Bone conduction headphones

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Description

FIG. 1 is a perspective view of bone conduction headphones showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is a perspective view of the bone conduction headphones where the bone conduction headphones is in a configuration of use.

The broken lines in the drawings depict portions of the bone conduction headphones that form no part of the claimed design.

Claims

The ornamental design for a bone conduction headphones, as shown and described.

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Patent History
Patent number: D1027900
Type: Grant
Filed: Aug 3, 2022
Date of Patent: May 21, 2024
Assignee: U-LOVELIFE (SHENZHEN) TECHNOLOGY CO., LTD (Shenzhen)
Inventors: Jun Ma (Shenzhen), Huixian Tian (Shenzhen), Hui Pan (Shenzhen), Liu Meng (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/848,620
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)