Patents by Inventor Hui Pan

Hui Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131952
    Abstract: This application provides a charging plug and socket-outlet, charging and to-be-charged apparatuses, a charging system, and a control method. The charging system includes: a charging apparatus and a to-be-charged apparatus. The charging apparatus includes a charging plug and a first cooling system. The charging plug includes a first electrical transmission interface, a first heat conduction output interface, and a first heat conduction input interface. The to-be-charged apparatus includes a battery, a charging socket-outlet, and a second cooling system. The charging socket-outlet includes a second electrical transmission interface, a second heat conduction output interface, and a second heat conduction input interface. The solutions of this application can be used to meet a heat dissipation requirement of the battery in the to-be-charged apparatus during super charging.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 25, 2024
    Inventors: Deyuan Wang, Hui Feng, Liwen Pan
  • Publication number: 20240134591
    Abstract: A projection display method and an electronic device provide a source end device configured to project for display a first display interface of a first application onto a first window of a target device and to synchronously project for display on a second window of the target device a second display interface of a second application. When the source end device detects a call event, the source end device may provide a call interface for the call event and, upon the occurrence of predetermined conditions, terminate display of the call interface of the call event and optionally display a preset image to block display of all or part of the call interface.
    Type: Application
    Filed: February 11, 2022
    Publication date: April 25, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shujie He, Hui Pan
  • Patent number: 11942403
    Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu
  • Publication number: 20240085431
    Abstract: The present disclosure provides a method of determining the efficacy of a weight loss diet for a canine, the method comprising analyzing a serum or plasma sample from the canine for a biomarker before and after administration of the weight loss diet, wherein the biomarker is selected from the group consisting of 3-methylhistidine, 1-methylhistidine, and a combination thereof, and determining the weight loss diet is efficacious if the amount of the biomarker has decreased.
    Type: Application
    Filed: August 7, 2023
    Publication date: March 14, 2024
    Inventors: Yuanlong Pan, Hui Xu, Sandeep Bhatnagar, Julie Kristine Spears
  • Patent number: 11926238
    Abstract: Disclosed is an apparatus for charging a battery comprising a first charging device configured to communicate with at least one second charging device, the first charging device and the at least one second charging device configured to charge the battery, and comprising a first controller configured to control the first charging device, wherein the first controller determines the number of the at least one second charging devices by communicating with a second controller.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: March 12, 2024
    Assignee: MINE MOBILITY RESEARCH CO., LTD.
    Inventors: Somphote Ahunai, Wen Wu Pan, Cao Kai Zheng, Gang Liu, Jian Hua Li, Xiao Meng Deng, Zhao Hui Peng
  • Publication number: 20240079399
    Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20240071857
    Abstract: A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
  • Patent number: 11830975
    Abstract: An amorphous composite solid electrolyte is provided that includes one or more three-dimensional branched macromolecules with a core portion and at least three arm portions connected to the core portion. Each arm portion includes a random copolymer or a block polymer comprising a first monomer and a second monomer with a molar ratio of the first monomer to the second monomer in the range from greater than 0 to less than or equal to 1. An ion conductive electrolytic solution including at least one lithium salt solution in an amount of approximately 1 mol/l to 10 mol/l is entrained within the branched macromolecule, with a weight ratio of the branched macromolecule to the ion conducive electrolytic solution equal to or lower than 1:9, such that the branched macromolecule has a swelling degree of at least 5:1 (liquid:polymer in weight) of the ion conductive electrolytic solution.
    Type: Grant
    Filed: December 20, 2020
    Date of Patent: November 28, 2023
    Assignee: Nano and Advanced Materials Institute Limited
    Inventors: Hui Pan, Jianping Han, Yong Zhu, Heng Liu, Ou Dong, Shengbo Lu, Chenmin Liu
  • Publication number: 20230326772
    Abstract: A method includes moving a drum containing a chemical liquid into a chamber of a chemical liquid supplying system. The drum is connected with a testing pipe. The chemical liquid is pumped from the drum to the testing pipe. A condition of the chemical liquid flowing through the testing pipe is monitored. Whether the chemical liquid is supplied to a processing tool is determined based on the condition of the chemical liquid.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 12, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Cheng CHANG, Keng-Hui PAN, Chieh-Jan HUANG, Ming-Lee LEE, Chiang-Jeh CHEN
  • Patent number: 11784541
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: October 10, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Chuan Huang
  • Patent number: 11739768
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: August 29, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan
  • Patent number: 11715656
    Abstract: In accordance with some embodiments, a method for processing semiconductor wafer is provided. The method includes connecting a drum which stores the chemical liquid with a testing pipe. The method also includes guiding the chemical liquid in the drum into the testing pipe. In addition, the method includes detecting a condition of the chemical liquid in the testing pipe. The method further includes determining if the condition of the chemical liquid is acceptable. When the condition of the chemical liquid is acceptable, supplying the chemical liquid to a processing tool at which the semiconductor wafer is processed.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: August 1, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Cheng Chang, Keng-Hui Pan, Chieh-Jan Huang, Ming-Lee Lee, Chiang-Jeh Chen
  • Patent number: 11700706
    Abstract: A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: July 11, 2023
    Assignee: Dell Products L.P.
    Inventors: Chuan Chieh Tseng, Ming-Hui Pan
  • Publication number: 20230204047
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Application
    Filed: May 18, 2022
    Publication date: June 29, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN
  • Publication number: 20230195188
    Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 22, 2023
    Inventors: HUNG-PIN CHIEN, JYH-YINN LIN, YU-WEI CHI LIAO, CHIEN YEN HSU, MING-HUI PAN
  • Publication number: 20230133593
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Application
    Filed: April 1, 2022
    Publication date: May 4, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN, Yu-Chuan HUANG
  • Patent number: 11585357
    Abstract: A fan casing for mounting of a fan includes a frame including four corner segments and four side segments that are arranged alternately with the corner segments, a seat disposed in the frame, and four support members extending radially and outwardly from the seat and connected respectively to the corner segments. Each support member includes a base connected to the seat and having a width reducing in a direction away from the seat, and a rib connected between the base and the corresponding corner segment. The bases are interconnected to surround the seat. Any two adjacent bases are interconnected to form an arc surface facing the corresponding side segment and adapted to absorb shock.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: February 21, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Ting Liu
  • Publication number: 20220400925
    Abstract: A docking station for a mobile cleaning robot can include a base portion configured to receive the mobile cleaning robot. The docking station can include a housing connected to the base portion and a pad cleaning system. The pad cleaning system can be connected to the housing and can include a cleaning head engageable with a cleaning pad of the mobile cleaning robot to remove debris from the cleaning pad, the cleaning head can include a nozzle configured to discharge a fluid onto the cleaning pad.
    Type: Application
    Filed: May 19, 2022
    Publication date: December 22, 2022
    Inventors: Rick Hoobler, Jason Jeffrey Suchman, Peter J. Lydon, Guo Hui Pan, Gary Cui
  • Patent number: 11513571
    Abstract: An information handling system may include a chassis having a first region and a second region, wherein the first region includes a memory module, and wherein the second region includes a processing unit; at least one air mover configured to provide airflow; and an airflow shroud including an airflow baffle. When the airflow shroud is installed in the information handling system in a first orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the first region. When the airflow shroud is installed in the information handling system in a second orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the second region.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: November 29, 2022
    Assignee: Dell Products L.P.
    Inventors: Ming-Hui Pan, Cho Shih Huai
  • Publication number: 20220374445
    Abstract: A federated data exploration system includes a first and a second interoperable data exploration apparatuses. The first interoperable data exploration apparatus executes a data process engine and has a first data object. The data process engine enables a display screen to display a visualization user interface, which includes a first and second display areas respectively for the first and second data object. The second data object belongs to the second interoperable data exploration apparatus. The data process engine explores the second data object by issuing a sequence of queries in response to a sequence of operations on the second display area to narrow down a target of interest. The data process engine receives a first set of identifiers corresponding to the target of interest from the second data object and produces a target dataset by querying the first data object according to the first set of identifiers.
    Type: Application
    Filed: May 20, 2021
    Publication date: November 24, 2022
    Inventors: Wenwey Hseush, Hsin Hua Cheng, Ya Chu Chen, Hsien Hui Pan