Method for integrating heat conductor with heat dissipating fin

Abstract

A method for integrating a heat conductor with a heat dissipating fin is provided. The steps includes: a) employing a low-temperature treatment to an area of the heat conductor so as to generate a shape contraction thereof, wherein the area is a connecting area between the heat conductor and the heat dissipating fin; b) employing a heating treatment to the heat dissipating fin to generate a shape expansion thereof and opening an aperture on the heat dissipating fin corresponding to a position of the heat conductor; and c) integrating the heat conductor with the heat dissipating fin by passing the heat conductor through the aperture on the heat dissipating fin and combining the heat conductor and the heat dissipating fin under a room temperature. Accordingly, the contact density between heat conductor and heat dissipating fin is increased, while the thermal resistance is reduced.

Description

BACKGROUND OF THE INVENTION

The present invention is related to a method for integrating a heat conductor with a heat dissipating fin, and more particularly, to an integrating method employing a temperature change to the metal material to cause a physical change thereof for easily combining a heat conductor with a heat dissipating fin tightly. It has been a general trend to use a heat conductor as a heat dissipating element in the fields relevant to computers. By owning the properties including high heat-conducting ability, short heat-conducting time, high heat-conducting speed, light weight, simple structure, and multi-purpose, the heat conductors are very suitable for the heat dissipating needs of electronic products since they can conduct large amount of heat without consuming any electrical power, especially the heat conductors like heat tubes and copper pillars.

In the past, when connecting or combining the heat tube of heat conductor with the heat dissipating fin, the apertures corresponding to the position of the heat tube must be opened or mounted on each heat dissipating fin before the heat tube respectively passes through each aperture of the heat dissipating fins. In addition, in order to enhance the contact density between the heat tube and each heat dissipating fin so as to reduce the thermal resistance of heat conduction, the heat-conducting medium like solder paste is coated on the surface of the heat tube before the heat tube is connected or combined with each heat dissipating fin.

However, since the foresaid heat-conducting medium is usually viscose-like, the heat tube can not pass the aperture on each heat dissipating fin very smoothly when the heat-conducting medium is spread on the heat tube. Besides, the extra viscose-like heat-conducting medium would spill from each aperture, which not only affects the outside appearance, but also increases the thermal resistance when the impurities are attached thereon. On the other hand, if the coated heat-conducting medium is not enough, the heat tube would not be able to be contacted with the aperture on each heat dissipating fin tightly. Therefore, it is very hard to accurately control the amount of the coated heat-conducting medium or to evenly spread the heat-conducting medium on the heat tube during the integrating process of the heat tube and the heat dissipating fin, and that seriously affects the product quality and results in plenty of manufacturing troubles.

In addition, there is another disadvantage, in which the aperture of the heat dissipating fin is designed to have a slightly smaller diameter than the outer diameter of the heat tube so that the heat dissipating fin can be directly pushed and put around the heat tube. Accordingly, the contact density and the heat conducting ability of the combined heat tube and the heat dissipating fin are both enhanced. However, since the thickness of the tube wall is very thin (thinner than 0.5 mm), it is very common to cause a distortion by improperly extruding the heat tube or to impair the heat tube by accidentally scratching the surface of the heat tube.

Hence, how to improve the process for integrating the heat tube and the heat dissipating fin has become a major problem waited to be solved in the industry. In order to overcome the drawbacks in the prior art, a method for integrating a heat conductor with a heat dissipating fin, which effectively improves the integrating process, is provided.

SUMMARY OF THE INVENTION

The present invention is to provide a method for integrating a heat conductor with a heat dissipating fin. Based on the principle that a temperature change would cause the physical change of metal material, the heat conductor and the heat dissipating fin can be combined tightly. Therefore, the drawbacks in the conventional art that the viscose-like heat-conducting medium is not spread evenly, the shape of the heat conductor is altered due to improper extruding, and the surface of the heat tube is impaired because of unavoidable scratching, are accordingly solved so that the product quality could be effectively controlled for further manufacturing and processing.

According to one aspect of the present invention, a method for integrating a heat conductor with a heat dissipating fin is provided. The steps includes:

• • a) employing a low-temperature treatment to an area of the heat conductor so as to generate a shape contraction thereof, wherein the area is a connecting area between the heat conductor and the heat dissipating fin;
  • b) employing a heating treatment to the heat dissipating fin to generate a shape expansion thereof and opening an aperture on the heat dissipating fin corresponding to a position of the heat conductor; and
  • c) integrating the heat conductor with the heat dissipating fin by passing the heat conductor through the aperture on the heat dissipating fin and combining the heat conductor and the heat dissipating fin under a room temperature.

In accordance with the present invention, the step a) and the step b) are proceeded simultaneously.

In accordance with the present invention, the step a) is proceeded after the step b).

In accordance with the present invention, the step a) and the step b) are proceeded before step c).

In accordance with the present invention, the heat conductor is a heat tube.

In accordance with the present invention, the heat conductor is a copper pillar.

In accordance with the present invention, the aperture on the heat dissipating fin has an inside diameter larger than or equal to an outer diameter of the heat conductor so that the heat conductor can easily pass through the aperture of the heat dissipating fin to be combined therewith.

According to another aspect of the present invention, a method for integrating a heat conductor with a heat dissipating fin is provided. The steps includes:

• • a) employing a low-temperature treatment to an area of the heat conductor so as to generate a shape contraction thereof, wherein the area is a connecting area between the heat conductor and the heat dissipating fin, and the heat dissipating fin has an aperture mounted thereon and is maintained at a room temperature; and
  • b) integrating the heat conductor with the heat dissipating fin by passing the heat conductor through the aperture on the heat dissipating fin and combining the heat conductor and the heat dissipating fin under the room temperature.

According to another aspect of the present invention, a method for integrating a heat conductor with a heat dissipating fin is provided. The steps includes:

• • a) maintaining the heat conductor under a room temperature and employing a heating treatment to the heat dissipating fin to generate a shape expansion thereof, and opening an aperture on the heat dissipating fin corresponding to a position of the heat conductor; and
  • b) integrating the heat conductor with the heat dissipating fin by passing the heat conductor through the aperture on the heat dissipating fin and combining the heat conductor and the heat dissipating fin under the room temperature.

The foregoing and other features and advantages of the present invention will be more clearly understood through the following descriptions with reference to the drawings, wherein:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a flow chart illustrating the steps for integrating a heat conductor with a heat dissipating fin according to the first preferred embodiment of the present invention;

FIG. 1B is a flow chart illustrating the steps for integrating a heat conductor with a heat dissipating fin according to the second preferred embodiment of the present invention;

FIG. 1C is a flow chart illustrating the steps for integrating a heat conductor with a heat dissipating fin according to the third preferred embodiment of the present invention;

FIG. 2 is a diagram showing the heat conductor and the heat dissipating fin before combined according to a preferred embodiment of the present invention;

FIG. 3 is a diagram showing the heat tube and the heat dissipating fin after combined according to a preferred embodiment of the present invention; and

FIG. 4 is a sectional diagram showing the heat dissipating device combined by the heat tube and a plurality of heat dissipating fin according to a preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only; it is not intended to be exhaustive or to be limited to the precise form disclosed.

Please refer to FIGS. 1A and 2-4. FIG. 1A is a flow chart illustrating the steps for integrating a heat conductor with a heat dissipating fin according to the first preferred embodiment of the present invention. FIG. 2 is a diagram showing the heat conductor and the heat dissipating fin before combined. FIG. 3 is a diagram showing the heat tube and the heat dissipating fin after combined. FIG. 4 is a sectional diagram showing the heat dissipating device combined by the heat tube and a plurality of heat dissipating fin. A method for integrating a heat conductor with a heat dissipating fin is provided in the present invention. Based on the principle that a temperature change would cause the physical change of metal material, the heat conductor would have a shape contraction when treated by a low temperature. The heat dissipating fin is heated to make the diameter of the aperture on the heat dissipating fin larger. Then, the heat conductor is penetrated through the heat dissipating fin via the aperture and combined with the heat dissipating fin under a room temperature. According to the first preferred embodiment of the present invention, the steps are as follows.

a) A low-temperature treatment is employed to an area of the heat conductor 1, where is the connecting region of the heat conductor is combined with the heat dissipating fin 2. The heat conductor 1 would generate a shape contraction around the connecting region, as shown in FIG. 2. In this step, the material for the heat conductor 1 is preferably the metal material of heat tube or copper pillar. The heat conductor 1 is put into a freezing device or a low-temperature liquid such as liquid nitrogen so that the shape or the size thereof would shrink slightly. By controlling the factors such as the cooling time or the cooling temperature of the cooling liquid, the contraction degree of the heat conductor 1 can be accurately monitored and controlled. Thus an even shape contraction can be obtained.

b) A heating treatment is employed to the heat dissipating fin 2 so as to generate a shape expansion thereof, as shown in FIG. 2. An aperture 20 is opened on the heat dissipating fin 2 corresponding to a position of the heat conductor 1. In this step, the aperture 20 on the heat dissipating fin 2 has an inside diameter larger than or equal to the outer diameter of the heat conductor 1 so that the heat conductor 1 can easily pass through the aperture 20 of the heat dissipating fin 2. As such, neither the shape alteration of the heat conductor 1 nor the scratching damage on the surface of the heat conductor 1 would occur. According to another preferred embodiment of the present invention, this step can be proceeded with the step a) simultaneously, or proceeded before the step a).

c) The heat conductor 1 is penetrated through the aperture 20 on the heat dissipating fin 2 and then combined with the heat dissipating fin 2 under a room temperature. In this step, the temperature of the heat conductor 1 is increased owing to the ambient environment so that the shape and the size thereof are expanded. Meanwhile, since the aperture 20 of the heat dissipating fin 2 is cooled down, the diameter of the aperture 20 is shrunk. Consequently, the heat conductor 1 and the heat dissipating fin 2 can be tightly integrated under a room temperature through the manners that the size of the heat conductor 1 is increased and the diameter of the heat dissipating fin 2 is decreased. Preferably, this step is proceeded after the step a) and the step b).

Please refer to FIG. 1B. FIG. 1B is a flow chart illustrating the steps for integrating a heat conductor with a heat dissipating fin according to the second preferred embodiment of the present invention. According to the second preferred embodiment of the present invention, the steps are as follows.

a) A low-temperature treatment is employed to an area of the heat conductor 1, where is the connecting region the heat conductor is combined with the heat dissipating fin 2. The heat conductor 1 would generate a shape contraction around the connecting region. The heat dissipating fin 2 has an aperture 20 and is maintained at a room temperature. In this step, the heat conductor 1 is employed with the low-temperature treatment longer than that in the first embodiment, or under a lower temperature than that in the first embodiment so that more shape contraction is obtained.

b) The heat conductor 1 is penetrated through the aperture 20 on the heat dissipating fin 2 and then combined with the heat dissipating fin 2 under a room temperature.

Please refer to FIG. 1C. FIG. 1C is a flow chart illustrating the steps for integrating a heat conductor with a heat dissipating fin according to the third preferred embodiment of the present invention. According to the third preferred embodiment of the present invention, the steps are as follows.

a) A heating treatment is employed to the heat dissipating fin 2 to generate a shape expansion. The aperture 20 is opened on the heat dissipating fin 2 corresponding to the position of the heat conductor 1. In this step, the heat dissipating fin 2 is employed under the heating treatment with a high temperature than that in the first embodiment so that more shape expansion of the aperture 20 is obtained. Meanwhile, the heat conductor 1 is maintained under a room temperature.

b) The heat conductor 1 is penetrated through the aperture 20 on the heat dissipating fin 2 and then combined with the heat dissipating fin 2 under a room temperature.

Accordingly, the method for integrating a heat conductor with a heat dissipating fin could be accomplished by the foresaid steps in the respective embodiment.

According to the above, the drawbacks in the conventional integrating method for heat conductor and heat dissipating fin are not existed in the integrating method provided in the present invention. By employing the method for integrating heat conductor with heat dissipating fin of the present invention, the drawbacks in the conventional art that the viscose-like heat-conducting medium is not spread evenly, the shape of the heat conductor is altered due to improper extruding, and the surface of the heat tube is impaired because of unavoidable scratching, are accordingly solved. The products made by the present integrating method not only have a pleasant outside appearance, but also are preferable for further manufacturing and processing. The contact density between heat conductor and heat dissipating fin is increased, while the thermal resistance is reduced. Accordingly, the property that the heat conductor conducts large amount of heat is effectively achieved. Hence, the present invention not only has a novelty and a progressive nature, but also has an industry utility.

While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims

1. A method for integrating a heat conductor with a heat dissipating fin, comprising steps of:

employing a low-temperature treatment to an area of said heat conductor so as to generate a shape contraction thereof, wherein said area is a connecting area between said heat conductor and said heat dissipating fin;

employing a heating treatment to said heat dissipating fin to generate a shape expansion thereof and opening an aperture on said heat dissipating fin corresponding to a position of said heat conductor; and

integrating said heat conductor with said heat dissipating fin by passing said heat conductor through said aperture on said heat dissipating fin and combining said heat conductor and said heat dissipating fin under a room temperature.

2. The method according to claim 1, wherein said low-temperature treatment step and said heat treatment step are proceeded simultaneously.

3. The method according to claim 1, wherein said low-temperature treatment step is proceeded after said heat treatment step.

4. The method according to claim 1, wherein said low-temperature treatment step and said heat treatment step are proceeded before step c).

5. The method according to claim 1, wherein said heat conductor is a heat tube.

6. The method according to claim 1, wherein said heat conductor is a copper pillar.

7. The method according to claim 1, wherein said aperture on said heat dissipating fin has an inside diameter which is larger than or equal to an outer diameter of said heat conductor so that said heat conductor can easily passes through said aperture of said heat dissipating fin to be combined therewith.

8. A method for integrating a heat conductor with a heat dissipating fin, comprising steps of:

a) employing a low-temperature treatment to an area of said heat conductor so as to generate a shape contraction thereof, wherein said area is a connecting area between said heat conductor and said heat dissipating fin, and said heat dissipating fin has an aperture mounted thereon and is maintained at a room temperature; and

b) integrating said heat conductor with said heat dissipating fin by passing said heat conductor through said aperture on said heat dissipating fin and combining said heat conductor and said heat dissipating fin under said room temperature.

9. The method according to claim 8, wherein said heat conductor is a heat tube.

10. The method according to claim 8, wherein said heat conductor is a copper pillar.

11. A method for integrating a heat conductor with a heat dissipating fin, comprising steps of:

a) maintaining said heat conductor under a room temperature and employing a heating treatment to said heat dissipating fin to generate a shape expansion thereof, and opening an aperture on said heat dissipating fin corresponding to a position of said heat conductor; and

b) integrating said heat conductor with said heat dissipating fin by passing said heat conductor through said aperture on said heat dissipating fin and combining said heat conductor and said heat dissipating fin under said room temperature.

12. The method according to claim 11, wherein said heat conductor is a heat tube.

13. The method according to claim 11, wherein said heat conductor is a copper pillar.