Bone conduction headphones
Description
The broken lines in the drawings depict portions of the bone conduction headphones that form no part of the claimed design.
Claims
The ornamental design for a bone conduction headphones, as shown and described.
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Patent History
Patent number: D1027900
Type: Grant
Filed: Aug 3, 2022
Date of Patent: May 21, 2024
Assignee: U-LOVELIFE (SHENZHEN) TECHNOLOGY CO., LTD (Shenzhen)
Inventors: Jun Ma (Shenzhen), Huixian Tian (Shenzhen), Hui Pan (Shenzhen), Liu Meng (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/848,620
Type: Grant
Filed: Aug 3, 2022
Date of Patent: May 21, 2024
Assignee: U-LOVELIFE (SHENZHEN) TECHNOLOGY CO., LTD (Shenzhen)
Inventors: Jun Ma (Shenzhen), Huixian Tian (Shenzhen), Hui Pan (Shenzhen), Liu Meng (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/848,620
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)