Abstract: An isothermal plate assembly with predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation space is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. The upper plate and the lower plate are assembled and then a hot melting process is executed. The resultant product is then cooled to form a finished isothermal plate assembly with predetermined shape.

Abstract: A heat-dissipating device with an isothermal plate assembly of predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation groove is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. A heat-dissipating unit composed of a plurality of heat-dissipating fins is assembled to a concave portion of the isothermal plate assembly of the predetermined shape. The upper plate and the lower plate are assembled with outer coupling unit and then a hot melting process is executed. The resultant product is then cooled to form a finished heat-dissipating device with an isothermal plate assembly of predetermined shape.

Abstract: A heat-dissipating device with an isothermal plate assembly of predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation groove is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. A heat-dissipating unit composed of a plurality of heat-dissipating fins is assembled to a concave portion of the isothermal plate assembly of the predetermined shape. The upper plate and the lower plate are assembled with outer coupling unit and then a hot melting process is executed. The resultant product is then cooled to form a finished heat-dissipating device with an isothermal plate assembly of predetermined shape.

Abstract: An isothermal plate assembly with predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation space is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. The upper plate and the lower plate are assembled and then a hot melting process is executed. The resultant product is then cooled to form a finished isothermal plate assembly with predetermined shape.

Abstract: A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The protection structure has a bottom surface to cover the thermal conducting medium, a side wall extending along and projecting from a periphery of the bottom surface to form a space for receiving the thermal conducting medium and a portion of the heat dissipation device, and a support structure protruding from the bottom surface to avoid a direct contact between the thermal conducting medium and the bottom surface.

Abstract: A heat dissipating device with uniform heat points, having a first heat sink, a second heat sink and at least two heat pipes. The second heat sink is aligned over the first heat sink. Each heat pipe has a heat absorbing portion and a heat dissipating portion. The heat absorbing and dissipating portions of each heat pipe are in thermal communication with the first and second heat sinks, respectively. The distance between two neighboring heat absorbing portions is smaller than the distance between the heat pipe and the heat sink. Thereby, the heat absorbing portions are concentrated to absorb heat generated by a heat source, and the heat dissipating portions are distributed over a larger area to effectively dissipate the heat.

Abstract: A method for integrating a heat conductor with a heat dissipating fin is provided. The steps includes: a) employing a low-temperature treatment to an area of the heat conductor so as to generate a shape contraction thereof, wherein the area is a connecting area between the heat conductor and the heat dissipating fin; b) employing a heating treatment to the heat dissipating fin to generate a shape expansion thereof and opening an aperture on the heat dissipating fin corresponding to a position of the heat conductor; and c) integrating the heat conductor with the heat dissipating fin by passing the heat conductor through the aperture on the heat dissipating fin and combining the heat conductor and the heat dissipating fin under a room temperature. Accordingly, the contact density between heat conductor and heat dissipating fin is increased, while the thermal resistance is reduced.

Abstract: A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The protection structure has a bottom surface to cover the thermal conducting medium, a side wall extending along and projecting from a periphery of the bottom surface to form a space for receiving the thermal conducting medium and a portion of the heat dissipation device, and a support structure protruding from the bottom surface to avoid a direct contact between the thermal conducting medium and the bottom surface.

Abstract: A dual-layer heat dissipating structure includes a first heat sink, a second heat sink, and a heat pipe with a connecting portion and a curved portion, interconnecting the first and second heat sinks for thermal conduction. The first and second heat sinks each has a substrate and exterior fins protruding from two opposing ends thereof. Two substrates each includes at least one slot through out of two corresponding end plates of the same side for locating the connecting portion, and the corresponding end plates each includes an opening with respect to the slot for partially moving in the curved portion. The exterior fins of the first and second heat sinks are aligned with each other, and a snap-type connecting structures are formed on terminuses of the exterior fins. The second and first heat sinks are connected to each other by the snap-type structure, and the connection joint is reinforced by implanting soldering material.

Abstract: A heat dissipating device with uniform heat points, having a first heat sink, a second heat sink and at least two heat pipes. The second heat sink is aligned over the first heat sink. Each heat pipe has a heat absorbing portion and a heat dissipating portion. The heat absorbing and dissipating portions of each heat pipe are in thermal communication with the first and second heat sinks, respectively. The distance between two neighboring heat absorbing portions is smaller than the distance between the heat pipe and the heat sink. Thereby, the heat absorbing portions are concentrated to absorb heat generated by a heat source, and the heat dissipating portions are distributed over a larger area to effectively dissipate the heat.

Abstract: A dual-layer heat dissipating structure includes a first heat sink, a second heat sink, and a heat pipe with a connecting portion and a curved portion, interconnecting the first and second heat sinks for thermal conduction. The first and second heat sinks each has a substrate and exterior fins protruding from two opposing ends thereof. Two substrates each includes at least one slot through out of two corresponding end plates of the same side for locating the connecting portion, and the corresponding end plates each includes an opening with respect to the slot for partially moving in the curved portion. The exterior fins of the first and second heat sinks are aligned with each other, and a snap-type connecting structures are formed on terminuses of the exterior fins. The second and first heat sinks are connected to each other by the snap-type structure, and the connection joint is reinforced by implanting soldering material.