Patents by Inventor Hun Teak Lee
Hun Teak Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110285000Abstract: A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.Type: ApplicationFiled: July 29, 2011Publication date: November 24, 2011Inventors: Hun Teak Lee, Jong Kook Kim, ChulSik Kim, Ki Youn Jang
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Publication number: 20110266700Abstract: A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.Type: ApplicationFiled: July 7, 2011Publication date: November 3, 2011Inventors: Hun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
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Patent number: 7986047Abstract: A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.Type: GrantFiled: May 19, 2010Date of Patent: July 26, 2011Assignee: Chippac, Inc.Inventors: Hun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
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Publication number: 20110169149Abstract: A semiconductor package system, and method of manufacturing thereof, includes: a die having a contact pad; a lead finger having a substantially trapezoidal cross-section; a bump clamped on a top and a side of the lead finger, the bump connected to the contact pad; and an encapsulant over the lead finger and the die, the encapsulant with a bottom of the lead finger exposed.Type: ApplicationFiled: March 21, 2011Publication date: July 14, 2011Inventors: Hun Teak Lee, Jong Kook Kim, ChulSik Kim, Ki Youn Jang
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Patent number: 7909233Abstract: A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of predetermined lengths, the plurality of lead fingers having a fine pitch and each having a trapezoidal cross-section; attaching a plurality of bumps to the plurality of lead fingers, the plurality of bumps on the tops, extending beyond the widths of the trapezoidal cross-sections, and clamping down on the two sides of each of the plurality of lead fingers; attaching a plurality of bond wires to the plurality of contact pads; attaching the plurality of bond wires to the plurality of bumps; and forming an encapsulant over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.Type: GrantFiled: April 26, 2010Date of Patent: March 22, 2011Assignee: Stats Chippac Ltd.Inventors: Hun Teak Lee, Jong Kook Kim, ChulSik Kim, Ki Youn Jang
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Patent number: 7863737Abstract: An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.Type: GrantFiled: April 1, 2006Date of Patent: January 4, 2011Assignee: Stats Chippac Ltd.Inventors: Byoung Wook Jang, Hun Teak Lee, Kwang Soon Hwang
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Publication number: 20100225008Abstract: A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.Type: ApplicationFiled: May 19, 2010Publication date: September 9, 2010Inventors: Hun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
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Publication number: 20100203683Abstract: A method for manufacturing a semiconductor package system includes: providing a die having a plurality of contact pads; forming a leadframe having a plurality of lead fingers with flat tops of predetermined lengths, the plurality of lead fingers having a fine pitch and each having a trapezoidal cross-section; attaching a plurality of bumps to the plurality of lead fingers, the plurality of bumps on the tops, extending beyond the widths of the trapezoidal cross-sections, and clamping down on the two sides of each of the plurality of lead fingers; attaching a plurality of bond wires to the plurality of contact pads; attaching the plurality of bond wires to the plurality of bumps; and forming an encapsulant over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.Type: ApplicationFiled: April 26, 2010Publication date: August 12, 2010Inventors: Hun Teak Lee, Jong Kook Kim, ChulSik Kim, Ki Youn Jang
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Patent number: 7759783Abstract: An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.Type: GrantFiled: December 7, 2006Date of Patent: July 20, 2010Assignee: Stats Chippac Ltd.Inventors: Hun Teak Lee, Tae Keun Lee, Soo Jung Park
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Patent number: 7745322Abstract: A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.Type: GrantFiled: February 15, 2008Date of Patent: June 29, 2010Assignee: Chippac, Inc.Inventors: Hun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
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Patent number: 7731078Abstract: A semiconductor package system includes providing a die having a plurality of contact pads. A leadframe is formed having a plurality of lead fingers with the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section. A plurality of bumps is formed on the plurality of lead fingers, the plurality of bumps are on the tops and extend down the sides of the plurality of lead fingers. A plurality of bond wires is attached to the plurality of contact pads and to the plurality of bumps. An encapsulant is formed over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.Type: GrantFiled: September 16, 2005Date of Patent: June 8, 2010Assignee: Stats Chippac Ltd.Inventors: Hun Teak Lee, Jong Kook Kim, ChulSik Kim, Ki Youn Jang
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Patent number: 7652382Abstract: A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern.Type: GrantFiled: October 9, 2007Date of Patent: January 26, 2010Assignee: Stats Chippac Ltd.Inventors: Jong Kook Kim, Hun Teak Lee, Jason Lee
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Patent number: 7453156Abstract: A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.Type: GrantFiled: November 14, 2005Date of Patent: November 18, 2008Assignee: Chippac, Inc.Inventors: Hun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
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Publication number: 20080272487Abstract: A wire bond system including providing an integrated circuit die with a bond pad thereon, forming a soft bump on the bond pad, and wire bonding a hard-metal wire on the soft bump.Type: ApplicationFiled: May 5, 2008Publication date: November 6, 2008Inventors: Il Kwon Shim, Hun Teak Lee, Sheila Marie L. Alvarez, Gyung Sik Yun, Heap Hoe Kuan
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Patent number: 7407080Abstract: A capillary tip for a wire bonding tool has a chamfer provided with at least one annular groove. The annular groove is generally oriented in a plane perpendicular to the axis of the capillary. In a sectional view through the capillary axis, the groove profile may be generally part-oval or part circular, such as semicircular or half-oval; or generally rectangular; or generally triangular. In some embodiments the width of the groove profile at the face of the chamfer is at least about one-tenth, more usually at least about one-fifth, the length of the chamfer face; and less than about one-half, more usually less than about one-third, the length of the chamfer face. In some embodiments two or more such grooves are provided. The grooved chamfer can improve the transmission of ultrasonic energy to the wire ball during formation of the bond.Type: GrantFiled: October 22, 2004Date of Patent: August 5, 2008Assignee: Chippac, Inc.Inventors: Kenny Lee, Hun-Teak Lee, Jong Kook Kim, Chulsik Kim, Ki-Youn Jang
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Publication number: 20080135997Abstract: A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal. Also, such a package in which the package substrate includes a two-tier substrate, each tier including a plurality of lead fingers having a lead finger bond pitch about twice the die pad pitch, the lead fingers of the first tier and the second tier having a staggered arrangement.Type: ApplicationFiled: February 15, 2008Publication date: June 12, 2008Inventors: Hun-Teak Lee, Jong-Kook Kim, Chul-Sik Kim, Ki-Youn Jang, Rajendra D. Pendse
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Publication number: 20080136005Abstract: A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.Type: ApplicationFiled: December 9, 2006Publication date: June 12, 2008Applicant: STATS CHIPPAC LTD.Inventors: Hun Teak Lee, Tae Keun Lee, Soo Jung Park
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Publication number: 20080137312Abstract: An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.Type: ApplicationFiled: December 7, 2006Publication date: June 12, 2008Applicant: STATS CHIPPAC LTD.Inventors: Hun Teak Lee, Tae Keun Lee, Soo Jung Park
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Patent number: 7298052Abstract: A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern.Type: GrantFiled: January 31, 2006Date of Patent: November 20, 2007Assignee: Stats Chippac Ltd.Inventors: Jong Kook Kim, Hun Teak Lee, Jason Lee
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Publication number: 20070235869Abstract: An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.Type: ApplicationFiled: April 1, 2006Publication date: October 11, 2007Applicant: STATS CHIPPAC LTD.Inventors: Byoung Wook Jang, Hun Teak Lee, Kwang Soon Hwang