is opposite to the lower electrode pattern. The first interconnection layer includes a plurality of first interconnect structures electrically connected on the upper electrode pattern. The second interconnection layer includes a plurality of second interconnect structures electrically connected on the lower electrode pattern. The first interconnect structures on the upper electrode pattern are hybrid bonded with the second interconnect structures on the lower electrode pattern. Therefore, the upper electrode patterns and the lower electrode patterns are joined by hybrid bonding to form a capacitor element.Type: ApplicationFiled: October 7, 2020Publication date: April 7, 2022Inventors: Chien-Ming Lai, Zhi-Rui Sheng, Hui-Ling Chen
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Publication number: 20220005775Abstract: A structure of semiconductor device is provided, including a first circuit structure, formed on a first substrate. A first test pad is disposed on the first substrate. A second circuit structure is formed on a second substrate. A second test pad is disposed on the second substrate. A first bonding pad of the first circuit structure is bonded to a second bonding pad of the second circuit structure. One of the first test pad and the second test pad is an inner pad while another one of the first test pad and the second test pad is an outer pad, wherein the outer pad surrounds the inner pad.Type: ApplicationFiled: August 4, 2020Publication date: January 6, 2022Applicant: United Microelectronics Corp.Inventors: Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Ming-Tse Lin, Chien En Hsu