Abstract: The disclosure is related to an identity recognition device. The identity recognition device includes a thermal conductive casing, an identity recognition module, a heat dissipation assembly, and a heat dissipation coating. The heat dissipation assembly includes a plurality of heat pipes, a heat absorbing block and a first heat sink. The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing. The heat absorbing block is in thermal contacts with the identity recognition module, and two opposite sides of the first heat sink respectively are in thermal contacts with the heat pipes and the heat absorbing block. The heat dissipation coating is coated on the thermal conductive casing and the heat pipes, wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes.

Abstract: A liquid cooling heat dissipation module adapted to be disposed on a heat source of a motherboard is provided. The liquid cooling heat dissipation module includes a heat conducting member, a first tank, a pump and a first agitating member. The heat conducting member is adapted to be thermally coupled to the heat source. The first tank is filled with cooling liquid, and the cooling liquid thermally couples with the heat conducting member. The pump is connected through with the first tank to drive the cooling liquid to flow along a direction. The first agitating member is disposed on a flowing path of the cooling liquid so as to homogenize a temperature of the cooling liquid.

Abstract: A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

Abstract: A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

Abstract: A liquid-cooling module includes a liquid-providing component, a liquid-receiving component and at least one heat dissipating assembly. The liquid-providing component has a liquid inlet and a plurality of liquid-providing openings, while the liquid inlet is used for being connected to a cooler. The liquid-receiving component has a plurality of liquid-receiving openings and a liquid outlet, and the liquid outlet is used for being connected to the cooler. The at least one heat dissipating assembly includes a flow tube. One end of the flow tube is detachably connected to one of the plurality of liquid-providing openings, and the other end of the flow tube is connected on one of the plurality of liquid-receiving openings.

Abstract: A liquid-cooling module includes a liquid-providing component, a liquid-receiving component and at least one heat dissipating assembly. The liquid-providing component has a liquid inlet and a plurality of liquid-providing openings, while the liquid inlet is used for being connected to a cooler. The liquid-receiving component has a plurality of liquid-receiving openings and a liquid outlet, and the liquid outlet is used for being connected to the cooler. The at least one heat dissipating assembly includes a flow tube. One end of the flow tube is detachably connected to one of the plurality of liquid-providing openings, and the other end of the flow tube is connected on one of the plurality of liquid-receiving openings.

Abstract: Systems and methods for monitoring and controlling business level SLAs (Service level Agreements), and more particularly, systems and method for monitoring and controlling business level SLAs using probe points, KPIs (Key Performance Indicators) and business commitments. An XML (extensible Markup Language)-based specification referred to as BPCL (Business Process Commitment Language) is used to describe business commitments. BPCL specifications are used by a business process management (BPM) system to configure, monitor, and control business processes based on business commitments. Business Commitments and BPCL provide a path toward model-based management for dynamic e-business solutions.

Abstract: A structure having a cavity or enclosed space is fabricated by forming a recessed region in a surface of a substrate, and providing a first layer adjacent the recessed region. A liquid mixture including first and second components is supplied to the recessed region. The first component has a higher chemical affinity to the first layer than the second component such that the first component separates from the second component and adheres to an edge portion of the first layer. The substrate may then be heated to remove the second component from the recessed region through evaporation. As a result, the first component remains as a second layer adhering to the edge portion of the first layer and covering the recessed region, thereby defining a cavity or enclosed space with the recessed region. Unique structures including such cavities may be employed to realize a capacitor having a fluid, as opposed to solid, dielectric material, in order to increase the capacitance of the capacitor.

Abstract: Aspects of the present invention include method and apparatuses that may utilize a digital video recording device with a screen control panel, for example, a touch screen control panel, to record digital video data with adjusted light compensation based on a selected object within a scene. For example, a user, using a touch screen control panel, may choose an object within a scene. Based on this selection, the digital video recording device may adjust the backlight compensation settings and camera angle to obtain a better image of the selected object. A user may select an object by touching the image of the object, tracing the selected object, or touching a number of reference points of the object. Then, depending on the user selection, the digital video recording device may take a snapshot, zoom in and take a snapshot, record the scene, or it may lock on the object and readjust and track the object as the object moves, while recording the scene.

Abstract: Aspects of the present invention include method and apparatuses that may be utilized to more efficiently use available storage space for a digital video recording system in a law enforcement vehicle and final “backend storage systems.” In one embodiment of the present invention, video and audio data is recorded in one or more buffers when a triggering event is activated, while a digital video recording device accounts for specified pre-event time, a time period before a first triggering event has been activated, and a post-event time, a time period after a second triggering event has been activated. The system will tag the actual start and stop points of events in one or more buffers based on a first and a second triggering event and will then include the pre-event and post-event data along with specified data. The system will then extract the event from one or more buffer files and write the event into final video files to be stored in a hard disk drive.

Abstract: A semiconductor device and method of manufacturing include an STI trench having a low-k dielectric material as a liner oxide layer and a bulk oxide trench fill layer.

Abstract: A method for re-forming BGA of a semiconductor package includes the steps of, providing a semiconductor package element formed with balls grid array, at least one of diameter of the ball is larger than the others ; providing a jig formed with penetrated holes corresponding to the each of balls of the semiconductor package element ; providing the jig mounted to the semiconductor package element, each of balls is located within the corresponding to the penetrated holes, the at least one of bigger ball is exposed from the surface of the penetrated holes of the jig; grinding the exposed part of the balls to exact size; and re-working the processes of manufacturing BGA.

Abstract: A heat dissipating device for taking away heat from a plurality of heat sources is disclosed. It includes a plurality of heat sinks installed on heat sources and a heat conductor connected to the heat sinks. When a temperature difference is generated among the heat sources in work, the heat conductor can pass the heat from a hot heat sink to cooler ones. This enables heat transfers among the heat sinks to increase the heat dissipating efficiency.

Abstract: A computer system includes a processor for processing data, a storage unit for storing data, and a liquid cooling thermal module for dissipating heat generated by the processor. The thermal module has a liquid coolant carrying pipe adjacent to the processor for conducting heat, and a cooling device. The cooling device has a plurality of tanks, which are connected with each other.

Abstract: An organic electroluminescent device comprises M scan lines, N data lines, a plurality of organic light-emitting units and a plurality of light driving units. The light driving unit drives the organic light-emitting unit. The light driving unit comprises a first transistor, a second transistor and a capacitance unit. The first transistor comprises a first gate, a first electrode and a second electrode. The first gate connects with the (M?j+1)th scan line. The first electrode connects with the ith data line. The second transistor comprises a second gate, a third electrode and a fourth electrode. The second gate connects with the second electrode. The third electrode connects with the (M?j)th scan line, The fourth electrode connects with the organic light-emitting unit which is driven by the light driving unit. The capacitance unit has a first terminal and a second terminal. The first terminal connects with the (M?j)th scan line. The second terminal connects with the second electrode and the second gate.

Abstract: An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.

Abstract: The present invention provides a heat-sinking apparatus for a light pipe. The light pipe is disposed on an optical engine of a projector and optically couples with a light source. The heat-sinking apparatus includes a cover made of a heat conductive material and a fan. The cover covers the light pipe and uniformly distributes thermal energy generated by the light source over the light pipe. The fan dissipates the thermal energy distributed over the light pipe.

Abstract: A computer system includes a processor for processing data, a storage unit for storing data, and a liquid-cooling thermal module for dissipating heat generated by the processor. The thermal module has a heat pipe adjacent to the processor for conducting heat, and a cooling device. The cooling device has a plurality of tanks, which are connected with each other.

Abstract: A heat dissipating device for taking away heat from a plurality of heat sources is disclosed. It includes a plurality of heat sinks installed on heat sources and a heat conductor connected to the heat sinks. When a temperature difference is generated among the heat sources in work, the heat conductor can pass the heat from a hot heat sink to cooler ones. This enables heat transfers among the heat sinks to increase the heat dissipating efficiency.

Abstract: An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.