Patents by Inventor Hui Pan

Hui Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250240908
    Abstract: An airflow impedance blank may be configured to populate a slot of an information handling system and may include a housing, which may include a plurality of venting holes, and a removable airflow impedance element configured to mechanically couple to the housing and further configured to be readily exchanged for another removable airflow impedance element to adjust a venting ratio of the airflow impedance blank.
    Type: Application
    Filed: January 19, 2024
    Publication date: July 24, 2025
    Applicant: Dell Products L.P.
    Inventors: Yi-Chang CHEN, Ching-Yuan WANG, Liang-Chun MA, Ming-Hui PAN, MingHsueh TSAI, Chen ZHAO
  • Publication number: 20250176143
    Abstract: A heatsink includes a main body, a hinge, an arm portion, and a latch. The arm portion is in physical communication with the main body and with the hinge. The arm portion includes a movable portion that transitions between a closed position and an open position. The latch is in physical communication with the movable portion of the arm portion. The latch transitions between a locked position and an unlocked position. The latch securely holds the movable portion in the closed position.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 29, 2025
    Inventors: Sih-Hao Liou, Wen-Hung Lu, Ming-Hui Pan, Lawrence Ying-Hsi Lin
  • Publication number: 20250020516
    Abstract: An infrared detector based on a CMOS process is provided.
    Type: Application
    Filed: March 24, 2022
    Publication date: January 16, 2025
    Applicant: Beijing North Gaoye Technology Co., Ltd.
    Inventors: Guangjie ZHAI, Pei WU, Hui PAN, Guangqiang ZHAI
  • Publication number: 20240395848
    Abstract: An infrared detector with a multi-layer structure based on a CMOS process. A CMOS measuring circuit system and a CMOS infrared sensing structure in the infrared detector are both fabricated by using the CMOS process, and a CMOS manufacturing process comprises a metal interconnection process, a through hole process, an IMD process and an RDL process. In the infrared detector with the multi-layer structure, a first columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, a second columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, at least one hole-shaped structure is formed in an absorption plate, and the hole-shaped structure at least penetrates a dielectric layer in the absorption plate; and/or, at least one hole-shaped structure is formed in a beam structure.
    Type: Application
    Filed: August 6, 2024
    Publication date: November 28, 2024
    Applicant: Beijing North Gaoye Technology Co., Ltd.
    Inventors: Guangjie Zhai, Pei Wu, Hui Pan, Guangqiang Zhai
  • Patent number: 12107111
    Abstract: An infrared detector with a multi-layer structure based on a CMOS process. A CMOS measuring circuit system and a CMOS infrared sensing structure in the infrared detector are both fabricated by using the CMOS process, and a CMOS manufacturing process comprises a metal interconnection process, a through hole process, an IMD process and an RDL process. In the infrared detector with the multi-layer structure, a first columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, a second columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, at least one hole-shaped structure is formed in an absorption plate, and the hole-shaped structure at least penetrates a dielectric layer in the absorption plate; and/or, at least one hole-shaped structure is formed in a beam structure.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: October 1, 2024
    Assignee: Beijing North Gaoye Technology Co., Ltd.
    Inventors: Guangjie Zhai, Pei Wu, Hui Pan, Guangqiang Zhai
  • Publication number: 20240243160
    Abstract: An infrared detector with a multi-layer structure based on a CMOS process. A CMOS measuring circuit system and a CMOS infrared sensing structure in the infrared detector are both fabricated by using the CMOS process, and a CMOS manufacturing process comprises a metal interconnection process, a through hole process, an IMD process and an RDL process. In the infrared detector with the multi-layer structure, a first columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, a second columnar structure comprises at least one layer of solid columnar structure and/or at least one layer of hollow columnar structure, at least one hole-shaped structure is formed in an absorption plate, and the hole-shaped structure at least penetrates a dielectric layer in the absorption plate; and/or, at least one hole-shaped structure is formed in a beam structure.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 18, 2024
    Applicant: Beijing North Gaoye Technology Co., Ltd.
    Inventors: Guangjie Zhai, Pei Wu, Hui Pan, Guangqiang Zhai
  • Publication number: 20240231742
    Abstract: A projection display method and an electronic device provide a source end device configured to project for display a first display interface of a first application onto a first window of a target device and to synchronously project for display on a second window of the target device a second display interface of a second application. When the source end device detects a call event, the source end device may provide a call interface for the call event and, upon the occurrence of predetermined conditions, terminate display of the call interface of the call event and optionally display a preset image to block display of all or part of the call interface.
    Type: Application
    Filed: February 11, 2022
    Publication date: July 11, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shujie He, Hui Pan
  • Patent number: 11977423
    Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: May 7, 2024
    Assignee: Dell Products L.P.
    Inventors: Hung-Pin Chien, Jyh-Yinn Lin, Yu-Wei Chi Liao, Chien Yen Hsu, Ming-Hui Pan
  • Publication number: 20240134591
    Abstract: A projection display method and an electronic device provide a source end device configured to project for display a first display interface of a first application onto a first window of a target device and to synchronously project for display on a second window of the target device a second display interface of a second application. When the source end device detects a call event, the source end device may provide a call interface for the call event and, upon the occurrence of predetermined conditions, terminate display of the call interface of the call event and optionally display a preset image to block display of all or part of the call interface.
    Type: Application
    Filed: February 11, 2022
    Publication date: April 25, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shujie He, Hui Pan
  • Patent number: 11830975
    Abstract: An amorphous composite solid electrolyte is provided that includes one or more three-dimensional branched macromolecules with a core portion and at least three arm portions connected to the core portion. Each arm portion includes a random copolymer or a block polymer comprising a first monomer and a second monomer with a molar ratio of the first monomer to the second monomer in the range from greater than 0 to less than or equal to 1. An ion conductive electrolytic solution including at least one lithium salt solution in an amount of approximately 1 mol/l to 10 mol/l is entrained within the branched macromolecule, with a weight ratio of the branched macromolecule to the ion conducive electrolytic solution equal to or lower than 1:9, such that the branched macromolecule has a swelling degree of at least 5:1 (liquid:polymer in weight) of the ion conductive electrolytic solution.
    Type: Grant
    Filed: December 20, 2020
    Date of Patent: November 28, 2023
    Assignee: Nano and Advanced Materials Institute Limited
    Inventors: Hui Pan, Jianping Han, Yong Zhu, Heng Liu, Ou Dong, Shengbo Lu, Chenmin Liu
  • Publication number: 20230326772
    Abstract: A method includes moving a drum containing a chemical liquid into a chamber of a chemical liquid supplying system. The drum is connected with a testing pipe. The chemical liquid is pumped from the drum to the testing pipe. A condition of the chemical liquid flowing through the testing pipe is monitored. Whether the chemical liquid is supplied to a processing tool is determined based on the condition of the chemical liquid.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 12, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Cheng CHANG, Keng-Hui PAN, Chieh-Jan HUANG, Ming-Lee LEE, Chiang-Jeh CHEN
  • Patent number: 11784541
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: October 10, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Chuan Huang
  • Patent number: 11739768
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: August 29, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan
  • Patent number: 11715656
    Abstract: In accordance with some embodiments, a method for processing semiconductor wafer is provided. The method includes connecting a drum which stores the chemical liquid with a testing pipe. The method also includes guiding the chemical liquid in the drum into the testing pipe. In addition, the method includes detecting a condition of the chemical liquid in the testing pipe. The method further includes determining if the condition of the chemical liquid is acceptable. When the condition of the chemical liquid is acceptable, supplying the chemical liquid to a processing tool at which the semiconductor wafer is processed.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: August 1, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Cheng Chang, Keng-Hui Pan, Chieh-Jan Huang, Ming-Lee Lee, Chiang-Jeh Chen
  • Patent number: 11700706
    Abstract: A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: July 11, 2023
    Assignee: Dell Products L.P.
    Inventors: Chuan Chieh Tseng, Ming-Hui Pan
  • Publication number: 20230204047
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Application
    Filed: May 18, 2022
    Publication date: June 29, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN
  • Publication number: 20230195188
    Abstract: Methods and systems for thermal management of hardware resources that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the thermal management of the hardware resources without impairment of storage devices. To improve the likelihood of the computer implemented services being provided, the systems may proactively identify whether storage devices subject to impairment due to dynamic motion are present. If such storage devices are present, then the system may automatically take action to reduce the likelihood of the storage devices being subject to dynamic motion sufficient to impair their operation.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 22, 2023
    Inventors: HUNG-PIN CHIEN, JYH-YINN LIN, YU-WEI CHI LIAO, CHIEN YEN HSU, MING-HUI PAN
  • Publication number: 20230133593
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Application
    Filed: April 1, 2022
    Publication date: May 4, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN, Yu-Chuan HUANG
  • Patent number: D1027900
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: May 21, 2024
    Assignee: U-LOVELIFE (SHENZHEN) TECHNOLOGY CO., LTD
    Inventors: Jun Ma, Huixian Tian, Hui Pan, Liu Meng
  • Patent number: D1086210
    Type: Grant
    Filed: October 23, 2023
    Date of Patent: July 29, 2025
    Inventor: Hui Pan