Patents by Inventor Hui Pan
Hui Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250240908Abstract: An airflow impedance blank may be configured to populate a slot of an information handling system and may include a housing, which may include a plurality of venting holes, and a removable airflow impedance element configured to mechanically couple to the housing and further configured to be readily exchanged for another removable airflow impedance element to adjust a venting ratio of the airflow impedance blank.Type: ApplicationFiled: January 19, 2024Publication date: July 24, 2025Applicant: Dell Products L.P.Inventors: Yi-Chang CHEN, Ching-Yuan WANG, Liang-Chun MA, Ming-Hui PAN, MingHsueh TSAI, Chen ZHAO
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Publication number: 20250176143Abstract: A heatsink includes a main body, a hinge, an arm portion, and a latch. The arm portion is in physical communication with the main body and with the hinge. The arm portion includes a movable portion that transitions between a closed position and an open position. The latch is in physical communication with the movable portion of the arm portion. The latch transitions between a locked position and an unlocked position. The latch securely holds the movable portion in the closed position.Type: ApplicationFiled: November 28, 2023Publication date: May 29, 2025Inventors: Sih-Hao Liou, Wen-Hung Lu, Ming-Hui Pan, Lawrence Ying-Hsi Lin
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Publication number: 20250020516Abstract: An infrared detector based on a CMOS process is provided.Type: ApplicationFiled: March 24, 2022Publication date: January 16, 2025Applicant: Beijing North Gaoye Technology Co., Ltd.Inventors: Guangjie ZHAI, Pei WU, Hui PAN, Guangqiang ZHAI
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Publication number: 20240395848Abstract: An infrared detector with a multi-layer structure based on a CMOS process. A CMOS measuring circuit system and a CMOS infrared sensing structure in the infrared detector are both fabricated by using the CMOS process, and a CMOS manufacturing process comprises a metal interconnection process, a through hole process, an IMD process and an RDL process. In the infrared detector with the multi-layer structure, a first columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, a second columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, at least one hole-shaped structure is formed in an absorption plate, and the hole-shaped structure at least penetrates a dielectric layer in the absorption plate; and/or, at least one hole-shaped structure is formed in a beam structure.Type: ApplicationFiled: August 6, 2024Publication date: November 28, 2024Applicant: Beijing North Gaoye Technology Co., Ltd.Inventors: Guangjie Zhai, Pei Wu, Hui Pan, Guangqiang Zhai
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Patent number: 12107111Abstract: An infrared detector with a multi-layer structure based on a CMOS process. A CMOS measuring circuit system and a CMOS infrared sensing structure in the infrared detector are both fabricated by using the CMOS process, and a CMOS manufacturing process comprises a metal interconnection process, a through hole process, an IMD process and an RDL process. In the infrared detector with the multi-layer structure, a first columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, a second columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, at least one hole-shaped structure is formed in an absorption plate, and the hole-shaped structure at least penetrates a dielectric layer in the absorption plate; and/or, at least one hole-shaped structure is formed in a beam structure.Type: GrantFiled: March 24, 2022Date of Patent: October 1, 2024Assignee: Beijing North Gaoye Technology Co., Ltd.Inventors: Guangjie Zhai, Pei Wu, Hui Pan, Guangqiang Zhai
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Publication number: 20240243160Abstract: An infrared detector with a multi-layer structure based on a CMOS process. A CMOS measuring circuit system and a CMOS infrared sensing structure in the infrared detector are both fabricated by using the CMOS process, and a CMOS manufacturing process comprises a metal interconnection process, a through hole process, an IMD process and an RDL process. In the infrared detector with the multi-layer structure, a first columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, a second columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, at least one hole-shaped structure is formed in an absorption plate, and the hole-shaped structure at least penetrates a dielectric layer in the absorption plate; and/or, at least one hole-shaped structure is formed in a beam structure.Type: ApplicationFiled: March 24, 2022Publication date: July 18, 2024Applicant: Beijing North Gaoye Technology Co., Ltd.Inventors: Guangjie Zhai, Pei Wu, Hui Pan, Guangqiang Zhai
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Publication number: 20240231742Abstract: A projection display method and an electronic device provide a source end device configured to project for display a first display interface of a first application onto a first window of a target device and to synchronously project for display on a second window of the target device a second display interface of a second application. When the source end device detects a call event, the source end device may provide a call interface for the call event and, upon the occurrence of predetermined conditions, terminate display of the call interface of the call event and optionally display a preset image to block display of all or part of the call interface.Type: ApplicationFiled: February 11, 2022Publication date: July 11, 2024Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Shujie He, Hui Pan
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Patent number: 11977423Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.Type: GrantFiled: December 20, 2021Date of Patent: May 7, 2024Assignee: Dell Products L.P.Inventors: Hung-Pin Chien, Jyh-Yinn Lin, Yu-Wei Chi Liao, Chien Yen Hsu, Ming-Hui Pan
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Publication number: 20240134591Abstract: A projection display method and an electronic device provide a source end device configured to project for display a first display interface of a first application onto a first window of a target device and to synchronously project for display on a second window of the target device a second display interface of a second application. When the source end device detects a call event, the source end device may provide a call interface for the call event and, upon the occurrence of predetermined conditions, terminate display of the call interface of the call event and optionally display a preset image to block display of all or part of the call interface.Type: ApplicationFiled: February 11, 2022Publication date: April 25, 2024Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Shujie He, Hui Pan
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Patent number: 11830975Abstract: An amorphous composite solid electrolyte is provided that includes one or more three-dimensional branched macromolecules with a core portion and at least three arm portions connected to the core portion. Each arm portion includes a random copolymer or a block polymer comprising a first monomer and a second monomer with a molar ratio of the first monomer to the second monomer in the range from greater than 0 to less than or equal to 1. An ion conductive electrolytic solution including at least one lithium salt solution in an amount of approximately 1 mol/l to 10 mol/l is entrained within the branched macromolecule, with a weight ratio of the branched macromolecule to the ion conducive electrolytic solution equal to or lower than 1:9, such that the branched macromolecule has a swelling degree of at least 5:1 (liquid:polymer in weight) of the ion conductive electrolytic solution.Type: GrantFiled: December 20, 2020Date of Patent: November 28, 2023Assignee: Nano and Advanced Materials Institute LimitedInventors: Hui Pan, Jianping Han, Yong Zhu, Heng Liu, Ou Dong, Shengbo Lu, Chenmin Liu
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Publication number: 20230326772Abstract: A method includes moving a drum containing a chemical liquid into a chamber of a chemical liquid supplying system. The drum is connected with a testing pipe. The chemical liquid is pumped from the drum to the testing pipe. A condition of the chemical liquid flowing through the testing pipe is monitored. Whether the chemical liquid is supplied to a processing tool is determined based on the condition of the chemical liquid.Type: ApplicationFiled: June 9, 2023Publication date: October 12, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Cheng CHANG, Keng-Hui PAN, Chieh-Jan HUANG, Ming-Lee LEE, Chiang-Jeh CHEN
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Patent number: 11784541Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.Type: GrantFiled: April 1, 2022Date of Patent: October 10, 2023Assignee: YEN SUN TECHNOLOGY CORP.Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Chuan Huang
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Patent number: 11739768Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.Type: GrantFiled: May 18, 2022Date of Patent: August 29, 2023Assignee: YEN SUN TECHNOLOGY CORP.Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan
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Patent number: 11715656Abstract: In accordance with some embodiments, a method for processing semiconductor wafer is provided. The method includes connecting a drum which stores the chemical liquid with a testing pipe. The method also includes guiding the chemical liquid in the drum into the testing pipe. In addition, the method includes detecting a condition of the chemical liquid in the testing pipe. The method further includes determining if the condition of the chemical liquid is acceptable. When the condition of the chemical liquid is acceptable, supplying the chemical liquid to a processing tool at which the semiconductor wafer is processed.Type: GrantFiled: April 1, 2020Date of Patent: August 1, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Cheng Chang, Keng-Hui Pan, Chieh-Jan Huang, Ming-Lee Lee, Chiang-Jeh Chen
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Patent number: 11700706Abstract: A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.Type: GrantFiled: October 8, 2020Date of Patent: July 11, 2023Assignee: Dell Products L.P.Inventors: Chuan Chieh Tseng, Ming-Hui Pan
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Publication number: 20230204047Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.Type: ApplicationFiled: May 18, 2022Publication date: June 29, 2023Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN
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Publication number: 20230195188Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.Type: ApplicationFiled: December 20, 2021Publication date: June 22, 2023Inventors: HUNG-PIN CHIEN, JYH-YINN LIN, YU-WEI CHI LIAO, CHIEN YEN HSU, MING-HUI PAN
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Publication number: 20230133593Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.Type: ApplicationFiled: April 1, 2022Publication date: May 4, 2023Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN, Yu-Chuan HUANG
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Patent number: D1027900Type: GrantFiled: August 3, 2022Date of Patent: May 21, 2024Assignee: U-LOVELIFE (SHENZHEN) TECHNOLOGY CO., LTDInventors: Jun Ma, Huixian Tian, Hui Pan, Liu Meng
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Patent number: D1086210Type: GrantFiled: October 23, 2023Date of Patent: July 29, 2025Inventor: Hui Pan