Abstract: A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.

Abstract: A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.

Abstract: A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.

Abstract: A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.

Abstract: A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.

Abstract: The invention is directed to a semiconductor structure located on a substrate in a scribe line region of a wafer. The semiconductor structure comprises a first dielectric layer, a first test pad and a passivation layer. The first dielectric layer is disposed on the substrate and the first test pad is disposed on the first dielectric layer. The passivation layer is disposed on the first dielectric layer and surrounding the first test pad and a groove is located between the first test pad and the passivation layer and the groove is at lest located between the boundary of the scribe line region and the first test pad.

Abstract: The present invention relates to a series of dicarboxylic acid ester derivatives of ginsenosides such as succinate and glutarate derivatives of 20-O-?-D-glucopyranosyl-protopanaxadiol (compound K, abbreviated as CK), preparation thereof and pharmaceutical uses thereof. The dicarboxylic acid ester derivatives of ginsenosides of the present invention can be used to form pharmaceutical acceptable salts thereof having a high water solubility or can be directly dissolved in an aqueous solution of metal salt, and retain the pharmaceutical activities of ginsenosides such as tumor growth inhibition and cancer preventive cytotoxicity. The dicarboxylic acid ester derivatives of ginsenosides of the present invention are thus suitable for use in the manufactures of various pharmaceutically and cosmetically acceptable dosage forms of preparations, such as peripheral, oral, and topical dosage forms.

Abstract: A paper reel includes a lining, and an enclosure mounted on a periphery of the lining. Thus, the plastic enclosure encompasses a whole length of the paper lining to reinforce the strength of the paper reel, so that when an element, such as a tape, cloth, weaving strap, metallic foil, car insulating paper or the like, is closely wound around the paper reel, the paper reel will not be deformed or distorted due to compression, thereby enhancing the quality and stability of the paper reel.

Abstract: The present invention is a structure of container, which includes a protective cover and a body with a concave part. The said body has a first room formed between its outer edge and side-wall structure; the said protective cover is a hollow ring form with a second room provided at its cross section. The said protective cover and the said body are fitted in with each other and can be pressed for closing. When liquid is loaded into the first or the second room, the liquid will prevent the invasion of bugs or ants. Besides, even if the body is turned around 360 degrees, no leakage will happen because the liquid just flow between the first room and the second room.

Abstract: A wrench including a stem having a head section at one end of the stem and a polygonal socket formed in the head section for fitting onto a screwed member. A resilient ring is disposed at the head section and pivotally connected with a controlling switch pivotally disposed at the head section. By means of operating the controlling switch, the resilient ring is driven to expand or close. In the closed position, the resilient ring obstructs at least one inner angle of the socket to prevent the screwed member from detaching out of the socket and clamp the screwed member in the socket. In the expanded position, the resilient ring frees the inner angle, permitting the screwed member to freely pass through the socket.

Abstract: An exhaust pipe with flickering light includes an annular position plate and a protective sleeve fixed on a position pipe. The position plate is provided to stabilize a tubular outer cover and prevent an annular electric board from damaged when the outer cover is knocked. The protective sleeve is provided for preventing heat and from getting too high and protecting the electric board from damaged so as to increase its service life.

Abstract: A shoe insole is composed of a toe portion, a sole portion and a heel portion. The insole has a thickness of 2 mm or more. The toe portion and the sole portion have a hardness value ranging between 20 and 45 degrees in the Asker Type C, whereas the heel portion has a hardness value ranging between 30 and 50 degrees in the Asker Type C. The hardness values of the toe portion, the sole portion and the heel portion are decreased by at least 5 degrees for an increase in the thickness of the insole by 1 mm.

Abstract: Disclosed are new fluorogenic substrates for assay of angiotensin converting enzyme, a process for preparing them and methods for using them to assay angiotensin converting enzyme and to screen antihypertensive agents which inhibit angiotensin converting enzyme.